Patents by Inventor Cheng-Hsiang Chen
Cheng-Hsiang Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240170385Abstract: A semiconductor package device is provided. The semiconductor package device includes a chip and a redistribution layer disposed on the chip and electrically connected to the chip. The redistribution layer includes a plurality of first metal lines and a plurality of second metal lines, wherein at least one of the second metal lines is disposed between two adjacent first metal lines. The included angle between the at least one of the second metal lines and the two adjacent first metal lines is greater than or equal to 0 degrees and less than or equal to 10 degrees. The first width of one of the two adjacent first metal lines is greater than the second width of the at least one of the second metal lines.Type: ApplicationFiled: December 22, 2022Publication date: May 23, 2024Inventors: Te-Hsun LIN, Wen-Hsiang LIAO, Mei-Yen CHEN, Ming-Hsien SHIH, Yung-Feng CHEN, Cheng-Chi WANG
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Publication number: 20240171160Abstract: A sensing circuit coupled to a sensor includes a first transistor, a second transistor, a third transistor, a fourth transistor, and an oscillator. The first transistor, coupled to a first current source and the sensor, receives a sensing current from the sensor. A gate terminal of the first transistor is connected to a source terminal of the first transistor. The second transistor, coupled to the first transistor and a second current source, generates a first current according to the sensing current. The first current is greater than the sensing current. The third transistor, coupled to the second transistor and the second current source, generates a second current according to the first current. The fourth transistor, coupled to the third transistor, generates a third current. The oscillator is coupled to the fourth transistor. The oscillator generates a signal having an oscillation frequency according to the third current.Type: ApplicationFiled: February 7, 2023Publication date: May 23, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Tung-Tsun Chen, Ruey-Bin Sheen, Chih-Hsien Chang, Cheng-Hsiang Hsieh
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Patent number: 11988625Abstract: A capacitive biosensor is provided. The capacitive biosensor includes: a transistor, an interconnect structure on the transistor, and a passivation layer on the interconnect structure. The interconnect structure includes a first metal structure on the transistor, a second metal structure on the first metal structure, and a third metal structure on the second metal structure. The third metal structure includes a first conductive layer, a second conductive layer, and a third conductive layer that are sequentially stacked. The passivation has an opening exposing a portion of the third metal structure. The capacitive biosensor further includes a sensing region on the interconnect structure. The sensing region includes a first sensing electrode and a second sensing electrode. The first sensing electrode is formed of the third conductive layer, and the second sensing electrode is disposed on the passivation layer.Type: GrantFiled: December 23, 2020Date of Patent: May 21, 2024Assignee: VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATIONInventors: Cheng-Ping Chang, Chien-Hui Li, Chien-Hsun Wu, Tai-I Yang, Yung-Hsiang Chen
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Publication number: 20240145370Abstract: A semiconductor device includes a first region and a second region, and the second region surrounds the first region. The semiconductor device includes at least one electronic unit, a redistribution structure, a plurality of first pads, and a plurality of second pads. The redistribution structure may be electrically connected to at least one electronic unit. A plurality of first pads are arranged on the redistribution structure and correspondingly to the first region. There is a first pitch between two adjacent first pads. A plurality of second pads are arranged on the redistribution structure and correspondingly to the second region. There is a second pitch between two adjacent second pads, so that the first pitch is smaller than the second pitch.Type: ApplicationFiled: December 18, 2022Publication date: May 2, 2024Applicant: InnoLux CorporationInventors: Te-Hsun LIN, Wen-Hsiang LIAO, Ming-Hsien SHIH, Yung-Feng CHEN, Cheng-Chi WANG
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Publication number: 20240147658Abstract: A fan module and computing device with the fan module are disclosed. The fan module includes a handle configured to actuate between an operation state and a release state. The handle in the release state allows a user to vertically remove the fan module from its respective fan module slot and away from the bottom panel.Type: ApplicationFiled: January 11, 2023Publication date: May 2, 2024Inventors: Chao-Jung CHEN, Chih-Hsiang LEE, Wei-Pin CHEN, Jyue HOU, Cheng-Chieh WENG
