Abstract: A smart acoustic information recognition-based welded weld impact quality determination method and system, comprising: controlling a tip of an ultrasonic impact gun (1) to perform impact treatment on a welded weld with different treatment pressures, treatment speeds, treatment angles and impact frequencies, obtaining acoustic signals during the impact treatment, calculating feature values of the acoustic signals, and constructing an acoustic signal sample set including various stress conditions; marking the acoustic signal sample set according to impact treatment quality assessment results for the welded weld; establishing a multi-weight neural network model, and using the marked acoustic signal sample set to train the multi-weight neural network model; obtaining feature values of welded weld impact treatment acoustic signals to be determined, inputting the feature values into the trained multi-weight neural network model, and outputting determination results for welded weld impact treatment quality to be det

Abstract: The present disclosure provides a formula of a remover reagent for a cured silicone sealant and a method using the same. The remover reagent is prepared from an acid catalyst and a solvent each having a high boiling point and a high flash point. The acid catalyst is benzenesulfonic acid or alkylbenzenesulfonic acid. The solvent is mineral oil and/or silicone oil. The cured silicone sealant is first soaked with the remover reagent for 30 to 120 min, and then baked at a high temperature of 80 to 120° C. for 10 min or above into debris or powder, whereby the cured silicone sealant with a thickness of 10 mm or above can be removed. Moreover, the remover reagent has the advantages of readily available raw materials, high safety, environmentally friendliness, convenient preparation and good sealant removal effect, and thus, has good application prospects.

Abstract: In an embodiment, an electronic device includes a display and processing circuitry. The display includes a plurality of pixels arranged in a plurality of rows, wherein a first grouping of the plurality of rows displays image content during a first portion of an image frame, and wherein a second grouping of the plurality of rows displays image content during a second portion of the image frame. The processing circuitry is operatively coupled to the display and determines a velocity associated with the image content displayed by the first grouping of the plurality of rows moving across the display and adjusts a position of the image content displayed by the second grouping of the plurality of rows during the second portion of the image frame.

Abstract: An inspection system for inspecting a semiconductor wafer. The inspection system comprises an illumination setup for supplying broadband illumination. The broadband illumination can be of different contrasts, for example brightfield and darkfield broadband illumination. The inspection system further comprises a first image capture device and a second image capture device, each configured for receiving broadband illumination to capture images of the semiconductor wafer while the semiconductor wafer is in motion. The system comprises a number of tube lenses for enabling collimation of the broadband illumination. The system also comprises a stabilizing mechanism and an objective lens assembly. The system further comprises a thin line illumination emitter and a third image capture device for receiving thin line illumination to thereby capture three-dimensional images of the semiconductor wafer.

Abstract: An inspection system for inspecting a semiconductor wafer. The inspection system comprises an illumination setup for supplying broadband illumination. The broadband illumination can be of different contrasts, for example brightfield and darkfield broadband illumination. The inspection system further comprises a first image capture device and a second image capture device, each configured for receiving broadband illumination to capture images of the semiconductor wafer while the semiconductor wafer is in motion. The system comprises a number of tube lenses for enabling collimation of the broadband illumination. The system also comprises a stabilizing mechanism and an objective lens assembly. The system further comprises a thin line illumination emitter and a third image capture device for receiving thin line illumination to thereby capture three-dimensional images of the semiconductor wafer.

Abstract: An inspection system for inspecting a semiconductor wafer. The inspection system comprises an illumination setup for supplying broadband illumination. The broadband illumination can be of different contrasts, for example brightfield and darkfield broadband illumination. The inspection system further comprises a first image capture device and a second image capture device, each configured for receiving broadband illumination to capture images of the semiconductor wafer while the semiconductor wafer is in motion. The system comprises a number of tube lenses for enabling collimation of the broadband illumination. The system also comprises a stabilizing mechanism and an objective lens assembly. The system further comprises a thin line illumination emitter and a third image capture device for receiving thin line illumination to thereby capture three-dimensional images of the semiconductor wafer.

Abstract: The present disclosure provides a system and method to convert three-dimensional data into a two-dimensional height displacement map and extract the three-dimensional features and dimensions of a three-dimensional object using a two-dimensional image processing technique. An illumination source of the system scans across the workspace using a line laser and generates a two-dimensional height displacement map of the workspace. The individual pixel location represents an actual workspace sampled location. The pixel gray scale intensity represents the Z displacement height at the pixel location. A processing device processes the features and dimensions within two-dimensional image as a gray scale using two-dimensional image processing such as pattern match, blob, convolution and edge detection.

Abstract: A method and a system for inspecting a wafer. The system comprises an optical inspection head, a wafer table, a wafer stack, a XY table and vibration isolators. The optical inspection head comprises a number of illuminators, image capture devices, objective lens and other optical components. The system and method enables capture of brightfield images, darkfield images, 3D profile images and review images. Captured images are converted into image signals and transmitted to a programmable controller for processing. Inspection is performed while the wafer is in motion. Captured images are compared with reference images for detecting defects on the wafer. An exemplary reference creation process for creating reference images and an exemplary image inspection process is also provided by the present invention. The reference image creation process is an automated process.

