Abstract: A computing device and method starts applications via voice commands. The computing device records a sound input by a microphone of the computing device and sends the recorded sound input to a sound sensor of the computing device. Furthermore, the computing device reads a voice command by an embedded controller of the computing device from the sound sensor, in response to a determination that the recorded sound input matches a predetermined verbal statement of the voice command. The computing device notifies an operating system of the computing device to start the application corresponding to the voice command.

Abstract: An automatic detaching structure for a hook device includes a hook, a power unit, a tongue plate and an off-hook member. The power unit comprises a motor which is remote-controlled. The motor has a shaft. A first transmission transforming mechanism and a first gear are provided on the shaft. The first transmission transforming mechanism and the first gear mesh with a second transmission transforming mechanism and a second gear, respectively, to link a rotating lever and a transmission lever. The rotating lever links the tongue plate in an open status, while transmission wheels on the transmission lever pull the off-hook member to detach a rope of a cargo from the hook.

Abstract: An automatic detaching structure for a hook device includes a hook, a power unit, a tongue plate and an off-hook member. The power unit comprises a motor which is remote-controlled. The motor has a shaft. A first transmission transforming mechanism and a first gear are provided on the shaft. The first transmission transforming mechanism and the first gear mesh with a second transmission transforming mechanism and a second gear, respectively, to link a rotating lever and a transmission lever. The rotating lever links the tongue plate in an open status, while transmission wheels on the transmission lever pull the off-hook member to detach a rope of a cargo from the hook.

Abstract: A method for reducing electrical noise inside a ball grid array package for installing capacitors between a plurality of power pads and ground pads on a top side of a substrate of the ball grid array package coats solder paste on the plurality of power pads and ground pads, coats adhesive glue beneath the plurality of capacitors, fixes the plurality of capacitors on the power pads and ground pads with the adhesive glue and solder paste, and solidifies the adhesive glue in a reflow soldering stove.