Patents by Inventor Chen Yu-Tsai
Chen Yu-Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240176093Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.Type: ApplicationFiled: February 5, 2024Publication date: May 30, 2024Inventors: Chao-Chang HU, Chih-Wei WENG, Chia-Che WU, Chien-Yu KAO, Hsiao-Hsin HU, He-Ling CHANG, Chao-Hsi WANG, Chen-Hsien FAN, Che-Wei CHANG, Mao-Gen JIAN, Sung-Mao TSAI, Wei-Jhe SHEN, Yung-Ping YANG, Sin-Hong LIN, Tzu-Yu CHANG, Sin-Jhong SONG, Shang-Yu HSU, Meng-Ting LIN, Shih-Wei HUNG, Yu-Huai LIAO, Mao-Kuo HSU, Hsueh-Ju LU, Ching-Chieh HUANG, Chih-Wen CHIANG, Yu-Chiao LO, Ying-Jen WANG, Shu-Shan CHEN, Che-Hsiang CHIU
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Patent number: 11990430Abstract: A method includes forming a conductive pad over an interconnect structure of a wafer, forming a capping layer over the conductive pad, forming a dielectric layer covering the capping layer, and etching the dielectric layer to form an opening in the dielectric layer. The capping layer is exposed to the opening. A wet-cleaning process is then performed on the wafer. During the wet-cleaning process, a top surface of the capping layer is exposed to a chemical solution used for performing the wet-cleaning process. The method further includes depositing a conductive diffusion barrier extending into the opening, and depositing a conductive material over the conductive diffusion barrier.Type: GrantFiled: February 26, 2021Date of Patent: May 21, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Chen-Yu Tsai, Ku-Feng Yang, Wen-Chih Chiou
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Publication number: 20240134167Abstract: An optical path folding element includes a main body, a light absorption film layer and a matte structure. The main body has optical surface including an incident surface, a reflective surface and an emitting surface. A light enters into the optical folding element through the incident surface. The reflective surface reflects the light so as to change a traveling direction thereof. The light exits the optical folding element through the emitting surface. The light absorbing film layer is configured to reduce reflectance and provided adjacent to at least part of the optical surface, and the light absorbing film layer is in physical contact with the main body. The matte structure is disposed adjacent to at least part of the optical surface. The matte structure provides an undulating profile on a surface of the optical path folding element, and the matte structure is formed in one-piece with the main body.Type: ApplicationFiled: September 24, 2023Publication date: April 25, 2024Applicant: LARGAN PRECISION CO., LTD.Inventors: Ssu-Hsin LIU, Chen Wei FAN, Chien-Hsun WU, Wen-Yu TSAI, Ming-Ta CHOU
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Publication number: 20240099154Abstract: A magnetoresistive random access memory (MRAM) device includes a first array region and a second array region on a substrate, a first magnetic tunneling junction (MTJ) on the first array region, a first top electrode on the first MTJ, a second MTJ on the second array region, and a second top electrode on the second MTJ. Preferably, the first top electrode and the second top electrode include different nitrogen to titanium (N/Ti) ratios.Type: ApplicationFiled: November 21, 2023Publication date: March 21, 2024Applicant: UNITED MICROELECTRONICS CORPInventors: Hui-Lin Wang, Si-Han Tsai, Dong-Ming Wu, Chen-Yi Weng, Ching-Hua Hsu, Ju-Chun Fan, Yi-Yu Lin, Che-Wei Chang, Po-Kai Hsu, Jing-Yin Jhang
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Patent number: 11934027Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.Type: GrantFiled: June 21, 2022Date of Patent: March 19, 2024Assignee: TDK TAIWAN CORP.Inventors: Chao-Chang Hu, Chih-Wei Weng, Chia-Che Wu, Chien-Yu Kao, Hsiao-Hsin Hu, He-Ling Chang, Chao-Hsi Wang, Chen-Hsien Fan, Che-Wei Chang, Mao-Gen Jian, Sung-Mao Tsai, Wei-Jhe Shen, Yung-Ping Yang, Sin-Hong Lin, Tzu-Yu Chang, Sin-Jhong Song, Shang-Yu Hsu, Meng-Ting Lin, Shih-Wei Hung, Yu-Huai Liao, Mao-Kuo Hsu, Hsueh-Ju Lu, Ching-Chieh Huang, Chih-Wen Chiang, Yu-Chiao Lo, Ying-Jen Wang, Shu-Shan Chen, Che-Hsiang Chiu
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Publication number: 20240074536Abstract: A foot protection pad is provided, comprising: a body, a midfoot elastic body and a heel elastic body; wherein, the body is formed with a first elastic material to form a front plantar area, a midfoot area and a heel area; the bottom surface of the midfoot area is formed with a midfoot arch, and opposite sides are formed with a concave arc surface of the inner arch and the concave arc surface of the outer arch; a recession is formed on the body of the heel area, and the opposite two sides of the recession are formed with a concave arc surface of the inner arch and a concave arc surface of the outer arch, and the rear end is formed with a heel concave arc surface; the midfoot elastic body and the heel elastic body are formed with a second elastic material and respectively combined with the body.Type: ApplicationFiled: September 7, 2022Publication date: March 7, 2024Inventor: Chen-Yu Tsai
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Publication number: 20240070243Abstract: A collaborative session (e.g., a virtual time capsule) in which access to a collaborative object and added virtual content is selectively provided to participants/users. In one example of the collaborative session, authentication of the collaborative object is performed by all of the users to complete the collaborative session. Each user authenticates the collaborative object, such as using a stamping gesture on a user interface of a client device or in an augmented reality session. User specific data is recorded with the stamping gesture to authenticate the collaborative object and the associated virtual content. In an example, user specific data may include device information, participant profile information, or biometric signal information. Biometric signal information, such as a fingerprint from a mobile device or a heart rate received from a connected smart device can be used to provide an authenticating signature to the seal.Type: ApplicationFiled: August 31, 2022Publication date: February 29, 2024Inventors: Youjean Cho, Chen Ji, Fannie Liu, Andrés Monroy-Hernández, Tsung-Yu Tsai, Rajan Vaish
