Patents by Inventor Cheng-Han Chung

Cheng-Han Chung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200288002
    Abstract: A functional assembly and an electronic device including the functional assembly are provided. The functional assembly includes a functional module, a motor, and a linking mechanism. The functional module has a first shaft. The motor has a second shaft and is configured to drive the second shaft to rotate. The linking mechanism is connected with the first shaft and the second shaft such that the first shaft and the second shaft are linking-up with each other. As a result, the thickness of the electronic device near the frame is not limited by the size of the motor, which further reduces the thickness of the electronic device.
    Type: Application
    Filed: March 6, 2020
    Publication date: September 10, 2020
    Inventors: Cheng-Han CHUNG, Chui-Hung CHEN, Chia-Min CHENG, Ching-Yuan YANG
  • Publication number: 20200060036
    Abstract: The disclosure discloses an electronic device, and the electronic device includes: a housing, a waterproof structure, a functional module, and a driving member. The housing has an inner surface and an opening connected to each other. The waterproof structure has a first end surface, a second end surface, and a side wall connecting the first end surface and the second end surface. The first end surface tightly connected with the inner surface in a sealing manner. The functional module is disposed inside the waterproof structure. The driving member is located in the housing, and is configured to drive the functional module to move toward or away from the opening.
    Type: Application
    Filed: August 1, 2019
    Publication date: February 20, 2020
    Inventors: Chui-Hung CHEN, Chia-Min CHENG, Ching-Yuan YANG, Cheng-Han CHUNG
  • Publication number: 20200059542
    Abstract: A functional assembly is provided. The functional assembly includes a functional module and a lifting assembly. The lifting assembly is fixed in the housing and configured to drive the functional module to move. In addition, the functional assembly further includes a rotating assembly. The rotating assembly is connected to the functional module.
    Type: Application
    Filed: August 14, 2019
    Publication date: February 20, 2020
    Inventors: Chui-Hung CHEN, Ching-Yuan YANG, Cheng-Han CHUNG, Chia-Min CHENG
  • Patent number: 10113243
    Abstract: A manufacturing method of a casing of an electronic device including the following steps is provided. First, a casing body is formed by an injection molding technology, and the casing body includes a button portion. Thereafter, a sensing assembly is electroplated on an inner surface of the casing body. The sensing assembly includes a first conductive line and two first contacts. The first conductive line forms a strain sensing pattern on the button portion, and the two first contacts connect to two ends of the first conductive line, respectively.
    Type: Grant
    Filed: December 31, 2015
    Date of Patent: October 30, 2018
    Assignee: HTC Corporation
    Inventors: Cheng-Han Chung, Chao-Feng Wan
  • Patent number: 9774072
    Abstract: A housing, a handheld device and a manufacturing method of a housing are provided. The housing includes a body, a metal antenna layer, and a conductive element. The body includes a through hole and an outer surface and an inner surface opposite to the outer surface. The metal antenna layer is disposed on the outer surface and covers the through hole, wherein an edge of the metal antenna layer is connected to the outer surface seamlessly, and a surface of the metal antenna layer is at least partially exposed by the body. The conductive element is disposed in the through hole and directly contacts the metal antenna layer to transmit signals received by the metal antenna layer.
    Type: Grant
    Filed: January 14, 2014
    Date of Patent: September 26, 2017
    Assignee: HTC Corporation
    Inventors: Cheng-Han Chung, Chih-Kuang Wang, Yen-Liang Kuo
  • Patent number: 9464360
    Abstract: A casing of an electronic device including a casing body and a sensing assembly is provided. The casing body includes a button portion. The sensing assembly includes a first conductive line and two first contacts. The first conductive line is disposed on an inner surface of the casing body, and the first conductive line forms a strain sensing pattern on the button portion. The first contacts are disposed on the inner surface of the casing body, and connected to two ends of the first conductive line, respectively. The strain sensing pattern is adapted to result a resistance variation accompanied with a deformation of the button portion when the button portion is deformed, so as to generate an electrical signal.
    Type: Grant
    Filed: January 15, 2014
    Date of Patent: October 11, 2016
    Assignee: HTC Corporation
    Inventors: Cheng-Han Chung, Chao-Feng Wan
  • Publication number: 20160153109
    Abstract: A casing of an electronic device and a manufacturing method thereof are provided. The casing comprises a metal shell, a painting layer and a micro-arc oxidation (MAO) layer. The MAO layer is formed between the metal shell and the painting layer.
