Abstract: Embodiments include a Schottky barrier diode (SBD) structure and method of forming the same, the SBD structure including a current blockage feature to inhibit current from leaking at an interface with a shallow trench isolation regions surrounding an anode region of the SBD structure.

Abstract: A smoke detector with an anti-insect function includes a substrate, an optical detection module, a top cover, a base and a perforated plate. The substrate has a ring shape region surrounding a central detection region, and a first block structure of the central detection region is protruded from the substrate and higher than an upper surface of the ring shape region. The optical detection module is disposed inside the central detection region. The top cover has a lateral wall. The base is disposed on the substrate and connected to the top cover to cover the optical detection module. The base has a second block structure partly overlapped with the lateral wall to form a guiding channel. The perforated plate is disposed between the lateral wall and the second block structure to prevent an insect from moving into the top cover through the guiding channel.

Abstract: Systems, methods, and devices are described herein for integrated circuit (IC) layout validation. A plurality of IC patterns are collected which include a first set of patterns capable of being manufactured and a second set of patterns incapable of being manufactured. A machine learning model is trained using the plurality of IC patterns. The machine learning model generates a prediction model for validating IC layouts. The prediction model receives data including a set of test patterns comprising scanning electron microscope (SEM) images of IC patterns. Design violations associated with an IC layout are determined based on the SEM images and the plurality of IC patterns. A summary of the design violations is provided for further characterization of the IC layout.

Abstract: The present disclosure generally relates to underwater user interfaces.

Abstract: A control system of a travelling system includes a directional controller, a first sensor, a second sensor, an image-capturing module and a preprocessor. The first sensor is disposed on a reference position. The second sensor and the image-capturing module are disposed on the directional controller. The preprocessor compares a first directional data from the first sensor and a second directional data from the second sensor to obtain a difference value, and provides a photographing parameter to the image-capturing module.

Abstract: Systems, methods, and devices are described herein for integrated circuit (IC) layout validation. A plurality of IC patterns are collected which include a first set of patterns capable of being manufactured and a second set of patterns incapable of being manufactured. A machine learning model is trained using the plurality of IC patterns. The machine learning model generates a prediction model for validating IC layouts. The prediction model receives data including a set of test patterns comprising scanning electron microscope (SEM) images of IC patterns. Design violations associated with an IC layout are determined based on the SEM images and the plurality of IC patterns. A summary of the design violations is provided for further characterization of the IC layout.

Abstract: A control system of a travelling system includes a directional controller, a first sensor, a second sensor, an image-capturing module and a preprocessor. The first sensor is disposed on a reference position. The second sensor and the image-capturing module are disposed on the directional controller. The preprocessor compares a first directional data from the first sensor and a second directional data from the second sensor to obtain a difference value, and provides a photographing parameter to the image-capturing module.

Abstract: An image capturing apparatus includes a first lens module, a second lens module and an operation module which divides a first left block, a second right block of the first image and a second right block, a second left block of the second image into a plurality of first right sub-blocks, first left sub-blocks, second right sub-blocks and second left sub-blocks respectively, compares a first parameter, a second parameter and/or a third parameter of the first left sub-blocks, the first right sub-blocks, the second left sub-blocks and the second right sub-blocks, obtains a plurality of first difference values, a plurality of second difference values and/or a plurality of third difference values, obtains a total weighting value according to the first difference values, the second difference values and/or the third difference values, and adjusts brightness of the first image and the second image with the total weighting value.

Abstract: An image capturing apparatus includes a first lens module, a second lens module and an operation module which divides a first left block, a second right block of the first image and a second right block, a second left block of the second image into a plurality of first right sub-blocks, first left sub-blocks, second right sub-blocks and second left sub-blocks respectively, compares a first parameter, a second parameter and/or a third parameter of the first left sub-blocks, the first right sub-blocks, the second left sub-blocks and the second right sub-blocks, obtains a plurality of first difference values, a plurality of second difference values and/or a plurality of third difference values, obtains a total weighting value according to the first difference values, the second difference values and/or the third difference values, and adjusts brightness of the first image and the second image with the total weighting value.

Abstract: An etching method includes forming a high density structure and a low density structure on a substrate. A first material layer is formed to cover both structures. Part of the low density structure is exposed through the first material layer. A second material layer is formed to cover the first material layer. The second material layer is etched to remove the second material layer on the high density structure and part of the second material layer on the low density structure. The first material layer on the high density structure and the second material layer on the low density structure are simultaneously etched. The first material layer is etched to expose a first portion of the high density structure and a second portion of the low density structure. Finally, the first portion and the second portion are removed.

Abstract: A method for reducing the tilt of an optical unit during manufacture of an image sensor includes the steps of: providing a semimanufacture of the image sensor, carrying out a preheating process, carrying out an adhesive application process, carrying out an optical unit mounting process, and carrying out a packaging process. Due to the preheating process, the semimanufacture will be subjected to a stabilized process environment during the adhesive application process and the optical unit mounting process, so as for the optical unit to remain highly flat once attached to the semimanufacture. The method reduces the chances of tilt and crack of the optical unit and thereby contributes to a high yield rate.

Abstract: A two-stage packaging method of image sensors is disclosed. The packaging method includes the following steps: providing a substrate, fixing an image sensor chip on the substrate, fixing a transparent board on the image sensor chip, electrically connecting the image sensor chip and the substrate, forming a first encapsulant lay, and forming a second encapsulant layer. The two-stage packaging method prevents excessive pressure from being generated by formation of the encapsulant layers during the image sensor packaging process. Such excessive pressure, if generated, may result in position shift of the image sensor chip or damage of the bonding wires. The two-stage packaging method can increase the yield of the image sensor packaging process as well as the sensitivity of image sensors, thereby improving the quality and production of image sensor packaging while lowering the manufacturing costs.

