Abstract: An imaging lens set includes three plastic lens elements, which are a first lens element, a second lens element and a third lens element, and a light blocking sheet. The first lens element includes a first flat abutting portion and a first conical surface. The second lens element includes a second flat abutting portion, a second conical surface, a fourth flat abutting portion and a fourth conical surface. The third lens element includes a third flat abutting portion and a third conical surface. The first flat abutting portion is abutted with the second flat abutting portion, the first conical surface contacts with the second conical surface, and the third conical surface contacts with the fourth conical surface. The light blocking sheet is abutted with the third flat abutting portion and the fourth flat abutting portion, respectively.

Abstract: An imaging lens system has an optical axis and an image surface through which the optical axis passes. The imaging lens system includes a plastic lens barrel surrounding the optical axis. The plastic lens barrel includes an image-side portion and an object-side aperture through which the optical axis passes, and the image-side portion is located between the image surface and the object-side aperture. The image-side portion includes a protrusive structure surrounding the optical axis and extending towards the image surface. The protrusive structure has an inner surface facing the optical axis, an outer surface disposed opposite to the inner surface and located farther away from the optical axis than the inner surface and a reflection-reducing surface extending towards the image surface and connected to and located between the inner surface and the outer surface. The protrusive structure includes a reflection-reducing structure disposed on the reflection-reducing surface.

Abstract: In a method, a wafer is bonded to a first carrier. The wafer includes a semiconductor substrate, and a first plurality of through-vias extending into the semiconductor substrate. The method further includes bonding a plurality of chips over the wafer, with gaps located between the plurality of chips, performing a gap-filling process to form gap-filling regions in the gaps, bonding a second carrier onto the plurality of chips and the gap-filling regions, de-bonding the first carrier from the wafer, and forming electrical connectors electrically connecting to conductive features in the wafer. The electrical connectors are electrically connected to the plurality of chips through the first plurality of through-vias.

Abstract: An imaging lens assembly includes a plastic barrel and a lens set, and the lens set is disposed in the plastic barrel. The plastic barrel includes an object-side outer surface, a first inner surface and a second inner surface. The lens set has an optical axis, and includes, in order from an object side to an image side thereof, at least one plastic lens element and a spacer. A light-absorbing coating is disposed on the plastic lens element. The spacer includes an object-side connecting surface and a relative surface. When the object-side connecting surface is connected with a neighboring object-side optical element, the relative surface is out of touch with the neighboring object-side optical element. There is an overlap between the second inner surface and the relative surface along a direction parallel to the optical axis.

Abstract: A plastic barrel includes an object-end portion, an image-end portion, a tube portion and a plurality of wedge structures. The object-end portion includes an outer object-end surface, an object-end hole and an inner annular object-end surface. The image-end portion includes an outer image-end surface, an image-end opening and an inner annular image-end surface. The tube portion connects the object-end portion and the image-end portion, and includes a plurality of inclined surfaces. The wedge structures are disposed on at least one surface of the inner annular object-end surface, the inner annular image-end surface and the inclined surfaces, wherein the wedge structures are regularly arranged around the central axis, and each of the wedge structures includes an acute end and a tapered section. The tapered section connects the surface, which the wedge structure is disposed on, and the acute end.

Abstract: An operation method of an optical sensor comprising receiving an ambient light by a light-sensing device. Record a signal generated by the light-sensing device after receiving the ambient light by a operation unit. A flicker frequency of the ambient light is determined by the operation unit. A signal operation parameter is set according to the flicker frequency, and the signal operation parameter comprises a sampling time difference, which is the starting time interval of two corresponding integration time periods of a plurality of integration time periods. Furthermore, the light-sensing device and the operation unit start the calculation of the intensity of the ambient light, so that the flicker component of an ambient light source may be eliminated from the light sensing result to produce a stable sensing result.