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Publication number: 20240070301Abstract: A collaborative session (e.g., a virtual time capsule) in which access to a collaborative object and added virtual content is selectively provided to participants/users. In one example of the collaborative session, a participant (the host) creates a new session and invites participants to join. The session creator (i.e., the host) and other approved participants can access the contents of a session (e.g., which may be recorded using an application such as lens cloud feature; available from Snap Inc. of Santa Monica, California). A timestamp is associated with each received virtual content, and the users are provided with a timelapse of the collaborative object as a function of the timestamps.Type: ApplicationFiled: August 31, 2022Publication date: February 29, 2024Inventors: Youjean Cho, Chen Ji, Fannie Liu, Andrés Monroy-Hernández, Tsung-Yu Tsai, Rajan Vaish
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Publication number: 20240069643Abstract: A collaborative session (e.g., a virtual time capsule) in which access to a collaborative object and added virtual content is selectively provided to participants/users. In one example of the collaborative session, a user interacts with the collaborative object using hand gestures. The virtual content associated with the collaborative object can be accessed with an opening hand gesture and the virtual content can be hidden with a closing hand gesture. The hand gestures are detected by cameras of a client device used by the user. The collaborative object can be moved and manipulated using a pointing gesture, wherein the position of the collaborate object can be confirmed to a new position by titling the client device of the user.Type: ApplicationFiled: August 31, 2022Publication date: February 29, 2024Inventors: Youjean Cho, Chen Ji, Fannie Liu, Andrés Monroy-Hernández, Tsung-Yu Tsai, Rajan Vaish
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Publication number: 20240070300Abstract: Collaborative sessions in which access to added virtual content is selectively made available to participants/users by a collaborative system. The system receives a request from a user to join a session, and associates a timestamp with the user corresponding to receipt of the request.Type: ApplicationFiled: August 31, 2022Publication date: February 29, 2024Inventors: Youjean Cho, Chen Ji, Fannie Liu, Andrés Monroy-Hernández, Tsung-Yu Tsai, Rajan Vaish
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Publication number: 20240070298Abstract: Collaborative sessions in which access to added virtual content is selectively made available to participants/users. A participant (the host) creates a new session and invites participants to join. The invited participants receive an invitation to join the session. The session creator (i.e., the host) and other approved participants can access the contents of a session. The session identifies a new participant when they join the session, and concurrently notifies the other participants in the session that a new participant is waiting for permission to access the added virtual content. The host or approved participants can set up the new participant with permissions for accessing added virtual content.Type: ApplicationFiled: August 31, 2022Publication date: February 29, 2024Inventors: Youjean Cho, Chen Ji, Fannie Liu, Andrés Monroy-Hernández, Tsung-Yu Tsai, Rajan Vaish
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Publication number: 20240070302Abstract: Collaborative sessions in which access to added virtual content is selectively made available to participants/users. A participant (the host) creates a new session and invites participants to join. The invited participants receive an invitation to join the session. The session creator (i.e., the host) and other approved participants can access the contents of a session. The session identifies a new participant when they join the session, and concurrently notifies the other participants in the session that a new participant is waiting for permission to access the added virtual content. The host or approved participants can set up the new participant with permissions for accessing added virtual content.Type: ApplicationFiled: August 31, 2022Publication date: February 29, 2024Inventors: Youjean Cho, Chen Ji, Fannie Liu, Andrés Monroy-Hernández, Tsung-Yu Tsai, Rajan Vaish
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Publication number: 20240071020Abstract: A collaborative session (e.g., a virtual time capsule) in which access to a collaborative object with an associated material and added virtual content is provided to users. In one example of the collaborative session, a user selects the associated material of the collaborative object. Physical characteristics are assigned to the collaborative object as a function of the associated material to be perceived by the participants when the collaborative object is manipulated. In one example, the material associated to the collaborative object is metal, wherein the interaction between the users and the collaborative object generates a response of the collaborative object that is indicative of the physical properties of metal, such as inertial, acoustic, and malleability.Type: ApplicationFiled: August 31, 2022Publication date: February 29, 2024Inventors: Youjean Cho, Chen Ji, Fannie Liu, Andrés Monroy-Hernández, Tsung-Yu Tsai, Rajan Vaish
