Patents by Inventor Chen-Tsai Hsieh

Chen-Tsai Hsieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8191239
    Abstract: A conductive winding structure, the fabricating method thereof, and the magnetic device having the same. The method for fabricating the conductive winding structure includes: (a) providing a mold with a plurality of extension portions and a plurality of protrusions, the plurality of extension portions are connected to each other as a continuous spiral structure, and the plurality of protrusions extend from the plurality of extension portions; (b) performing an electroforming procedure to form a conductive layer on partial surface of the mold; and (c) stripping the conductive layer from the mold, so as to obtain the conductive winding structure.
    Type: Grant
    Filed: December 2, 2008
    Date of Patent: June 5, 2012
    Assignee: Delta Electronics, Inc.
    Inventors: Ming-Tsung Lee, Yung-Yu Chang, Chen-Yu Yu, Jui-Yuan Hsu, Chen-Tsai Hsieh
  • Publication number: 20100117780
    Abstract: A method for fabricating a conductive winding module of a magnetic element includes the following steps. Firstly, a non-insulated winding structure including multiple conductive units is provided, wherein the conductive units have respective conductive bodies, and one or more of the conductive units have pins. Then, an insulating varnish layer is formed on surfaces of the conductive bodies, thereby producing the conductive winding module.
    Type: Application
    Filed: September 21, 2009
    Publication date: May 13, 2010
    Applicant: DELTA ELECTRONICS, INC.
    Inventors: Chen-Tsai Hsieh, Yung-Yu Chang, Ming-Tsung Lee, Chen-Yu Yu, Nai-Tao Fan
  • Publication number: 20090293260
    Abstract: A conductive winding structure, the fabricating method thereof, and the magnetic device having the same are disclosed. The method for fabricating the conductive winding structure comprises steps of: (a) providing a mold; (b) performing an electroforming procedure to form a conductive layer on partial surface of the mold; and (c) stripping the conductive layer from the mold, so as to obtain the conductive winding structure.
    Type: Application
    Filed: December 2, 2008
    Publication date: December 3, 2009
    Applicant: DELTA ELECTRONICS, INC.
    Inventors: Ming-Tsung Lee, Yung-Yu Chang, Chen-Yu Yu, Jui-Yuan Hsu, Chen-Tsai Hsieh