    Type: Application
    Filed: November 28, 2014
    Publication date: June 2, 2016
    Applicant: HTC Corporation
    Inventors: Chih-Sheng Wei, Shih-Ying Peng, Cheng-Han Chung, Tsung-Yuan Ou
  • Publication number: 20160108535
    Abstract: A manufacturing method of a casing of an electronic device including the following steps is provided. First, a casing body is formed by an injection molding technology, and the casing body includes a button portion. Thereafter, a sensing assembly is electroplated on an inner surface of the casing body. The sensing assembly includes a first conductive line and two first contacts. The first conductive line forms a strain sensing pattern on the button portion, and the two first contacts connect to two ends of the first conductive line, respectively.
    Type: Application
    Filed: December 31, 2015
    Publication date: April 21, 2016
    Inventors: Cheng-Han Chung, Chao-Feng Wan
  • Publication number: 20150198981
    Abstract: A casing of an electronic device including a casing body and a sensing assembly is provided. The casing body includes a button portion. The sensing assembly includes a first conductive line and two first contacts. The first conductive line is disposed on an inner surface of the casing body, and the first conductive line forms a strain sensing pattern on the button portion. The first contacts are disposed on the inner surface of the casing body, and connected to two ends of the first conductive line, respectively. The strain sensing pattern is adapted to result a resistance variation accompanied with a deformation of the button portion when the button portion is deformed, so as to generate an electrical signal.
    Type: Application
    Filed: January 15, 2014
    Publication date: July 16, 2015
    Applicant: HTC Corporation
    Inventors: Cheng-Han Chung, Chao-Feng Wan
  • Publication number: 20140191910
    Abstract: A housing, a handheld device and a manufacturing method of a housing are provided. The housing includes a body, a metal antenna layer, and a conductive element. The body includes a through hole and an appearance surface and an inner surface opposite to the appearance surface. The metal antenna layer is disposed on the appearance surface and covers the through hole, wherein an edge of the metal antenna layer is connected to the appearance surface seamlessly, and a surface of the metal antenna layer is at least partially exposed by the body. The conductive element is disposed in the through hole and directly contacts the metal antenna layer to transmit signals received by the metal antenna layer.
    Type: Application
    Filed: January 14, 2014
    Publication date: July 10, 2014
    Applicant: HTC Corporation
    Inventors: Cheng-Han Chung, Chih-Kuang Wang, Yen-Liang Kuo
  • Patent number: 7915322
    Abstract: The present invention relates to a polymerizable water-soluble or alcohol-soluble ultraviolet absorber, which is represented by the following formula (I): wherein R1 is H or C1˜5 alkyl; R2 is H, Cl, Br or I; R3 is H or methyl; and m each is an integer in the range from 3 to 12. The above-mentioned compounds are suitable for copolymerizing with one or more monomers to form copolymers so that the UV-light resistance of the copolymer can be efficiently promoted. For example, the polymer made by copolymerizing the above-mentioned compound with acrylate monomers can be applied to the production of optical medical materials, especially contact lenses or intraocular lenses.
    Type: Grant
    Filed: April 30, 2008
    Date of Patent: March 29, 2011
    Assignee: Everlight USA, Inc.
    Inventors: Chiu-Ming Hung, Wei-Ju Chen, Cheng-Han Chung, Chih-Kang Chang, Hsiang-Lin Jiang, You-Chin Mou, Yen-Cheng Li, Chi-Hsiang Yao
  • Publication number: 20090275717
    Abstract: The present invention relates to a polymerizable water-soluble or alcohol-soluble ultraviolet absorber, which is represented by the following formula (I): wherein R1 is H or C1˜5 alkyl; R2 is H, Cl, Br or I; R3 is H or methyl; and m each is an integer in the range from 3 to 12. The above-mentioned compounds are suitable for copolymerizing with one or more monomers to form copolymers so that the UV-light resistance of the copolymer can be efficiently promoted. For example, the polymer made by copolymerizing the above-mentioned compound with acrylate monomers can be applied to the production of optical medical materials, especially contact lenses or intraocular lenses.
    Type: Application
    Filed: April 30, 2008
    Publication date: November 5, 2009
    Applicant: Everlight USA, Inc.
    Inventors: Chiu-Ming Hung, Wei-Ju Chen, Cheng-Han Chung, Chih-Kang Chang, Hsiang-Lin Jiang, You-Chun Mau, Yen-Cheng Li, Chi-Hsiang Yao
  • Patent number: D884689
    Type: Grant
    Filed: September 27, 2018
    Date of Patent: May 19, 2020
    Assignee: ASUSTeK COMPUTER INC.
    Inventors: Chui-Hung Chen, Zih-Siang Huang, Hung-Chieh Wu, Liang-Jen Lin, Ching-Yuan Yang, Cheng-Han Chung, Chia-Min Cheng