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Patent number: 11965898Abstract: An automatic nucleic acid detection system and a method thereof are disclosed. The automatic nucleic acid detection method includes: performing, by an automatic control subsystem, on a nucleic acid extraction machine platform, a nucleic acid extraction on one or more specimens in a sample tray to generate one or more corresponding nucleic acids in the sample tray; distributing, by the automatic control subsystem, on a nucleic acid distribution machine platform, the nucleic acid in each hole of the sample tray and a first reagent into a plurality of holes of a detection tray, wherein the number of holes of the detection tray is greater than that of the sample tray; and performing, by the automatic control subsystem, on a nucleic acid detection machine platform, a nucleic acid detection on the detection tray.Type: GrantFiled: July 23, 2020Date of Patent: April 23, 2024Assignees: TCI GENE INC, TCI CO., LTDInventors: Yung-Hsiang Lin, Cheng-Hong Hsieh, Ciao-Ting Chen, Tsung-Cheng Chen
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Publication number: 20240126006Abstract: A backlight module comprises an outer frame unit, a light guide plate arranged in the outer frame unit, a light-emitting unit, a plurality of adhesives for fixing the light-emitting unit on the light guide plate, and a plurality of abutting structures. The light-emitting unit includes a flexible circuit board and a plurality of light-emitting elements arranged on the flexible circuit board at intervals. Part of the flexible circuit board is deformed at a specific position by the abutting structures, and the position of the light-emitting elements relative to the light guide plate can be adjusted. Thereby, the light-emitting elements can be aligned with the light incident surface of the light guide plate, prevent light from leaking from the light emitting surface of the light guide plate close to the light-emitting elements, and reduce the generation of bright lines and improving the overall uniformity. The present invention also provides a display device including the backlight module.Type: ApplicationFiled: September 14, 2023Publication date: April 18, 2024Applicant: Radiant Opto-Electronics CorporationInventors: Chih-Hsiang CHEN, Cheng-Te CHANG
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Patent number: 11962441Abstract: A multi-tap Differential Feedforward Equalizer (DFFE) configuration with both precursor and postcursor taps is provided. The DFFE has reduced noise and/or crosstalk characteristics when compared to a Feedforward Equalizer (FFE) since DFFE uses decision outputs of slicers as inputs to a finite impulse response (FIR) unlike FFE which uses actual analog signal inputs. The digital outputs of the tentative decision slicers are multiplied with tap coefficients to reduce noise. Further, since digital outputs are used as the multiplier inputs, the multipliers effectively work as adders which are less complex to implement. The decisions at the outputs of the tentative decision slicers are tentative and are used in a FIR filter to equalize the signal; the equalized signal may be provided as input to the next stage slicers. The bit-error-rate (BER) of the final stage decisions are lower or better than the BER of the previous stage tentative decisions.Type: GrantFiled: July 25, 2022Date of Patent: April 16, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chaitanya Palusa, Rob Abbott, Wei-Li Chen, Po-Hsiang Lan, Dirk Pfaff, Cheng-Hsiang Hsieh
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Publication number: 20240105121Abstract: An electronic device includes a substrate, a first silicon transistor, a second silicon transistor and a first oxide semiconductor transistor. The first silicon transistor, the second silicon transistor and the first oxide semiconductor transistor are disposed on the substrate. The first silicon transistor has a first terminal electrically connected to a first voltage level, a second terminal and a control terminal. The second silicon transistor has a first terminal electrically connected to the second terminal of the first silicon transistor, a second terminal electrically connected to a second voltage level, and a control terminal electrically connected to the control terminal of the first silicon transistor. The first oxide semiconductor transistor has a first terminal electrically connected to the first terminal of the second silicon transistor. Wherein, a voltage value of the first voltage level is greater than a voltage value of the second voltage level.Type: ApplicationFiled: December 6, 2023Publication date: March 28, 2024Inventors: Lien-Hsiang CHEN, Kung-Chen KUO, Ming-Chun TSENG, Cheng-Hsu CHOU, Kuan-Feng LEE
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Publication number: 20240085398Abstract: A semiconductor device includes a circuit layer and a nanopore layer. The nanopore layer is formed on the circuit layer and is formed with a pore therethrough. The circuit layer includes a circuit unit configured to drive a biomolecule through the pore and to detect a current associated with a resistance of the nanopore layer, whereby a characteristic of the biomolecule can be determined using the currents detected by the circuit unit.Type: ApplicationFiled: November 21, 2023Publication date: March 14, 2024Inventors: Kun-Lung Chen, Tung-Tsun Chen, Cheng-Hsiang Hsieh, Yu-Jie Huang, Jui-Cheng Huang
