Abstract: Embodiments of this disclosure relate to the multimedia processing field, and provide a video frame interpolation method, apparatus, and a device. In the video frame interpolation method in this disclosure, a first image at first time, a second image at second time, and sensor data captured by a dynamic vision sensor apparatus are obtained, and the sensor data includes dynamic event data between the first time and the second time. At least one target image is determined based on the first image, the second image, and the sensor data, where the at least one target image is an image corresponding to at least one target time between the first time and the second time. The dynamic event data is used to help compensate for motion information missing from existing image data. This implements accurate prediction of an intermediate image, and improves image prediction effect.

Abstract: Described herein are window retrofits including a monolithic silica aerogel slab having (i) an average haze value of <5% as calculated in accordance with ASTM standard D1003-13 and (ii) a U-factor of <0.5 BTU/sf/hr/° F., and a transparent polymer envelope sealed at an internal pressure of ?1 atmosphere, wherein the monolithic silica aerogel slab is encapsulated in the transparent polymer envelope. The monolithic aerogel slab can have a transmittance>94% at 8 mm thickness. The window retrofit can be bonded to a glass sheet.

Abstract: Provided herein are compounds according to Formula (I) or a pharmaceutically acceptable salt thereof, wherein R1, R2, R3, R5, and R7 are defined herein. Also provided herein are pharmaceutical compositions comprising a compound of Formula (I) as well as the use of such compounds as M4 receptor agonists.

Abstract: A system that includes a machine learning model that is configured to receive an input layout file that includes a portion of an integrated circuit layout that has a previously identified wafer hotspot, match the previously identified wafer hotspot to one of a plurality of categories of wafer hotspot types, and output a proposed layout modification associated with the matching category of wafer hotspot types.

Abstract: This application relates to the field of wireless communications technologies, and discloses an encoding method and apparatus, to improve accuracy of reliability calculation and ordering for polarized channels. The method includes: obtaining a first sequence used to encode K to-be-encoded bits, where the first sequence includes sequence numbers of N polarized channels, the first sequence is same as a second sequence or a subset of the second sequence, the second sequence comprises sequence numbers of Nmax polarized channels, and the second sequence is the sequence shown in Sequence Q11 or Table Q11, K is a positive integer, N is a positive integer power of 2, n is equal to or greater than 5, K?N, Nmax=1024; selecting sequence numbers of K polarized channels from the first sequence; and performing polar code encoding on K the to-be-encoded bits based on the selected sequence numbers of the K polarized channels.

Abstract: The present disclosure relates to air assemblies having an inflation, a deflation, and a closed state for use with inflatable products, such as air mattresses. Specifically, the present disclosure relates to air assemblies where the configuration of the air assembly can be changed manually by a user by operating a directional control valve to inflate, deflate, or close the inflatable product. The directional control valve may also activate a pump in the inflation and deflation states and deactivate the pump in the closed state.

Abstract: Embodiments relate to container resource autoscaling by a control plane. According to an aspect, a computer-implemented method includes receiving and intercepting a request from a software application by a proxy, the request for a service provided by a backend service of one or more control plane components. A processing device of the proxy determines, based on the intercepted request, an amount of resources to be assigned to or updated in the backend service. The processing device causes a control plane scaler coupled to the one or more control plane components to request the determined amount of resources for the backend service. Upon receiving a confirmation that the determined amount of resources is available in the backend service, the processing device forwards from the proxy, the intercepted request to the backend service.

Abstract: Example front forks for bicycles are described herein. An example front fork includes a crown having a top side and a bottom side opposite the top side. The crown defines an opening between the top side and the bottom side. The front fork includes a first leg and a second leg coupled to and extending from the bottom side of the crown. The front fork also includes a steerer tube disposed in the opening of the crown and extending from the top side of the crown. The steerer tube and the crown coupled by a weld at or near the bottom side of the crown.

Abstract: A method for manufacturing a target material is provided, including the steps of: disposing raw material powder on a substrate and melting the raw material powder by laser to form a target material layer; repeating the preceding process to allow a plurality of target material layers to form an integrated target material column; after cooling the target material column, removing the target material column from the substrate; and performing vacuum heat treatment on the target material column. Since the target material is additively manufactured and subjected to vacuum heat treatment, the target material has a finer and more uniform microstructure, thus improving the product quality.

Abstract: A method includes: constructing an on-wafer calibration piece model set that includes one or more on-wafer calibration piece models, where each of the one or more on-wafer calibration piece models has a corresponding on-wafer calibration piece; selecting an on-wafer calibration piece model from the on-wafer calibration piece model set; measuring the on-wafer calibration piece utilizing an on-wafer S parameter measurement system that is calibrated using a multi-thread TRL calibration method in a Terahertz frequency band, to obtain an S parameter of the on-wafer calibration piece; and calculating a plurality of different parameters that represent crosstalk of calibration pieces in the on-wafer calibration piece model, according to an admittance calculated according to the S parameter and an admittance formula corresponding to the on-wafer calibration piece model.

