Patents by Inventor Cheng-Chun Huang

Cheng-Chun Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240163947
    Abstract: A method for multi-link operation (MLO) is provided. The method for MLO may be applied to an apparatus. The method for MLO may include the following steps. A multi-chip controller of the apparatus may assign different data to a plurality of chips of the apparatus, wherein each chip corresponds to one link of multi-links. Each chip may determine whether transmission of the assigned data has failed. A first chip of the chips may transmit the assigned data to an access point (AP) in response to the first chip determining that the transmission of the assigned data has not failed.
    Type: Application
    Filed: November 8, 2023
    Publication date: May 16, 2024
    Inventors: Cheng-Ying WU, Wei-Wen LIN, Shu-Min CHENG, Hui-Ping TSENG, Chi-Han HUANG, Chih-Chun KUO, Yang-Hung PENG, Hao-Hua KANG
  • Patent number: 11977249
    Abstract: An optical device is provided. The optical device includes a ring waveguide and a bus waveguide. The ring waveguide includes a coupling region. The bus waveguide is disposed adjacent to and spaced apart from the coupling region of the ring waveguide. The bus waveguide includes a coupling structure corresponding to the coupling region.
    Type: Grant
    Filed: April 11, 2022
    Date of Patent: May 7, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Cheng-Tse Tang, Chewn-Pu Jou, Lan-Chou Cho, Ming Yang Jung, Tai-Chun Huang
  • Patent number: 11955154
    Abstract: A sense amplifier circuit includes a sense amplifier, a switch and a temperature compensation circuit. The temperature compensation circuit provides a control signal having a positive temperature coefficient, based on which the switch provides reference impedance for temperature compensation. The sense amplifier includes a first input end coupled to a target bit and a second input end coupled to the switch. The sense amplifier outputs a sense amplifier signal based on the reference impedance and the impedance of the target bit.
    Type: Grant
    Filed: May 16, 2022
    Date of Patent: April 9, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Cheng-Tung Huang, Jen-Yu Wang, Po-Chun Yang, Yi-Ting Wu, Yung-Ching Hsieh, Jian-Jhong Chen, Chia-Wei Lee
  • Patent number: 11942130
    Abstract: A bottom-pinned spin-orbit torque magnetic random access memory (SOT-MRAM) is provided in the present invention, including a substrate, a bottom electrode layer on the substrate, a magnetic tunnel junction (MTJ) on the bottom electrode layer, a spin-orbit torque (SOT) layer on the MTJ, a capping layer on the SOT layer, and an injection layer on the capping layer, wherein the injection layer is divided into individual first part and second part, and the first part and the second part are connected respectively with two ends of the capping layer.
    Type: Grant
    Filed: March 23, 2022
    Date of Patent: March 26, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Jian-Jhong Chen, Yi-Ting Wu, Jen-Yu Wang, Cheng-Tung Huang, Po-Chun Yang, Yung-Ching Hsieh
  • Patent number: 11935871
    Abstract: A semiconductor package including a first semiconductor die, a second semiconductor die, a first insulating encapsulation, a dielectric layer structure, a conductor structure and a second insulating encapsulation is provided. The first semiconductor die includes a first semiconductor substrate and a through silicon via (TSV) extending from a first side to a second side of the semiconductor substrate. The second semiconductor die is disposed on the first side of the semiconductor substrate. The first insulating encapsulation on the second semiconductor die encapsulates the first semiconductor die. A terminal of the TSV is coplanar with a surface of the first insulating encapsulation. The dielectric layer structure covers the first semiconductor die and the first insulating encapsulation. The conductor structure extends through the dielectric layer structure and contacts with the through silicon via.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: March 19, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hao-Yi Tsai, Cheng-Chieh Hsieh, Tsung-Hsien Chiang, Hui-Chun Chiang, Tzu-Sung Huang, Ming-Hung Tseng, Kris Lipu Chuang, Chung-Ming Weng, Tsung-Yuan Yu, Tzuan-Horng Liu
  • Publication number: 20240069606
    Abstract: A portable electronic device including a first body, a second body, and a hinge mechanism is provided. The second body is connected to the first body through the hinge mechanism, and the hinge mechanism has a basis axis located at the first body and a rotation axis located at a lower end of the second body. When the second body rotates with respect to the first body, the rotation axis slides along an arc shaped path with respect to the basis axis to increase or decrease a distance between the rotation axis and the basis axis and increase or decrease a distance between the lower end of the second body and a back end of the first body.
    Type: Application
    Filed: November 3, 2023
    Publication date: February 29, 2024
    Applicants: Acer Incorporated, Sinher Technology Inc.
    Inventors: Yi-Ta Huang, Cheng-Nan Ling, Chih-Chun Liu, Yung-Chang Chiang
  • Patent number: 11913084
    Abstract: A quenching fixture adapted to clamp at least one workpiece is provided. The quenching fixture includes a first positioning component and a second positioning component. Both of the first positioning component and the second positioning component have a positioning surface, multiple protrusions protruding from the positioning surface and a heat dissipation channel disposed between the protrusions in a staggered manner. The positioning surface of the first positioning component faces the positioning surface of the second positioning component, and the protrusions of the first positioning component overlap the protrusions of the second positioning component. The workpiece is clamped between the protrusions of the first positioning component and the protrusions of the second positioning component.
