Patents by Inventor CHENG-CHAO CHAO

CHENG-CHAO CHAO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130256734
    Abstract: An LED (light emitting diode) includes a base, two spaced electrodes and a thermal conductivity layer. The base has a top surface. The two electrodes and the thermal conductivity layer are located on the top surface of the base. The thermal conductivity layer is attached to the top surface and located beside and between the electrodes. The two electrodes are electrically insulated from each other, and electrically insulated from the thermal conductivity layer. A light emitting chip is electrically connected to the two electrodes. The electrodes and the thermal conductivity layer are on different levels.
    Type: Application
    Filed: September 28, 2012
    Publication date: October 3, 2013
    Inventors: SUNG-HSIANG YANG, WEI-CHUN YEH, CHENG-CHAO CHAO
  • Publication number: 20130163262
    Abstract: A lamp assembly comprises a lamp body, a bracket, and a securing member. The lamp body comprises a leg. The lamp body is arranged on the bracket. The securing member is mounted on the bracket and capable of moving relative to the bracket to press or away from the leg of the lamp body to achieve an assembly of the lamp body to the bracket or a disassembly of the lamp body from the bracket. The lamp body includes a plurality of light emitting diodes as a light source.
    Type: Application
    Filed: March 28, 2012
    Publication date: June 27, 2013
    Applicant: FOXSEMICON INTEGRATED TECHNOLOGY, INC.
    Inventors: SUNG-HSIANG YANG, WEI-CHUN YEH, CHENG-CHAO CHAO
  • Publication number: 20130164556
    Abstract: An exemplary method for manufacturing a circuit board includes, firstly, providing a substrate made of heat conductive, electrically insulative material. Then a copper layer is formed on the substrate. After that, nickel is plated on the copper layer to form a nickel layer. Finally, gold is and plated on the nickel layer to form a gold layer.
    Type: Application
    Filed: August 15, 2012
    Publication date: June 27, 2013
    Applicant: FOXSEMICON INTEGRATED TECHNOLOGY, INC.
    Inventors: SUNG-HSIANG YANG, WEI-CHUN YEH, CHENG-CHAO CHAO