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Publication number: 20240070299Abstract: A collaborative session (e.g., a virtual time capsule) in which access to a collaborative object and added virtual content is selectively provided to participants/users. In one example of the collaborative session, a processor provides users with access to a collaborative object using respective physically remote devices, and associates virtual content received from the users with the collaborative object during a collaboration period. The processor maintains a timer including a countdown indicative of when the collaboration period ends for associating virtual content with the collaborative object. The processor provides the users with access to the collaborative object with associated virtual content at the end of the collaboration period.Type: ApplicationFiled: August 31, 2022Publication date: February 29, 2024Inventors: Youjean Cho, Chen Ji, Fannie Liu, Andrés Monroy-Hernández, Tsung-Yu Tsai, Rajan Vaish
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Publication number: 20240069642Abstract: Collaborative sessions in which access to a collaborative object and added virtual content is selectively provided to participants/users. In one example of the collaborative session, a participant crops media content by use of a hand gesture to produce an image segment that can be associated to the collaborative object. The hand gesture resembles a pair of scissors and the camera and processor of the client device track a path of the hand gesture to identify an object within a displayed image to create virtual content of the identified object. The virtual content created by the hand gesture is then associated to the collaborative object.Type: ApplicationFiled: August 31, 2022Publication date: February 29, 2024Inventors: Youjean Cho, Chen Ji, Fannie Liu, Andrés Monroy-Hernández, Tsung-Yu Tsai, Rajan Vaish
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Patent number: 11917923Abstract: A magnetoresistive random access memory (MRAM) structure, including a substrate and multiple MRAM cells on the substrate, wherein the MRAM cells are arranged in a memory region adjacent to a logic region. An ultra low-k (ULK) layer covers the MRAM cells, wherein the surface portion of ultra low-k layer is doped with fluorine, and dents are formed on the surface of ultra low-k layer at the boundaries between the memory region and the logic region.Type: GrantFiled: April 28, 2021Date of Patent: February 27, 2024Assignee: UNITED MICROELECTRONICS CORP.Inventors: Hui-Lin Wang, Ching-Hua Hsu, Si-Han Tsai, Shun-Yu Huang, Chen-Yi Weng, Ju-Chun Fan, Che-Wei Chang, Yi-Yu Lin, Po-Kai Hsu, Jing-Yin Jhang, Ya-Jyuan Hung
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Publication number: 20240006792Abstract: A power device is provided. The power device includes a body and a plug rotatably assembled on the body. The body includes a lower housing and a connection element in the lower housing. The connection element includes a pathway and a conductive pin at least partially disposed in the pathway. The plug includes an upper housing and an upper pin rotatably and pivotally connected to the upper housing. The upper pin is used to electrically connect to an external power supply. The plug rotates relative to the body to move the conductive pin along the pathway from a storage position to an extending position to electrically connect to the upper pin.Type: ApplicationFiled: February 22, 2023Publication date: January 4, 2024Inventors: Shuo-Jen SHIEH, Chen-Yu TSAI, Yu-Po CHEN
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Publication number: 20230411326Abstract: A semiconductor structure including a first die, a second die stacked on the first die, a smoothing layer disposed on the first die and a filling material layer disposed on the smoothing layer. The second die has a dielectric portion and a semiconductor material portion disposed on the dielectric portion. The smoothing layer includes a first dielectric layer and a second dielectric layer, and the second dielectric layer is disposed on the first dielectric layer. The dielectric portion is surrounded by the smoothing layer, and the semiconductor material portion is surrounded by the filling material layer. A material of the first dielectric layer is different from a material of the second dielectric layer and a material of the filling material layer.Type: ApplicationFiled: June 16, 2022Publication date: December 21, 2023Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chen-Yu Tsai, Ku-Feng Yang, Tsang-Jiuh Wu, Wen-Chih Chiou
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Publication number: 20230387051Abstract: A method includes forming a conductive pad over an interconnect structure of a wafer, forming a capping layer over the conductive pad, forming a dielectric layer covering the capping layer, and etching the dielectric layer to form an opening in the dielectric layer. The capping layer is exposed to the opening. A wet-cleaning process is then performed on the wafer. During the wet-cleaning process, a top surface of the capping layer is exposed to a chemical solution used for performing the wet-cleaning process. The method further includes depositing a conductive diffusion barrier extending into the opening, and depositing a conductive material over the conductive diffusion barrier.Type: ApplicationFiled: August 8, 2023Publication date: November 30, 2023Inventors: Chen-Yu Tsai, Ku-Feng Yang, Wen-Chih Chiou
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Publication number: 20230317648Abstract: Semiconductor devices and methods of manufacture are presented which form metallization layers over a semiconductor substrate; form a first pad over the metallization layers; deposit one or more passivation layers over the first pad; and form a first bond pad via through the one or more passivation layers and at least partially through the first pad.Type: ApplicationFiled: May 10, 2022Publication date: October 5, 2023Inventors: Chen-Yu Tsai, Ku-Feng Yang, Tsang-Jiuh Wu, Wen-Chih Chiou