Abstract: The present disclosure provides a system and method to convert three-dimensional data into a two-dimensional height displacement map and extract the three-dimensional features and dimensions of a three-dimensional object using a two-dimensional image processing technique. An illumination source of the system scans across the workspace using a line laser and generates a two-dimensional height displacement map of the workspace. The individual pixel location represents an actual workspace sampled location. The pixel gray scale intensity represents the Z displacement height at the pixel location. A processing device processes the features and dimensions within two-dimensional image as a gray scale using two-dimensional image processing such as pattern match, blob, convolution and edge detection.

Abstract: A wall hanger includes a fastening member, a linking member including a top wall, a lateral wall, and a bottom wall, and a sleeving member. A first connecting portion is at the fastening member. A second connecting portion is at the top wall to connect with the first connecting portion. The lateral wall is extending vertically toward a first direction distant from the top wall and has first teeth. The bottom wall is extending toward the first direction from the lateral wall and is parallel to the top wall. The sleeving member includes a base member, a supporting wall standing on the base member, and an abutting wall extending from the supporting wall and parallel to the base member. A groove is defined by the base member, the supporting wall, and the abutting wall. The top surface of the abutting wall has second teeth.

Abstract: An object positioning system includes an object positioning device and a detecting device. The object positioning device includes one or more magnetic bars forming a marked magnetic field. The detecting device includes a magnetic field generating unit for outputting a detecting magnetic field according to a detecting signal in an electromagnetic conversion process, and an analyzing unit for detecting whether the detecting signal varies when the detecting magnetic field passes the marked magnetic field along a moving direction. The analyzing unit analyzes whether a character of the variation corresponds to the marked magnetic field and accordingly outputs a detecting result. When people are trapped under snow or collapsed buildings because of an avalanche or an earthquake, the system can be utilized to find out trapped people. The system can also be utilized to find out objects buried underground. Money and time consumed by mass excavation can be saved.

Abstract: A wall hanger includes a fastening member, a linking member including a top wall, a lateral wall, and a bottom wall, and a sleeving member. A first connecting portion is at the fastening member. A second connecting portion is at the top wall to connect with the first connecting portion. The lateral wall is extending vertically toward a first direction distant from the top wall and has first teeth. The bottom wall is extending toward the first direction from the lateral wall and is parallel to the top wall. The sleeving member includes a base member, a supporting wall standing on the base member, and an abutting wall extending from the supporting wall and parallel to the base member. A groove is defined by the base member, the supporting wall, and the abutting wall. The top surface of the abutting wall has second teeth.

Abstract: A wall mount hanger includes a hanging section and a sleeve section. The hanging section is protrusively disposed on a wall surface and has a first arc surface and a stop portion. The first arc surface has plural protruding teeth, and the stop portion is protrusively disposed on the first arc surface. The sleeve section has a first surface and a second surface lower than the first surface. A second arc surface and a slot are disposed between the first surface and the second surface. The second arc surface has plural protruding teeth. The protruding teeth of the second arc surface are engaged with the protruding teeth of the first arc surface. Since the sleeve section and the hanging section are engaged with each other through the protruding teeth, the sleeve section can be rotated fixed to a required angle relative to the hanging section.

Abstract: A system for on-the-fly inspection of components is provided. The system includes a prism structure disposed below an inspection item transit path. An image data system is disposed below the prism structure. A lighting assembly provides a first lighting source to illuminate a plurality of sides of an inspection item and a second lighting source to illuminate a bottom of the inspection item.

Abstract: A system for inspecting components is provided. The system includes a prism having a first end, a second end, a first reflecting surface, and a second reflecting surface. The first end of the prism is located in a plane that is parallel to and axially separated from a plane of one or more of a plurality of inspection pieces. An image data system is disposed beyond the second end of the prism and generates image data of one or more of the inspection piece that includes a top surface of at least one of the inspection pieces and at least one side of at least one of the inspection pieces. An inspection piece transportation system, such as a pick and place tool or conveyor, moves a plurality of inspection pieces past the first end of the prism through an inspection area.

Abstract: A method and a system for inspecting a wafer. The system comprises an optical inspection head, a wafer table, a wafer stack, a XY table and vibration isolators. The optical inspection head comprises a number of illuminators, image capture devices, objective lens and other optical components. The system and method enables capture of brightfield images, darkfield images, 3D profile images and review images. Captured images are converted into image signals and transmitted to a programmable controller for processing. Inspection is performed while the wafer is in motion. Captured images are compared with reference images for detecting defects on the wafer. An exemplary reference creation process for creating reference images and an exemplary image inspection process is also provided by the present invention. The reference image creation process is an automated process.

Abstract: An inspection system for inspecting a semiconductor wafer. The inspection system comprises an illumination setup for supplying broadband illumination. The broadband illumination can be of different contrasts, for example brightfield and darkfield broadband illumination. The inspection system further comprises a first image capture device and a second image capture device, each configured for receiving broadband illumination to capture images of the semiconductor wafer while the semiconductor wafer is in motion. The system comprises a number of tube lenses for enabling collimation of the broadband illumination. The system also comprises a stabilizing mechanism and an objective lens assembly. The system further comprises a thin line illumination emitter and a third image capture device for receiving thin line illumination to thereby capture three-dimensional images of the semiconductor wafer.