Abstract: A two-stage packaging method of image sensors is disclosed. The packaging method includes the following steps: providing a substrate, fixing an image sensor chip on the substrate, fixing a transparent board on the image sensor chip, electrically connecting the image sensor chip and the substrate, forming a first encapsulant lay, and forming a second encapsulant layer. The two-stage packaging method prevents excessive pressure from being generated by formation of the encapsulant layers during the image sensor packaging process. Such excessive pressure, if generated, may result in position shift of the image sensor chip or damage of the bonding wires. The two-stage packaging method can increase the yield of the image sensor packaging process as well as the sensitivity of image sensors, thereby improving the quality and production of image sensor packaging while lowering the manufacturing costs.

Abstract: A triaxial driving device for electrodischarge machine tools having a three-liners-axes mechanism and an electrode tool and has a connecting mount, a first axial rotator, a base, a supporting arm, a second axial rotator, a third axial rotator and an electrode holder. The connecting mount is connected securely to the three-liners-axes mechanism. The first axial rotator is mounted in the connecting mount and has a rotating head. The base is connected securely to the rotating head of the first axial rotator and has a space. The supporting arm is rotatably mounted in the space of the base and has a connecting frame. The second axial rotator is securely connected to the base and the supporting arm and has a rotating head. The third axial rotator is connected to the supporting arm and has a rotating head. The electrode holder is connected to the third axial rotator and the electrode tool.

Abstract: The present invention discloses a structure and a manufacturing method for a high-resolution camera module, wherein the method includes the following steps: providing an image sensor wafer comprising multiple image sensor chips; performing inspection and defining if each image sensor chip is a good chip; disposing an optical cover on the image sensor chip defined as the good chip, wherein the optical cover faces a sensing area and does not cover conductive contacts; cutting the image sensor wafer to obtain the discrete image sensor chip covered with the optical cover; and disposing a first surface of the divided image sensor chip on a bottom surface of a ceramic substrate. The present invention can seal the high resolution camera module during early stage of the manufacturing process to improve the yield rate of the camera module, and downsize the camera module effectively.

Abstract: The present invention discloses a structure and a manufacturing method for a high-resolution camera module, wherein the method includes the following steps: providing an image sensor wafer comprising multiple image sensor chips; performing inspection and defining if each image sensor chip is a good chip; disposing an optical cover on the image sensor chip defined as the good chip, wherein the optical cover faces a sensing area and does not cover conductive contacts; cutting the image sensor wafer to obtain the discrete image sensor chip covered with the optical cover; and disposing a first surface of the divided image sensor chip on a bottom surface of a ceramic substrate. The present invention can seal the high resolution camera module during early stage of the manufacturing process to improve the yield rate of the camera module, and downsize the camera module effectively.

Abstract: A triaxial driving device for electrodischarge machine tools having a three-liners-axes mechanism and an electrode tool and has a connecting mount, a first axial rotator, a base, a supporting arm, a second axial rotator, a third axial rotator and an electrode holder. The connecting mount is connected securely to the three-liners-axes mechanism. The first axial rotator is mounted in the connecting mount and has a rotating head. The base is connected securely to the rotating head of the first axial rotator and has a space. The supporting arm is rotatably mounted in the space of the base and has a connecting frame. The second axial rotator is securely connected to the base and the supporting arm and has a rotating head. The third axial rotator is connected to the supporting arm and has a rotating head. The electrode holder is connected to the third axial rotator and the electrode tool.

Abstract: A method of automatically calibrating a visual parameter, such as luminance or contrast, for an imaging device is disclosed. A ratio of visual parameter difference to lens position difference between two predetermined lens positions is pre-determined for a predetermined focal length. A target visual parameter is then obtained according to the pre-determined ratio, a current visual parameter and lens position difference between a current lens position and a target lens position. Finally, the current visual parameter is updated by the target visual parameter in an automatic mode.

Abstract: The present invention is directed to a flashing control method for a digital camera. Indices respectively corresponding to sensitivity values are firstly determined. Subsequently, main-flash intensities are respectively obtained with respect to the sensitivity values such that their target brightness values are substantially the same after exposure, thereby constructing an energy table. Further, a predetermined preflash is fired to obtain a corresponding preflash brightness value with respect to each distinct distance. Main-flash indices are then respectively obtained according to maximum main-flash intensity and the energy table with respect to the distinct distances such that the target brightness values are substantially the same after exposure, thereby constructing a preflash table. During picture capturing, the main-flash intensity is obtained according to the preflash brightness value and the preflash table.

Abstract: The present invention is directed to a flashing control method for a digital camera. Indices respectively corresponding to sensitivity values are firstly determined. Subsequently, main-flash intensities are respectively obtained with respect to the sensitivity values such that their target brightness values are substantially the same after exposure, thereby constructing an energy table. Further, a predetermined preflash is fired to obtain a corresponding preflash brightness value with respect to each distinct distance. Main-flash indices are then respectively obtained according to maximum main-flash intensity and the energy table with respect to the distinct distances such that the target brightness values are substantially the same after exposure, thereby constructing a preflash table. During picture capturing, the main-flash intensity is obtained according to the preflash brightness value and the preflash table.