Abstract: An electronic device is provided. The electronic device includes a plurality of units. The plurality of units includes a first unit. The first unit includes a first electronic component and a test circuit. The test circuit is electrically connected to the first electronic component. The test circuit includes a coil circuit.

Abstract: A light-emitting device includes: a semiconductor stack, including a first semiconductor layer, an active region and a second semiconductor layer; a first contact electrode and a second contact electrode formed on the semiconductor stack, wherein the first contact electrode includes a first contact part formed on the first semiconductor layer and the second contact electrode includes a second contact part formed on the second semiconductor layer; an insulating stack formed on the semiconductor stack, including an opening on the second contact part; a first electrode pad and a second electrode pad formed on the insulating stack, wherein the second electrode pad filled in the opening and connecting the second contact part; wherein the second electrode pad includes an upper surface, and the upper surface includes a platform area and a depression area on the second contact part; wherein the platform area has a maximum height relative to other areas of the upper surface; wherein an area of a projection of the plat

Abstract: An electronic device includes a glass substrate, a first metal layer, a second metal layer, and a third metal layer. The glass substrate includes a first surface, a second surface corresponding to the first surface, and at least two first through holes. The first through hole includes a third surface, and the third surface is connected to the first surface and the second surface. A first conductive layer is disposed on the first surface. A second conductive layer is disposed on the second surface. A third conductive layer is disposed on the third surface and is electrically connected to the first conductive layer and the second conductive layer. The first through hole has a major axis and a minor axis in a top view direction. A method of manufacturing the electronic device is also included.

Abstract: A manufacturing method of an electronic device is provided. The manufacturing method of the electronic device includes: providing a substrate; providing an adjustable element, including a liquid crystal layer; and bonding the adjustable element onto the substrate.

Abstract: An electronic device and a manufacturing method thereof are provided. The manufacturing method of the electronic device includes: providing a substrate; providing an adjustable element, including a liquid crystal layer; and bonding the adjustable element onto the substrate.

Abstract: An electronic device and a repair method thereof are provided. The repair method of the electronic device includes: providing a panel, wherein the panel includes a substrate, a first conductive layer disposed on the substrate, a transistor disposed on the substrate, and a dielectric layer disposed between the first conductive layer and the transistor, wherein the transistor comprises a first electrode and a second electrode; and cutting at least one of the first electrode and the second electrode with a laser beam, wherein a cutting point formed by the laser beam does not overlap with the first conductive layer.

Abstract: An electronic device including a tuning element is provided. The tuning element includes a first capacitor element including a first switch and a first capacitor electrically coupled to the first switch and a second capacitor element including a second capacitor. The first capacitor element is electrically connected in parallel with the second capacitor element.

Abstract: An electronic device includes a substrate, a plurality of conductive patterns, and a tunable element. A plurality of conductive patterns are disposed on the substrate. The tunable element is disposed on at least one conductive pattern in the plurality of conductive patterns and includes a first pad, a second pad, and a third pad. The first pad, the second pad, and the third pad are separated from each other. The first pad and the second pad are overlapped with the at least one conductive pattern in the plurality of conductive patterns. The third pad is disposed between the first pad and the second pad.

Abstract: An electronic device includes a carrier, a plurality of electronic elements and a connecting terminal. The carrier has at least one bonding pad. The electronic elements are disposed on the carrier, and each of the electronic elements includes a substrate. A distance between two adjacent substrates of the electronic elements is not less than 300 ?m. The connecting terminal is disposed between one of the substrate and the carrier. One of the electronic elements are electrically connected to the at least one bonding pad via the connecting terminal.

Abstract: An electronic device includes a carrier having at least one bonding pad, a plurality of electronic elements disposed on the carrier and one of the electronic elements including a substrate and at least one connecting terminal disposed between the substrate and the carrier. The electronic elements are electrically connected to the at least one bonding pad via the at least one connecting terminal.

Abstract: The disclosure provides an electronic device, including a substrate, a first conductor layer, a first insulating layer, an electronic component, and a driving structure. The first conductor layer is arranged on the substrate. The first insulating layer is disposed on the first conductor layer. The electronic component is arranged on the first insulating layer and coupled to the first conductor layer. The driving structure is coupled to the electronic component. The electronic device in the disclosure can have improved structural reliability.

Abstract: Disclosed is an electronic device, including a substrate, a first electrode, a second electrode, a modulation element, a first solder, and a switch element. The first electrode is disposed on the substrate. The second electrode is disposed on the substrate. The modulation element is disposed on the substrate and includes at least two connecting pads. The first solder is disposed between the first electrode and one connecting pad of the modulation element. The switch element is disposed on the substrate. The one connecting pad of the modulation element is electrically connected to the switch element sequentially through the first solder, the first electrode, and the second electrode.

Abstract: An electronic device and a manufacturing method thereof are provided. The manufacturing method of the electronic device includes: providing a substrate; providing an adjustable element, including a liquid crystal layer; and bonding the adjustable element onto the substrate.

Abstract: An electronic device includes a substrate, a plurality of conductive patterns, and a tunable element. A plurality of conductive patterns are disposed on the substrate. The tunable element is disposed on at least one conductive pattern in the plurality of conductive patterns and includes a first pad, a second pad, and a third pad. The first pad, the second pad, and the third pad are separated from each other. The first pad and the second pad are overlapped with the at least one conductive pattern in the plurality of conductive patterns. The third pad is disposed between the first pad and the second pad.

Abstract: The disclosure provides an electronic device. The electronic device includes a substrate, a transistor, and a variable capacitor. The transistor is disposed on the substrate. The variable capacitor is disposed on the substrate and adjacent to the transistor. A material of the transistor and a material of the variable capacitor both a include a III-V semiconductor material. The electronic device of an embodiment of the disclosure may simplify manufacturing process, reduce costs, or reduce dimensions.

Abstract: An electronic device includes a carrier having at least one bonding pad, a plurality of electronic elements disposed on the carrier and one of the electronic elements including a substrate and at least one connecting terminal disposed between the substrate and the carrier. The electronic elements are electrically connected to the at least one bonding pad via the at least one connecting terminal.

Abstract: An electronic device includes a carrier having at least one bonding pad, a plurality of electronic elements disposed on the carrier and one of the electronic elements including a substrate and at least one connecting terminal disposed between the substrate and the carrier. The electronic elements are electrically connected to the at least one bonding pad via the at least one connecting terminal.

Abstract: A liquid crystal device, including two substrates disposed opposite to each other, a liquid crystal layer disposed between the two substrates, and multiple heating units disposed on at least one of the two substrates, is provided. Each heating unit includes a heater and a switch element coupled to the heater. The liquid crystal device according to the embodiments of the disclosure may operate in different ambient temperatures.