Abstract: A method of decoding a coded video bitstream implemented by a video decoder is disclosed. The method includes determining that a coded video sequence (CVS) of the coded video bitstream includes a video coding layer (VCL) network abstraction layer (NAL) unit having a gradual decoding refresh (GDR) network abstraction layer (NAL) unit type (GDR_NUT), the VCL NAL unit having the GDR_NUT containing a GDR picture; initiating decoding of the CVS at the GDR picture; and generating an image according to the CVS as decoded. A corresponding method of encoding is also disclosed.

Abstract: The present disclosure relates to a composition that includes a structure that includes where R1 includes at least one of a carbon atom and/or an oxygen atom, R2 includes at least one of a carbon atom and/or an oxygen atom, and represents a covalent bond. In some embodiments of the present disclosure, the composition may be bioderived.

Abstract: The present disclosure provides a determination method, an elimination method and an apparatus for an electron microscope aberration. The determination method comprises: training a neural network for image recognition using a plurality of electron microscope simulation images to obtain an electron microscope image recognition model; recognizing an electron microscope image of an experimental sample using the electron microscope image recognition model to obtain the electron microscope simulation image corresponding to the electron microscope image of the experimental sample; and obtaining the corresponding set aberration as an imaging aberration of the electron microscope image of the experimental sample according to the electron microscope simulation image corresponding to the electron microscope image of the experimental sample.

Abstract: A filament forming method includes: performing first stage to apply first bias including gate and drain voltages to a resistive memory unit plural times until read current reaches first saturating state, latching read current in first saturating state as saturating read current, determining whether rate of increase of saturating read current is less than first threshold value; when rate of increase of saturating read current is not less than first threshold value, performing second stage to apply second bias, by increasing gate voltage and decreasing drain voltage, to the resistive memory unit plural times until read current reaches second saturating state, latching read current in second saturating state as saturating read current and determining whether rate of increase of saturating read current is less than first threshold value; finishing the method when rate of increase of saturating read current is less than first threshold value and saturating read current reaches target current value.

Abstract: Anaphthalene ring-containing compound, a pharmaceutical composition containing same, and the use thereof. A naphthalene ring-containing compound as represented by formula III, a pharmaceutically acceptable salt thereof, a solvate thereof, or a solvate of the pharmaceutically acceptable salt thereof. The compound is new in structure and has a better activity on cancers.

Abstract: A testing module for a semiconductor wafer-form package includes a circuit board structure, first connectors, a first connecting structure, second connectors, third connectors and a first bridge connector. The circuit board structure includes two edge regions and a main region located therebetween. The first connectors are located over the edge regions and connected to the circuit board structure. The first connecting structure is located over and distant from the circuit board structure. The second connectors and third connectors are located over and connected to the first connecting structure, where the third connectors are configured to transmit electric signals for testing the semiconductor wafer-form package being placed over the main region. The first bridge connector is electrically coupling the circuit board structure and the first connecting structure by connecting the second connectors and the first connectors.

Abstract: In accordance with embodiments, a memory array is formed with a multiple patterning process. In embodiments a first trench is formed within a multiple layer stack and a first conductive material is deposited into the first trench. After the depositing the first conductive material, a second trench is formed within the multiple layer stack, and a second conductive material is deposited into the second trench. The first conductive material and the second conductive material are etched.

Abstract: A registration method and an electronic device for visual navigation in dental implant surgery, comprising obtaining a three-dimensional model of a target tooth to be registered, an entity model of the target tooth and a second model of the target tooth, obtaining a position and attitude matrix of the three-dimensional model in a virtual coordinate system according to the coordinates of at least three points on a three-dimensional model of a substrate after the registration of the three-dimensional model in the virtual coordinate system, mounting the entity model of the target tooth onto a registration standard board, obtaining a position and attitude matrix of the entity model in the visual coordinate system according to three optical marks and the points on the entity model corresponding to the three points, and obtaining a correspondence between the virtual coordinate system and the visual coordinate system according to two position and attitude matrices.

Abstract: A method includes receiving a wafer, measuring a surface topography of the wafer; calculating a topographical variation based on the surface topography measurement performing a single-zone alignment compensation when the topographical variation is less than a predetermined value or performing a multi-zone alignment compensation when the topographical variation is greater than the predetermined value; and performing a wafer alignment according to the single-zone alignment compensation or the multi-zone alignment compensation.

Abstract: A puller includes a first claw and a second claw arranged opposite to each other. The first claw includes a first pulling part, a first limiting part and a first connecting part. The first limiting part includes a first body part, a first notch part and a second notch part. The second claw includes a second pulling part, a second limiting part and a second connecting part. The second limiting part includes a second body part, a third notch part and a fourth notch part. A size of the second pulling part is smaller than or equal to a size of the second notch part.