Patents by Inventor Cheng-Feng Chang

Cheng-Feng Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240176353
    Abstract: The present invention provides a method of alerting to stationary objects for vehicle. When a vehicle moves at a first speed, an optical scanning device, an infrared image extraction device, and an image extraction device extract a first optical scanning image, a first infrared image, and a first ambient image of the ambiance on one side of the vehicle. According to the fusion algorithm and the optical flow method, the first obstacle information of the first obstacle in the first image will be given. According to the location information of the first obstacle, the vehicle computer judges and generates an alert message when the relative distance is smaller than a distance threshold value and the obstacle volume is greater than a volume threshold value.
    Type: Application
    Filed: July 6, 2023
    Publication date: May 30, 2024
    Inventors: TSUNG-HAN LEE, JINN-FENG JIANG, SHIH-CHUN HSU, TSU-KUN CHANG, CHENG-TAI LEI, HUNG-YUAN WEI
  • Patent number: 11994736
    Abstract: An imaging lens assembly has an optical axis and includes an annular structure located on an object side of the imaging lens assembly and surrounds the optical axis. The annular structure is located on an object side of the imaging lens assembly, surrounds the optical axis, and includes a first through hole, a second through hole, a first frustum surface, a second frustum surface and a third frustum surface. The first through hole is disposed on an object side of the annular structure, and the second through hole is disposed on an image side of the first through hole. The first frustum surface is disposed on the image side of the first through hole. The second frustum surface is disposed on an object side of the second through hole. The third frustum surface is disposed on an image side of the second through hole.
    Type: Grant
    Filed: January 8, 2021
    Date of Patent: May 28, 2024
    Assignee: LARGAN PRECISION CO., LTD.
    Inventors: Yu-Chen Lai, Ming-Ta Chou, Cheng-Feng Lin, Ming-Shun Chang
  • Publication number: 20240170343
    Abstract: A semiconductor device includes a first set of nanostructures stacked over a substrate in a vertical direction, and each of the first set of nanostructures includes a first end portion and a second end portion, and a first middle portion laterally between the first end portion and the second end portion. The first end portion and the second end portion are thicker than the first middle portion. The semiconductor device also includes a first plurality of semiconductor capping layers around the first middle portions of the first set of nanostructures, and a gate structure around the first plurality of semiconductor capping layers.
    Type: Application
    Filed: January 24, 2024
    Publication date: May 23, 2024
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Sai-Hooi YEONG, Bo-Feng YOUNG, Chi-On CHUI, Chih-Chieh YEH, Cheng-Hsien WU, Chih-Sheng CHANG, Tzu-Chiang CHEN, I-Sheng CHEN
  • Patent number: 11972951
    Abstract: The present disclosure relates to a method for fabricating a semiconductor structure. The method includes providing a substrate with a gate structure, an insulating structure over the gate structure, and a S/D region; depositing a titanium silicide layer over the S/D region with a first chemical vapor deposition (CVD) process. The first CVD process includes a first hydrogen gas flow. The method also includes depositing a titanium nitride layer over the insulating structure with a second CVD process. The second CVD process includes a second hydrogen gas flow. The first and second CVD processes are performed in a single reaction chamber and a flow rate of the first hydrogen gas flow is higher than a flow rate of the second hydrogen gas flow.
    Type: Grant
    Filed: April 4, 2022
    Date of Patent: April 30, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Cheng-Wei Chang, Kao-Feng Lin, Min-Hsiu Hung, Yi-Hsiang Chao, Huang-Yi Huang, Yu-Ting Lin
  • Patent number: 11923252
    Abstract: A semiconductor device includes a first set of nanostructures stacked over a substrate in a vertical direction, and each of the first set of nanostructures includes a first end portion and a second end portion, and a first middle portion laterally between the first end portion and the second end portion. The first end portion and the second end portion are thicker than the first middle portion. The semiconductor device also includes a first plurality of semiconductor capping layers around the first middle portions of the first set of nanostructures, and a gate structure around the first plurality of semiconductor capping layers.
    Type: Grant
    Filed: January 27, 2021
    Date of Patent: March 5, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Sai-Hooi Yeong, Bo-Feng Young, Chi-On Chui, Chih-Chieh Yeh, Cheng-Hsien Wu, Chih-Sheng Chang, Tzu-Chiang Chen, I-Sheng Chen
  • Publication number: 20240074337
    Abstract: A memory device includes a substrate, a bottom electrode disposed over the substrate, a top electrode disposed over the bottom electrode, and a phase change layer disposed between the top electrode and bottom electrode. The phase change layer includes a GeSbTe material that contains a Ge content of about 20 at % or less, a Sb content of about 30 at % or more, and a Te content of about 40 at % at or more.