Abstract: A method for detecting apparent defects in images of products acquires an original image of the product. Defects apparent in the original image are automatically detected by an automatic optical detection apparatus. When the original image comprises at least one apparent defect, the original image is cut into at least one partial image centered on the at least one apparent defect. Each partial image contains one defect. By determining whether the at least one partial image indicates a real defect or a false or ghost defect, a result of desired image (for further analysis), or undesired image (for discarding) is output. The original image is deemed a desired image or an undesired image based on the result. A defect detection system applying the method is also disclosed.

Abstract: A plastic barrel, which surrounds a central axis, includes an object-side portion and a tubular portion. The object-side portion includes an object-side opening and a reverse inclined structure. The reverse inclined structure surrounds the object-side opening and includes a reverse inclined surface and at least one annular concave structure. The at least one annular concave structure is disposed on an object side of the reverse inclined surface and recessed from the object-side opening along a direction away from the central axis, wherein a sectional surface of the at least one annular concave structure passing through the central axis includes a valley point and two concave ends, and the two concave ends are disposed on an object side and an image side of the valley point, respectively. The tubular portion is connected to the object-side portion and extends to the image side.

Abstract: An imaging lens assembly module has an optical axis, and includes at least one plastic lens element, a carrier element and a light absorbing layer. The plastic lens element, in order from a center to a peripheral region thereof, includes an optical effective portion and a peripheral portion. A side of the peripheral portion includes a plurality of step structures interposed between the side of the peripheral portion and a same side of the optical effective portion. The carrier element defines an inner space for disposing the plastic lens element, and includes a tip end minimal opening and a plurality of annular inner walls. The light absorbing layer is disposed on the peripheral portion of the plastic lens element, and the step structures and the at least one of the annular inner walls facing towards the plastic lens element.

Abstract: An imaging lens system has an optical axis and an image surface through which the optical axis passes. The imaging lens system includes a plastic lens barrel surrounding the optical axis. The plastic lens barrel includes an image-side portion and an object-side aperture through which the optical axis passes, and the image-side portion is located between the image surface and the object-side aperture. The image-side portion includes a protrusive structure surrounding the optical axis and extending towards the image surface. The protrusive structure has an inner surface facing the optical axis, an outer surface disposed opposite to the inner surface and located farther away from the optical axis than the inner surface and a reflection-reducing surface extending towards the image surface and connected to and located between the inner surface and the outer surface. The protrusive structure includes a reflection-reducing structure disposed on the reflection-reducing surface.

Abstract: An imaging lens assembly includes a plastic barrel and a lens set, and the lens set is disposed in the plastic barrel. The plastic barrel includes an object-side outer surface, a first inner surface and a second inner surface. The lens set has an optical axis, and includes, in order from an object side to an image side thereof, at least one plastic lens element and a spacer. A light-absorbing coating is disposed on the plastic lens element. The spacer includes an object-side connecting surface and a relative surface. When the object-side connecting surface is connected with a neighboring object-side optical element, the relative surface is out of touch with the neighboring object-side optical element. There is an overlap between the second inner surface and the relative surface along a direction parallel to the optical axis.

Abstract: A pressure sensor assembly includes an external housing unit; a sensor unit received within the external housing unit, the external housing unit has an external surface including a mounting surface; a sensing element mounted within the sensor unit and including a pressure-sensing surface; a substrate upon which the mounting surface is mounted; an air passage to enable air to impinge on the sensing element; and a filling passage, separate from the air flow passage, for the introduction of an encapsulation material onto the sensor unit, during assembly. The encapsulation material covers at least a part of the external surface of the sensor unit but does not cover the pressure-sensing surface of the sensing element which remains directly exposed to air within the air passage.

Abstract: In a method, a wafer is bonded to a first carrier. The wafer includes a semiconductor substrate, and a first plurality of through-vias extending into the semiconductor substrate. The method further includes bonding a plurality of chips over the wafer, with gaps located between the plurality of chips, performing a gap-filling process to form gap-filling regions in the gaps, bonding a second carrier onto the plurality of chips and the gap-filling regions, de-bonding the first carrier from the wafer, and forming electrical connectors electrically connecting to conductive features in the wafer. The electrical connectors are electrically connected to the plurality of chips through the first plurality of through-vias.