    Type: Grant
    Filed: September 16, 2021
    Date of Patent: February 27, 2024
    Assignee: Acer Incorporated
    Inventors: Yi-Ta Huang, Cheng-Nan Ling, Chih-Chun Liu
  • Patent number: 9617666
    Abstract: A coffee yarn and a fabric using the same are provided herein and the fabric includes a plurality of coffee yarns and a plurality of weaving yarns. The coffee yarns are arranged in parallel and each one of the coffee yarns includes a yarn body and multiple coffee particles. The yarn body has a wavy strip shape and includes a plurality of bending sections and a plurality of non-bending sections. The coffee particles are embedded within the yarn body. A density of the coffee particles in the bending sections is greater than a density of the coffee particles in the non-bending sections. The weaving yarns are arranged in parallel and the weaving yarns are alternately weaved with the coffee yarns.
    Type: Grant
    Filed: December 4, 2015
    Date of Patent: April 11, 2017
    Inventor: Cheng-Chun Huang
  • Publication number: 20170002485
    Abstract: A coffee yarn and a fabric using the same are provided herein and the fabric includes a plurality of coffee yarns and a plurality of weaving yarns. The coffee yarns are arranged in parallel and each one of the coffee yarns includes a yarn body and multiple coffee particles. The yarn body has a wavy strip shape and includes a plurality of bending sections and a plurality of non-bending sections. The coffee particles are embedded within the yarn body. A density of the coffee particles in the bending sections is greater than a density of the coffee particles in the non-bending sections. The weaving yarns are arranged in parallel and the weaving yarns are alternately weaved with the coffee yarns.
    Type: Application
    Filed: December 4, 2015
    Publication date: January 5, 2017
    Inventor: Cheng-Chun HUANG
  • Publication number: 20140215741
    Abstract: A bath ball has a ball body and a fixing string. The ball body is meshed and has two ball openings and a wire. The ball openings are each respectively formed in two sides of the ball body. The wire is flexible and stretchably sewed on the ball body along the wire, such that the ball body can be shrunk by the wire to create folds. The fixing string is bundled around the ball body to fix the ball body to keep the ball body from spreading. Therefore, the bath ball can be used to form dense bubbles by rubbing the mesh structure and the folds of the ball body.
    Type: Application
    Filed: February 6, 2013
    Publication date: August 7, 2014
    Inventor: Cheng-Chun HUANG
  • Patent number: 8546713
    Abstract: A push button structure includes a casing and a button body that are integrally formed by injection molding. The casing has an opening that extends through the surface of the casing. The button body is formed within the opening, and has an outer periphery spaced from the inner periphery of the opening and has an outer surface exposed on the surface of the casing and an inner surface extended by the curved lever. The curved lever has one end fixedly connected to an inner wall of the casing at a position adjacent to the opening such that the button body is movably positioned inside the opening. When the button body is pressed, the elasticity of the curved lever allows the button body to move toward the inside of the casing and thereby trigger an electronic switch in the casing.
    Type: Grant
    Filed: May 4, 2011
    Date of Patent: October 1, 2013
    Assignee: D-Link Corporation
    Inventor: Cheng-Chun Huang
  • Publication number: 20120234659
    Abstract: The present invention is to provide a push button structure including a casing and a button body that are integrally formed by injection molding. The casing has an opening that extends through the surface of the casing. The button body is formed within the opening, and has an outer periphery spaced from the inner periphery of the opening and has an outer surface exposed on the surface of the casing and an inner surface extended by the curved lever. The curved lever has one end fixedly connected to an inner wall of the casing at a position adjacent to the opening such that the button body is movably positioned inside the opening. When the button body is pressed, the elasticity of the curved lever allows the button body to move toward the inside of the casing and thereby trigger an electronic switch in the casing.
    Type: Application
    Filed: May 4, 2011
    Publication date: September 20, 2012
    Applicant: D-Link Corporation
    Inventor: Cheng-Chun Huang
  • Patent number: 8166780
    Abstract: A method of manufacturing a bathing-massage glove includes a preparing step, a pre-treating step, a knitting step and a forming step. The preparing step includes preparing a nylon segment with multiple nylon yarns and an environmental-regenerative segment with multiple polyethylene terephthalate bottles. The pre-treating step includes ruffling the nylon yarns of the nylon segment to form multiple winding nylon crepes and processing the polyethylene terephthalate bottles of the environmental-regenerative segment to form multiple environmental-regenerative crepes. The knitting step includes knitting the nylon crepes of the nylon segment and the environmental-regenerative crepes of the environmental-regenerative segment with a knitting speed ratio of 4:5. The forming step includes cutting and seaming a basketwork that is knit by the nylon crepes and the environmental-regenerative crepes to form the bathing-massage glove.