    Type: Application
    Filed: August 26, 2022
    Publication date: February 29, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hengyuan Lee, Cheng-Chun Chang, Chen-Feng Hsu, Tung-Ying Lee, Xinyu BAO
  • Patent number: 7258737
    Abstract: A method for recycling concrete waste includes the steps of: a) heating the concrete waste to provide a measure of fragility to the concrete waste; b) milling and sieving the heated concrete waste to separate coarse aggregate from the concrete waste; and c) milling and sieving a remaining portion of the concrete waste remaining after separation of the coarse aggregate to separate the remaining portion of the concrete waste into a cement-containing fraction and fine aggregate.
    Type: Grant
    Filed: May 17, 2005
    Date of Patent: August 21, 2007
    Inventor: Cheng-Feng Chang
  • Patent number: 7163581
    Abstract: A method for making a regenerated soil material for the production of a structural unit includes the steps of: a) obtaining a raw soil material containing aluminum and silicon from a natural source; b) adding an active mineral containing aluminum and silicon to the raw soil material; c) cleaving the raw soil material and the active mineral in a base so as to dissociate aluminum monomer and silicon monomer out of the mixture of the raw soil material and the active mineral; and d) polymerizing the aluminum monomer and the silicon monomer so as to form silicon-oxy tetrahedron and aluminum-oxy tetrahedron in the mixture.
    Type: Grant
    Filed: February 23, 2005
    Date of Patent: January 16, 2007
    Inventor: Cheng-Feng Chang
  • Publication number: 20060260514
    Abstract: A method for recycling concrete waste includes the steps of: a) heating the concrete waste to provide a measure of fragility to the concrete waste; b) milling and sieving the heated concrete waste to separate coarse aggregate from the concrete waste; and c) milling and sieving a remaining portion of the concrete waste remaining after separation of the coarse aggregate to separate the remaining portion of the concrete waste into a cement-containing fraction and fine aggregate.
    Type: Application
    Filed: May 17, 2005
    Publication date: November 23, 2006
    Inventor: Cheng-Feng Chang
  • Publication number: 20060185559
    Abstract: A method for making a regenerated soil material for the production of a structural unit includes the steps of: a) obtaining a raw soil material containing aluminum and silicon from a natural source; b) adding an active mineral containing aluminum and silicon to the raw soil material; c) cleaving the raw soil material and the active mineral in a base so as to dissociate aluminum monomer and silicon monomer out of the mixture of the raw soil material and the active mineral; and d) polymerizing the aluminum monomer and the silicon monomer so as to form silicon-oxy tetrahedron and aluminum-oxy tetrahedron in the mixture.
    Type: Application
    Filed: February 23, 2005
    Publication date: August 24, 2006
    Inventor: Cheng-Feng Chang
  • Patent number: 7069677
    Abstract: A method for producing a ready-mix soil material includes the steps of: (a) crushing earth material excavated from a work site; (b) sieving the earth material after crushing so as to obtain raw soil material; and (c) mixing metered amounts of the raw soil material and at least one strength-enhancing additive in an automated manner so as to obtain the ready-mix soil material.
    Type: Grant
    Filed: October 7, 2003
    Date of Patent: July 4, 2006
    Inventor: Cheng-Feng Chang
  • Publication number: 20050077058
    Abstract: A method for producing a ready-mix soil material includes the steps of: (a) crushing earth material excavated from a work site; (b) sieving the earth material after crushing so as to obtain raw soil material; and (c) mixing metered amounts of the raw soil material and at least one strength-enhancing additive in an automated manner so as to obtain the ready-mix soil material.
    Type: Application
    Filed: October 7, 2003
    Publication date: April 14, 2005
    Inventor: Cheng-Feng Chang
  • Patent number: 6247094
    Abstract: The present invention provides an improved cache memory architecture with way prediction. The improved architecture entails placing the address tag array of a cache memory on the central processing unit core (i.e. the microprocessor chip), while the cache data array remains off the microprocessor chip. In addition, a way predictor is provided in conjunction with the improved memory cache architecture to increase the overall performance of the cache memory system.
    Type: Grant
    Filed: December 22, 1997
    Date of Patent: June 12, 2001
    Assignee: Intel Corporation
    Inventors: Harsh Kumar, Gunjeet D. Baweja, Cheng-Feng Chang, Tim W. Chan
  • Patent number: 6237064
    Abstract: The present invention provides a method and a data processing system for accessing a memory of a data processing system, the data processing system including a first and at least a second level memory for storing information. The method includes issuing a memory request to the first level memory, and issuing the memory request to the second level memory at substantially the same time the memory request is issued to the first level memory.
    Type: Grant
    Filed: February 23, 1998
    Date of Patent: May 22, 2001
    Assignee: Intel Corporation
    Inventors: Harsh Kumar, Gunjeet D. Baweja, Cheng-Feng Chang