Abstract: An integrated circuit package including electrically floating metal lines and a method of forming are provided. The integrated circuit package may include integrated circuit dies, an encapsulant around the integrated circuit dies, a redistribution structure on the encapsulant, a first electrically floating metal line disposed on the redistribution structure, a first electrical component connected to the redistribution structure, and an underfill between the first electrical component and the redistribution structure. A first opening in the underfill may expose a top surface of the first electrically floating metal line.

Abstract: Methods of cutting gate structures and fins, and structures formed thereby, are described. In an embodiment, a substrate includes first and second fins and an isolation region. The first and second fins extend longitudinally parallel, with the isolation region disposed therebetween. A gate structure includes a conformal gate dielectric over the first fin and a gate electrode over the conformal gate dielectric. A first insulating fill structure abuts the gate structure and extends vertically from a level of an upper surface of the gate structure to at least a surface of the isolation region. No portion of the conformal gate dielectric extends vertically between the first insulating fill structure and the gate electrode. A second insulating fill structure abuts the first insulating fill structure and an end sidewall of the second fin. The first insulating fill structure is disposed laterally between the gate structure and the second insulating fill structure.

Abstract: A semiconductor structure includes a functional die, a dummy die, a redistribution structure, a seal ring and an alignment mark. The dummy die is electrically isolated from the functional die. The redistribution structure is disposed over and electrically connected to the functional die. The seal ring is disposed over the dummy die. The alignment mark is between the seal ring and the redistribution structure, wherein the alignment mark is electrically isolated from the dummy die, the redistribution structure and the seal ring. The insulating layer encapsulates the functional die and the dummy die.

Abstract: A control pad structure (10) with a built-in speaker (40) includes a circuit board (20) disposing a plurality of touch switches (22) thereon; a control pad (30) is provided with a plurality of bulge points (36); and an accommodating space (35) is formed between the circuit board and the control pad for enclosing the speaker therein. The speaker is also provided with a bulge point. When the control pad is operated, the bulge points engage with corresponding touch switches to activate the switches. A plurality of openings (24) is defined in the circuit board between the touch switches.

Abstract: A sound box structure includes a shell (10) and a speaker (30) received therein. The shell defines a resonance chamber (114) and a receiving chamber (115) communicating therewith. The speaker is received in the receiving chamber. The shell is Mg—Al alloy.

Abstract: A speaker module with expandable enclosure includes a speaker (20) and an enclosure (10) receiving the speaker therein. The enclosure includes a plurality of boxes (60, 70, 80) communicating with each other. Each box is extendable relative to an adjacent box to thereby adjust the volume of the enclosure. Furthermore, when the speaker does not work the boxes can be retracted to thereby save a space occupied by the speaker module.

Abstract: A control pad structure (10) with a built-in speaker (40) includes a circuit board (20) disposing a plurality of touch switches (22) thereon; a control pad (30) is provided with a plurality of bulge points (36); and an accommodating space (35) is formed between the circuit board and the control pad for enclosing the speaker therein. The speaker is also provided with a bulge point. When the control pad is operated, the bulge points engage with corresponding touch switches to activate the switches. A plurality of openings (24) is defined in the circuit board between the touch switches.