Patents by Inventor Chen-Hu Yu

Chen-Hu Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Approach for Bonding Dies onto Interposers
    Publication number: 20120104578
    Abstract: A method includes providing an interposer wafer including a substrate, and a plurality of through-substrate vias (TSVs) extending from a front surface of the substrate into the substrate. A plurality of dies is bonded onto a front surface of the interposer wafer. After the step of bonding the plurality of dies, a grinding is performed on a backside of the substrate to expose the plurality of TSVs. A plurality of metal bumps is formed on a backside of the interposer wafer and electrically coupled to the plurality of TSVs.
    Type: Application
    Filed: January 3, 2012
    Publication date: May 3, 2012
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hsien-Pin Hu, Chen-Hu Yu, Shin-Puu Jeng, Shang-Yun Hou, Jing-Cheng Lin, Wen-Chih Chiou, Hung-Jung Tu