Abstract: An optical module is disclosed. The optical module includes a carrier, an optical emitter disposed over the carrier, and a monitor disposed over the carrier and configured to adjust a property of a first light emitted from the optical emitter.

Abstract: A flow guiding device in an immersion-cooled chassis of a server comprises at least one deflector located above a chip on a mainboard in the chassis, each deflector comprises a first end for mounting to the mainboard above the chip and a second end inclined away from the mainboard. The first end is immersed in coolant, the second end is higher than the first end; the deflector further comprises a hollow part including multiple through holes for interrupting upward movement vapor bubbles generated by the hot chip, which reduces probability of the vapor bubbles escaping from the coolant liquid and the chassis. A liquid-cooled chassis having the flow guiding device is also disclosed.

Abstract: A device includes a fin extending from a semiconductor substrate; a gate stack over the fin; a first spacer on a sidewall of the gate stack; a source/drain region in the fin adjacent the first spacer; an inter-layer dielectric layer (ILD) extending over the gate stack, the first spacer, and the source/drain region, the ILD having a first portion and a second portion, wherein the second portion of the ILD is closer to the gate stack than the first portion of the ILD; a contact plug extending through the ILD and contacting the source/drain region; a second spacer on a sidewall of the contact plug; and an air gap between the first spacer and the second spacer, wherein the first portion of the ILD extends across the air gap and physically contacts the second spacer, wherein the first portion of the ILD seals the air gap.

Abstract: An integrated circuit package including electrically floating metal lines and a method of forming are provided. The integrated circuit package may include integrated circuit dies, an encapsulant around the integrated circuit dies, a redistribution structure on the encapsulant, a first electrically floating metal line disposed on the redistribution structure, a first electrical component connected to the redistribution structure, and an underfill between the first electrical component and the redistribution structure. A first opening in the underfill may expose a top surface of the first electrically floating metal line.

Abstract: An optical module is disclosed. The optical module includes a carrier, an optical emitter disposed over the carrier, and a monitor disposed over the carrier and configured to adjust a property of a first light emitted from the optical emitter.

Abstract: A power supply device includes connector from a power source, a rectifying module, a power supply module, and a bulk capacitor. The capacitor stores and smoothes the rectified power, and outputs the smoothed power to the power supply module. The connector is capable of connecting to the power source through a Delta connection and a Wye connection.

Abstract: A power supply device includes connector from a power source, a rectifying module, a power supply module, and a bulk capacitor. The capacitor stores and smoothes the rectified power, and outputs the smoothed power to the power supply module. The connector is capable of connecting to the power source through a Delta connection and a Wye connection.

Abstract: A structure of semiconductor device includes a gate structure, disposed on a substrate. A spacer is disposed on a sidewall of the gate structure, wherein the spacer is an l-like structure. A first doped region is disposed in the substrate at two sides of the gate structure. A second doped region is disposed in the substrate at the two sides of the gate structure, overlapping the first doped region. A silicide layer is disposed on the substrate within the second doped region, separating from the spacer by a distance. A dielectric layer covers over the second doped region and the gate structure with the spacer.

Abstract: A method of forming a semiconductor device includes following steps. First of all, plural mandrel patterns are formed on a target layer. Then, plural capping layers are formed to cover a top region and sidewalls of each of the mandrel patterns, respectively. Next, plural spacers are formed at two sides of each of the capping layers, respectively. Following these, a portion of the spacers and the capping layers covered on the top regions of the mandrel patterns are simultaneously removed, and the capping layers is then removed completely.

Abstract: A method of forming a semiconductor device includes following steps. First of all, plural mandrel patterns are formed on a target layer. Then, plural capping layers are formed to cover a top region and sidewalls of each of the mandrel patterns, respectively. Next, plural spacers are formed at two sides of each of the capping layers, respectively. Following these, a portion of the spacers and the capping layers covered on the top regions of the mandrel patterns are simultaneously removed, and the capping layers is then removed completely.

Abstract: The structure of slide-block module includes a plurality of slide-block modules composing several reinforced areas, the slide-block modules are contained in a plastic pallet shaping mold, the plastic pallet is provided in a connecting zone between a central area of a bearing surface and a plurality of supporting columns at surrounding sides on the plastic pallet with the plurality of reinforced areas having ribs arranged transversely or longitudinally; each slide-block module includes a fixed block fixed on a shaping mold and having at least a lateral side beveled, and having a slide block, by obliquely sliding moving of the slide block on the fixed block, the slide block can be released along the lateral side of the fixed block from the mold smoothly after injection molding.

Abstract: An improved structure of foldable receiving bin by which all the side plates of the receiving bin are provided on the connecting ends thereof to an upper frame and a lower base plate of the receiving bin with engaging portions, the receiving bin can be firmly engaged and fixed when it is unfolded or folded; the bin is comprised of a cover plate, an upper frame, a lower base plate, two foldable plates and two lateral side plates. The foldable plates are connected between the upper frame and the lower base plate; while the lateral side plates are pivotally connected beneath the upper frame; the upper frame is pivotally connected with the cover plate which is comprised of a left cover plate and a right cover plate connected by engaging with each other. When the bin is unfolded for use, the engaging portions at the connecting ends between the two foldable plates and the two lateral side plates make the assembly of the receiving bin firm.

Abstract: The shelving comprises receiving troughs, with many supporting rods mounted between the upper and the lower receiving troughs to allow them to be piled one over another for being fixedly assembled with the engaging stubs on the bottom ends of the supporting rods inserting into the top location holes on their respective lower receiving troughs, each engaging stub has a protruding rib on one of its sides for firmer connection; the posts have rollers on the feet and with top holes thereon to allow insertion of the stubs, so that the shelving after assemblying can be pushed to move about; when disassembled, the receiving troughs can be fittingly lapped over one another, the supporting rods, also the posts, can be collected four in one group to form a cylinder shape, as is beneficial to saving space, shipping and storage.

Abstract: Drawer type storage bins suitable for stacking one on another and each includes an inner case and an outer housing, the case is placed in the housing, a handle is exposed out of an opening on the front side of the housing and can be drawn out of it, above the handle, a slightly outwardly bending semi-transparent curved surface is provided for magnifying images of the goods stored in the case; a set of protruding buckles are provided on the top edge of the rear side of the housing to be interengaged with a locking strip, thus the storage bins can be locked to get firmer stacking of them, the locking strip can be formed in passing during injection molding of the housing and is attached thereon, effect of the product is improved without increasing of cost of production, yet a novel style of the drawer type storage bins can be obtained.

Abstract: A plastic pallet having a plurality of downwardly extending hollow conical struts, each of which is provided with an asymmetrical concavity, with all concavities facing the same direction, the struts being receivable within corresponding struts of an adjacent pallet whereby, in a first orientation the space between adjacent pallets is decreased for storage purposes, and in a second orientation the space between the stacked pallets is increased for receiving a fork-lift therebetween.