Abstract: A circuit board structure includes a first sub-circuit board, a second sub-circuit board, and a third sub-circuit board. The first sub-circuit board has an upper surface and a lower surface opposite to each other, and includes at least one first conductive through hole. The second sub-circuit board is disposed on the upper surface of the first sub-circuit board and includes at least one second conductive through hole. The third sub-circuit board is disposed on the lower surface of the first sub-circuit board and includes at least one third conductive through hole. At least two of the first conductive through hole, the second conductive through hole, and the third conductive through hole are alternately arranged in an axial direction perpendicular to an extending direction of the first sub-circuit board. The first, second and third sub-circuit boards are electrically connected to one another.

Abstract: A method is provided for forming an integrated circuit (IC) chip package structure. The method includes providing a substrate for an interposer, and forming a conductive interconnect structure in and on the substrate for connecting a group of selected IC dies. The method includes forming warpage-reducing trenches in non-routing regions of the interposer, wherein the warpage-reducing trenches are sized and positioned based on a warpage characteristic to reduce the warpage of the chip package structure. The method also includes depositing a warpage-relief material in the warpage-reducing trenches according to the warpage characteristic to reduce the warpage of the chip package structure, and bonding the group of selected IC dies to the interposer to form a chip package structure.

Abstract: A pump health analysis method and a pump health analysis device using the same are provided. A standard vibration curve of a standard pump is obtained. The standard vibration curve is converted from a time domain to a frequency domain to obtain a first frequency distribution curve. A sample vibration curve of a sample pump is obtained. The sample vibration curve is converted from the time domain to the frequency domain to obtain a second frequency distribution curve. The first frequency distribution curve is compared with the second frequency distribution curve by using a cosine similarity algorithm to obtain a health index of the sample pump.

Abstract: A training device and a training method for reducing hypertonic are disclosed. The training device includes a base, a driving circuit, two pedals, a control circuit, and a switch circuit. The driving circuit is fixed on the base. Each of the two pedals is coupled to the base. The driving circuit drives each of the two pedals to swing repeatedly between a first position and a second position relative to the base. When the control circuit executes a training program, the control circuit actuates the driving circuit.

Abstract: A plantar pressure sensing system is located at a sole of shoe. The plantar pressure sensing system includes a first layer, a second layer a plurality of sensor, a plurality of convex portions, a plurality of connection portions, a processor and a storage. The processor is coupled with the storage and configured to be connected with the plurality of sensors. The plurality of sensors are configured to form the first layer. The plurality of convex portions and the plurality of connection portions are configured to form the second layer. Overall, the plantar pressure sensing system is able to detect pressure with the sensors by setting the alignment of the convex portions, thereby obtaining a more accurate pressure(s) reading from the sole of shoe. The data validity of the plantar pressure sensing system is improved.

Abstract: A training device and a training method for reducing hypertonic are disclosed. The training device includes a base, a driving circuit, two pedals, a control circuit, and a switch circuit. The driving circuit is fixed on the base. Each of the two pedals is coupled to the base. The driving circuit drives each of the two pedals to swing repeatedly between a first position and a second position relative to the base. When the control circuit executes a training program, the control circuit actuates the driving circuit.

Abstract: A plantar pressure sensing system is located at a sole of shoe. The plantar pressure sensing system comprises at least a first layer and at least a second layer. Furthermore, the plantar pressure sensing system includes: a plurality of sensor, a plurality of convex portions, a plurality of connection portions, at least a processor and at least a storage. The processor is coupled with the storage and configured to be connected with the plurality of sensors. The plurality of sensors are configured to form the first layer. The plurality of convex portions and the plurality of connection portions are configured to form the second layer. Overall, the plantar pressure sensing system is able to detect pressure with the sensors by setting the alignment of the convex portions, thereby obtaining a more accurate pressure(s) reading from the sole of shoe. The data validity of the plantar pressure sensing system is improved.

Abstract: An exemplary signal processing apparatus includes a signal transmission port, a first signal processing circuit, a second signal processing circuit, and a control circuit. The signal transmission port is shared between a first signal processing operation and a second signal processing operation. The first signal processing circuit performs the first signal processing operation, wherein when the signal processing apparatus operates, the first signal processing circuit is not required to be consistently enabled to use the signal transmission port for signal transmission. The second signal processing circuit performs the second signal processing operation, wherein the signal transmission port is not always required to carry out signal transmission each time the second signal processing circuit is enabled to perform the second signal processing operation. The control circuit selectively enables the first signal processing circuit or the second signal processing circuit.

Abstract: Manufacturing an optical module includes providing a frame, attaching a light-emitting diode chip and a sensor chip to the frame, and forming overcoats on the light-emitting diode chip and the sensor chip. Each of the overcoats includes a lens. The overcoats can prevent internal chips from being damaged and suffering dust contamination during manufacture.

Abstract: An image capturing device is disclosed. The image capturing device includes: a light-emitting component for generating a light ray; a light-guiding component for providing a first straight light-guiding path to guide the light ray generated by the light-emitting component toward a surface; and a sensor for sensing the light ray reflected by the surface to detect a movement of the image capturing device on the surface.

Abstract: An optical module includes a substrate, a chip, a reflector and a lens. The chip is disposed on the substrate for emitting light. The reflector is disposed on the substrate for reflecting light emitted by the chip. The lens is formed on the substrate using resin. The lens covers the chip and is not in contact with the reflector.

Abstract: Manufacturing an optical module includes providing a frame, attaching a light-emitting diode chip and a sensor chip to the frame, and forming overcoats on the light-emitting diode chip and the sensor chip. Each of the overcoats includes a lens. The overcoats can prevent internal chips from being damaged and suffering dust contamination during manufacture.

Abstract: An optical module includes a frame, a light source module positioned at a first end of the frame, and a sensor module positioned on the frame for sensing light emitted from the light source module and reflected from a surface. The light source module includes a light source covered by a first protection element, part of the first protection element forming a lens. The sensor module includes a sensor covered by a second protection element, part of the second protection element forming a lens for focusing light reflected from the surface.

Abstract: An image capturing device is disclosed. The image capturing device includes: a light-emitting component for generating a light ray; a light-guiding component for providing a first straight light-guiding path to guide the light ray generated by the light-emitting component toward a surface; and a sensor for sensing the light ray reflected by the surface to detect a movement of the image capturing device on the surface.

Abstract: A control system with computer based host includes a first device, a computer based host is electrically connected to the first device. And a second device is electrically connected to the computer based host, wherein the first device has a control right to utilize said second device.

Abstract: An optical device includes a conductive frame, a sensor member mounted on a lower surface of the conductive frame, an aperture member covering the sensor member and having an aperture corresponding to the sensor member, a lighting member arranged on an extension portion of the conductive frame; and a protection member packaging the lighting member and the aperture member onto the conductive frame. The protection member is transparent and made integrally in one piece with the conductive frame, and the protection member has a light-condensing portion protruded therefrom and relative to the aperture and the sensor member sequentially. The lighting member provides light onto an object, which is disposed beneath the protection member, and the light is reflected to the light-condensing portion and further incident into the sensor member via the aperture member.