Abstract: Preparation methods of an anisotropic conductive adhesive film are provided. One of the preparation methods includes heating a solid-state light-curing resin, a solid-state thermosetting resin and a solid-state elastomer to form a mixture. A liquid-state light curing active monomer and plasticizer are added to the mixture. A leveling agent, antioxidant and insulating nanoparticles are added separately to the mixture. Conductive particles are added to the mixture. A light curing agent, latent heat curing agent and coupling agent are added to the mixture to produce a light-beat dual curing anisotropic conductive adhesive. The conductive adhesive is coated on a plastic film base material to form a semi-finished product. The semi-finished product is cured and dried to form a cured conductive adhesive layer, so that an anisotropic conductive adhesive film is produced. The anisotropic conductive adhesive layer is cut, and the anisotropic conductive adhesive film is rolled.

Abstract: A kind of light-heat dual curing anisotropic conductive adhesive includes light curing activated monomer 15.0-18.0%, light-cured resin 4.5-12.5%, thermosetting resin 20.0-25.0%, elastomer 5.0-10.0%, insulating nanoparticles 8.0-15.0%, conductive particles 4.0-18.0%, light curing agent 3.0-5.0% and latent heat curing agent 12.0-16.0%, wherein the components are counted according to weight percentage. The present invention also discloses a kind of light-heat dual curing anisotropic conductive film (ACF) and its preparation methods. Ultraviolet light curing method is applied to produce ACF can avoid using solvent to protect the natural environment. When using ACF, heat curing method is then applied to guarantee the quality of banding and the reliability.

Abstract: An autorotation and revolution magnetic stirring device for producing conductive golden particles comprises a mounting holder, a rotary electric motor, a flask, a magnetic stirrer, and a magnetic rotor. The rotary electric motor is fixed to the mounting holder. The flask is rotatably mounted to the mounting holder. The rotary electric motor provides rotary power to make the flask rotate. The magnetic rotor is put into the flask. The magnetic rotor rotates due to the magnetic force from the magnetic stirrer. In the present invention, the solvents in the flask rotate due to the rotary of the flask and the rotary of the magnetic rotor. “Revolution” and “autorotation” exist at the same time, so the solvents are stirred more adequately and more evenly so as to obtain an excellent surface treatment effect.

Abstract: A mold structure (100) includes a press board (20), a lower mold (10) and at least one locking mechanism (40) configured for locking the press board to the lower mold. The at least one locking mechanism includes a locking element (41), a slidable block (46) and a driven apparatus (42). The locking element engages with the press board and the lower mold along a first direction. The locking element defines a locking hole (4124). The slidable block engages in the locking hole along a second direction. The driven apparatus drives the slidable block to move along the second direction for pressing the press board to the lower mold along the first direction.

Abstract: A mold structure (100) includes a press board (20), a lower mold (10) and at least one locking mechanism (40) configured for locking the press board to the lower mold. The at least one locking mechanism includes a locking element (41), a slidable block (46) and a driven apparatus (42). The locking element engages with the press board and the lower mold along a first direction. The locking element defines a locking hole (4124). The slidable block engages in the locking hole along a second direction. The driven apparatus drives the slidable block to move along the second direction for pressing the press board to the lower mold along the first direction.

Abstract: A method is disclosed for one embodiment. An amount of photoresist is deposited upon a substrate, the amount of photoresist more than necessary to coat the substrate. The substrate is spun within a bowl such that an excess amount of photoresist is propelled off of the substrate to an interior surface of the bowl. A portion of the excess amount of photoresist is recovered and treated such that the recovered portion of the excess amount of photoresist is rendered usable.

Abstract: Embodiments of the invention provide methods and apparatuses for efficient and cost-effective imaging of alignment marks. For one embodiment, alignment mark imaging is accomplished separately from, and independent of product imaging through use of a relatively low cost, low resolution, imaging tool. For one embodiment a wafer is exposed to low-resolution light source through a reticle having a number of alignment patterns corresponding to desired alignment marks. For one embodiment, global alignment marks are imaged on a backside of a wafer. Various embodiments of the invention obviate the need for a highly accurate stage and a high-resolution imaging device, and therefore reduce processing costs and processing time.

Abstract: Embodiments of the invention provide methods and apparatuses for efficient and cost-effective imaging of alignment marks. For one embodiment, alignment mark imaging is accomplished separately from, and independent of product imaging through use of a relatively low cost, low resolution, imaging tool. For one embodiment a wafer is exposed to low-resolution light source through a reticle having a number of alignment patterns corresponding to desired alignment marks. For one embodiment, global alignment marks are imaged on a backside of a wafer. Various embodiments of the invention obviate the need for a highly accurate stage and a high-resolution imaging device, and therefore reduce processing costs and processing time.

Abstract: Embodiments of the invention provide methods and apparatuses for efficient and cost-effective imaging of alignment marks. For one embodiment, alignment mark imaging is accomplished separately from, and independent of product imaging through use of a relatively low cost, low resolution, imaging tool. For one embodiment a wafer is exposed to low-resolution light source through a reticle having a number of alignment patterns corresponding to desired alignment marks. For one embodiment, global alignment marks are imaged on a backside of a wafer. Various embodiments of the invention obviate the need for a highly accurate stage and a high-resolution imaging device, and therefore reduce processing costs and processing time.

Abstract: A method is disclosed for one embodiment. An amount of photoresist is deposited upon a substrate, the amount of photoresist more than necessary to coat the substrate. The substrate is spun within a bowl such that an excess amount of photoresist is propelled off of the substrate to an interior surface of the bowl. A portion of the excess amount of photoresist is recovered and treated such that the recovered portion of the excess amount of photoresist is rendered usable.

Abstract: A grinding paint has 30% to 45% of a copolymer of melamine, sulphonamide and formaldehyde, 30% to 45% of a resin, 20% to 30% of a solvent, 1% to 3% of a transparent paint, and 0.5% to 1.5% of an assistant agent. The resin is selected from a group consisting of epoxy resin, alkyd resin, amino-compound resin, and acrylic resin. The solvent is selected from a group consisting of alcohols, ketones, and aromatic compounds. The transparent paint is a metal-containing powder dissolved in the solvent to form a transparent liquid. The assistant agent is a silicon-containing liquid. The grinding paint is painted on a decoration bulb by spraying, dipping or showering to form a base coating layer on the decoration bulb. The base coating layer is baked at 150° C. to 250° C. for approximately ten to fifteen minutes.