    Type: Grant
    Filed: December 29, 2010
    Date of Patent: May 1, 2012
    Inventor: Cheng-Chun Huang
  • Publication number: 20110167582
    Abstract: A method of manufacturing a bathing-massage glove includes a preparing step, a pre-treating step, a weaving step and a forming step. The preparing step includes preparing a nylon segment with multiple nylon yarns and an environmental-regenerative segment with multiple polyethylene terephthalate bottles. The pre-treating step includes ruffling the nylon yarns of the nylon segment to form multiple winding nylon crepes and processing the polyethylene terephthalate bottles of the environmental-regenerative segment to form multiple environmental-regenerative crepes. The weaving step includes weaving the nylon crepes of the nylon segment and the environmental-regenerative crepes of the environmental-regenerative segment with a weaving speed ratio of 4:5. The forming step includes cutting and seaming a basketwork that is woven by the nylon crepes and the environmental-regenerative crepes to form the bathing-massage glove.
    Type: Application
    Filed: December 29, 2010
    Publication date: July 14, 2011
    Inventor: Cheng-Chun HUANG
  • Patent number: 7114941
    Abstract: A hot embossing auto-leveling apparatus which has an air-floating spherical bearing between a lower mold and a base, placed in a depression on the base, with the base housing an air inlet and an air outlet. A hot embossing auto-leveling method, comprising the steps of (1) performing an upward and downward coupling movement of the lower and upper molds; (2) adjusting the lower mold against the upper mold using the air-floating spherical bearing; (3) fixing the lower mold by under pressure in an orientation parallel to the upper mold; (4) placing a molded part on the lower mold; (5) evacuating, heating and pressurizing a working chamber; (6) cooling; and (7) opening.
    Type: Grant
    Filed: March 20, 2003
    Date of Patent: October 3, 2006
    Assignee: Industrial Technology Research Institute
    Inventors: Jung Yan Huang, Chu Shu Tsai, Choung-Lii Chao, Chuan Kang Mu, Jauh Jung Yang, Cheng-Chun Huang, Ming Yueh Liu
  • Publication number: 20040119199
    Abstract: A hot embossing auto-leveling apparatus which has an air-floating spherical bearing between a lower mold and a base, placed in a depression on the base, with the base housing an air inlet and an air outlet. A hot embossing auto-leveling method, comprising the steps of (1) performing an upward and downward coupling movement of the lower and upper molds; (2) adjusting the lower mold against the upper mold using the air-floating spherical bearing; (3) fixing the lower mold by under pressure in an orientation parallel to the upper mold; (4) placing a molded part on the lower mold; (5) evacuating, heating and pressurizing a working chamber; (6) cooling; and (7) opening.
    Type: Application
    Filed: March 20, 2003
    Publication date: June 24, 2004
    Inventors: Jung Yan Huang, Chu Shu Tsai, Choung-Lii Chao, Chuan Kang Mu, Jauh Jung Yang, Cheng-Chun Huang, Ming Yueh Liu
  • Patent number: 6584250
    Abstract: An optical fiber alignment element using integrated micro ball lens includes a substrate and a plurality of V-shaped grooves or waveguides formed on the substrate by lithography and etching. The substrate surface is coated with a first polymer layer and a high transparency second polymer layer, then is processed through a lithography process and heating process to form at least a base pad and a spherical micro ball lens between the V-shaped grooves or waveguides. Then dispose optical fibers in the V-shaped grooves. And encase an upper cap over the micro ball lens, grooves, and optical fibers or waveguides. Through suitable configuration and positioning of the micro ball lens, grooves or waveguides, the micro ball lens may be aligned precisely between two sides of the optical fibers or waveguides. The process is simpler, more accurate, and may produce the optical fiber alignment element in an integrated and batch fashion.
    Type: Grant
    Filed: February 20, 2001
    Date of Patent: June 24, 2003
    Assignee: Industrial Technology Research Institute
    Inventors: Yuh-Sheng Lin, Cheng-Chun Huang, Ming-Yueh Liu, Jauh-Jung Yang, Chuan-Kang Mu, Ya-Ru Huang
  • Publication number: 20020114578
    Abstract: An optical fiber alignment element using integrated micro ball lens includes a substrate and a plurality of V-shaped grooves or waveguides formed on the substrate by lithography and etching. The substrate surface is coated with a first polymer layer and a high transparency second polymer layer, then is processed through a lithography process and heating process to form at least a base pad and a spherical micro ball lens between the V-shaped grooves or waveguides. Then dispose optical fibers in the V-shaped grooves. And encase an upper cap over the micro ball lens, grooves, and optical fibers or waveguides. Through suitable configuration and positioning of the micro ball lens, grooves or waveguides, the micro ball lens may be aligned precisely between two sides of the optical fibers or waveguides. The process is simpler, more accurate, and may produce the optical fiber alignment element in an integrated and batch fashion.
    Type: Application
    Filed: February 20, 2001
    Publication date: August 22, 2002
    Inventors: Yuh-Sheng Lin, Cheng-Chun Huang, Ming-Yueh Liu, Jauh-Jung Yang, Chuan-Kang Mu, Ya-Ru Huang