Abstract: The instant disclosure relates to a low-profile transformer and methods of providing the transformer. The transformer in accordance with the present invention comprises a core unit having a pair of opposingly arranged base portions, an inserting portion, and at least a primary coil and a secondary coil wound around the inserting portion. The top-facing edge of the lateral portions is chamfered to enable tighter fitment into a receiving housing, such as a light tube. The transformer may also include a frame unit having a rounded flange that conforms to the shape of the wound coil. The instant disclosure further provides a method for providing a low-profile transformer that is particularly suitable for adapting in a tubular light device. The physical features and dimension of the transformer may be determined by methods that utilize the analysis of a characteristic equation in accordance with specific operating requirements.

Abstract: A display including a supporting layer, a flexible layer and a display structure is provided. The display structure has a top side and a bottom side which are opposite to each other. One of the supporting layer and the flexible layer is disposed at the bottom side of the display structure, and the other one of the supporting layer and the flexible layer is disposed at the top side or the bottom side of the display structure. When the supporting layer and the flexible layer are both disposed at the bottom side of the display structure, the flexible layer is located between the supporting layer and the display structure.

Abstract: An LED light emitter with heat sink holder and a method for manufacturing it are both disclosed. The LED light emitter with heat sink holder includes a heat sink holder and at least an LED chip. The heat sink holder is made of high thermal conductivity coefficient, and includes a reflecting mirror having a central portion and a reflecting portion surrounding the central portion. A normal of a top surface of the reflecting portion forms an acute angle relative to a normal of a top surface of the central portion. The LED chip is unitarily connected with a top surface of the central portion, and an electrode unit connecting with and Ohmic contacting the light emitting film for supplying power for the light emitting film. The LED light emitter with heat sink holder improves heat dissipation and working duration.

Abstract: A flexible light emitting module includes: a flexible substrate; and a flexible multi-layer structure formed on the flexible substrate, and including a plurality of light emitting bare chips that are disposed on the same level and that cooperatively define a spacing thereamong, a dielectric material that fills the spacing and that cooperates with the bare chips to form a light emitting layer, and first and second conductive layers sandwiching and adapted to connect the light emitting layer to a power source.

Abstract: An LED light emitter with heat sink holder and a method for manufacturing it are both disclosed. The LED light emitter with heat sink holder includes a heat sink holder and at least an LED chip. The heat sink holder is made of high thermal conductivity coefficient, and includes a reflecting mirror having a central portion and a reflecting portion surrounding the central portion. A normal of a top surface of the reflecting portion forms an acute angle relative to a normal of a top surface of the central portion. The LED chip is unitarily connected with a top surface of the central portion, and an electrode unit connecting with and Ohmic contacting the light emitting film for supplying power for the light emitting film. The LED light emitter with heat sink holder improves heat dissipation and working duration.

Abstract: A method for making a light emitting device includes: (a) preparing a chip-mounting board having a conductive surface; (b) mounting a plurality of vertical-feedthrough-LED chips on the conductive surface of the chip-mounting board; (c) forming a photoresist layer that cooperates with the chip-mounting board to enclose the vertical-feedthrough-LED chips; (d) patterning the photoresist layer by photolithography techniques to form a plurality of holes in the photoresist layer in such a manner that each of the holes exposes an electrode of a respective one of the vertical-feedthrough-LED chips; and (e) forming a conductive layer that covers the patterned photoresist layer and the vertical-feedthrough-LED chips.

Abstract: A flexible light emitting module includes: a flexible substrate; and a flexible multi-layer structure formed on the flexible substrate, and including a plurality of light emitting bare chips that are disposed on the same level and that cooperatively define a spacing thereamong, a dielectric material that fills the spacing and that cooperates with the bare chips to form a light emitting layer, and first and second conductive layers sandwiching and adapted to connect the light emitting layer to a power source.