Abstract: A method and a system for switching multi-function modes applied in an electronic device having a plurality of hardware module functions, and includes receiving input information from a user of the electronic device; obtaining status information of the electronic device; and switching the electronic device to one of the multi-function modes according to the input information and the status information, each of the multi-function modes corresponds to at least one of the plurality of hardware module functions.

Abstract: A welding fixture and a locking method are provided. The welding fixture includes a base and workpiece positioning dies; a top pressing plate slidably connected to the base in a pressing lifting direction is configured to press top surfaces of workpieces placed on the workpiece positioning dies; welding avoidance grooves are disposed on the top pressing plate, and each of the welding avoidance grooves is located above a corresponding one of the workpiece positioning dies; and a side-pressing mechanism disposed on the base is configured to perform and cancel lateral pressing of the workpieces. The welding fixture has advantages: the side-pressing mechanism can achieve tight pressing of sides of multiple workpieces at the same time, and the side-pressing mechanism can also cancel the tight pressing of the sides of the multiple workpieces after welding at the same time, which can greatly improve clamping efficiency and efficiency of unloading the workpieces.

Abstract: Guide holders for engaging a motherboard sled with an input-output sled stacked thereon within an electronic chassis, are disclosed. The electronic chassis includes a motherboard sled having a housing having a first sidewall and a second sidewall opposite to the first sidewall, a first guide holder and a second guide holder. The first guide holder is coupled to the first sidewall and includes a first plurality of slots for directing motion of a first plurality of guide pins of an input-output sled in a predetermined direction. The second guide holder is coupled to the second sidewall and includes a second plurality of slots for directing motion of a second plurality of guide pins of the input-output sled in the predetermined direction. The motion of the first plurality of guide pins and the second plurality of guide pins, upon completion, locks the input-output sled to the motherboard sled.

Abstract: Electronic design automation (EDA) of the present disclosure logically places components of the electronic circuitry onto an electronic design real estate to determine an architectural design placement for the electronic circuitry. The EDA evaluates a metaheuristic algorithm starting with an initial placement of components of the electronic circuitry onto the electronic design real estate to provide multiple possible placements for placing these components of the electronic circuitry onto the electronic design real estate. The EDA utilizes the multiple possible placements of the metaheuristic algorithm to train one or more probabilistic functions of a model-based reinforcement learning (RL) algorithm. The EDA evaluates the model-based RL algorithm utilizing the one or more probabilistic functions to determine the architectural design placement.

Abstract: A communication system includes a wireless access point and electronic devices. The wireless access point is configured to transmit a packet having sleep permission map information. The electronic devices are configured to be connected with the wireless access point via a channel and receive the packet and operate in a power saving mode. Each of the electronic devices is configured to be selectively prohibited from exchanging data with the wireless access point via the channel during a predetermined interval according to the sleep permission map information.

Abstract: This application provides a method of detecting printing defects. The method includes obtaining a first image of each character in a reference image. A third image of each character is obtained based on the first image of each character, a fourth image of each character is obtained based on a second image of each character obtained from an image to be detected. Once a fifth image of each character is obtained based on the third image of each character, a sixth image of each character is obtained according to the fourth image and the fifth image of each character, a detection result of each character in the image to be detected is determined according to the fifth image and the sixth image of the each character.

Abstract: A method of detecting misprints obtains a reference image of perfectly-formed characters and a test image showing the same characters. First image processing is performed on the reference image to obtain a first image, and first image processing is performed on the test image to obtain a second image. A second image processing is performed on the first image to obtain a first outline image of each of first characters in the reference image, and the second image processing is performed on the second image to obtain a second outline image of each of second characters in the test image. A corresponding first outline image is determined for the second outline image. A similarity between the corresponding first outline image and the second outline image is calculated. Accordingly, a detection result of the second outline image is determined. The method can detect character flaw accurately.