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Publication number: 20240088124Abstract: A semiconductor structure, comprising a redistribution layer (RDL) including a dielectric layer and a conductive trace within the dielectric layer; a first conductive member disposed over the RDL and electrically connected with the conductive trace; a second conductive member disposed over the RDL and electrically connected with the conductive trace; a first die disposed over the RDL; a second die disposed over the first die, the first conductive member and the second conductive member; and a connector disposed between the second die and the second conductive member to electrically connect the second die with the conductive trace, wherein the first conductive member is electrically isolated from the second die.Type: ApplicationFiled: November 24, 2023Publication date: March 14, 2024Inventors: HSIANG-TAI LU, SHUO-MAO CHEN, MILL-JER WANG, FENG-CHENG HSU, CHAO-HSIANG YANG, SHIN-PUU JENG, CHENG-YI HONG, CHIH-HSIEN LIN, DAI-JANG CHEN, CHEN-HUA LIN
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Patent number: 11149931Abstract: The present disclosure provides a cable assembly and a cable indication system. The cable assembly includes a first cable, a second cable, a first connector, a second connector, and a third connector. The first cable includes a jacket defining a first cavity and a second cavity, the first cavity includes a light guide extending through the first cavity, and the second cavity has an open end. The second cable is encased by the first cable in the second cavity, and the second cable extends through the second cavity. The first connector is electrically coupled to a first end of the first cable and includes a first interface for connecting with a first device. The second connector includes a second interface for connecting with the first connector. The third connector includes a third interface for connecting with a second device.Type: GrantFiled: November 20, 2019Date of Patent: October 19, 2021Assignee: BKS TEC CORP.Inventors: Cheng Hsiang Chen, Chun Mou Yu
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Publication number: 20210148555Abstract: The present disclosure provides a cable assembly and a cable indication system. The cable assembly includes a first cable, a second cable, a first connector, a second connector, and a third connector. The first cable includes a jacket defining a first cavity and a second cavity, the first cavity includes a light guide extending through the first cavity, and the second cavity has an open end. The second cable is encased by the first cable in the second cavity, and the second cable extends through the second cavity. The first connector is electrically coupled to a first end of the first cable and includes a first interface for connecting with a first device. The second connector includes a second interface for connecting with the first connector. The third connector includes a third interface for connecting with a second device.Type: ApplicationFiled: November 20, 2019Publication date: May 20, 2021Inventors: Cheng Hsiang CHEN, Chun Mou YU
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Patent number: 10897112Abstract: An AC power cord assembly comprises a cable and a control device, wherein the cable includes at least one first wire for transmitting AC voltages and at least one second wire for transmitting visible lights, wherein the control device includes at least one first LED for emitting visible lights to the at least one second wire.Type: GrantFiled: September 26, 2019Date of Patent: January 19, 2021Assignee: BKS TEC CORP.Inventors: Cheng Hsiang Chen, Shang Yu Liu
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Patent number: 10727660Abstract: The present disclosure provides a cable assembly and a cable indication system. The cable assembly includes a cable, a first connector, and a second connector. The cable includes a jacket defining a first cavity and a second cavity, the first cavity includes at least one electrical wire extending through the first cavity, and the second cavity includes a light bar extending through the second cavity. The first connector is electrically coupled to a first end of the cable, and includes a first interface for connecting with a first device. The second connector is electrically coupled to a second end of the cable, and includes a second interface for connecting with a second device.Type: GrantFiled: October 3, 2019Date of Patent: July 28, 2020Assignee: BKS TEC CORP.Inventors: Cheng Hsiang Chen, Tsung Hsien Huang
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Patent number: 9401234Abstract: An over-current protection device comprises a PTC device, first and second electrodes, a first welding metal plate and a second welding metal plate. The PTC device comprises a first conductive layer, at second conductive layer and a PTC polymeric material layer laminated therebetween. The first electrode electrically connects to the first conductive layer. The second electrode electrically connects to the second conductive layer and is separated from the first electrode. The first welding metal plate is formed on an upper surface of the device and connects to the first electrode. The second welding metal plate is formed on the upper surface or a lower surface of the device and connects to the second electrode. The first and second welding metal plates are placed at two opposite ends of the strip-like structure, and each of them has a thickness sufficient to withstand spot-welding without significant resultant damage to the PTC device.Type: GrantFiled: February 21, 2014Date of Patent: July 26, 2016Assignee: POLYTRONICS TECHNOLOGY CORP.Inventors: Chun Teng Tseng, Cheng Hsiang Chen, Pin Syuan Li, Chi Jen Su
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Patent number: 9073225Abstract: A hair trimming device has a first knife, a second knife, a first protective cover, a pair of movable plates, an elastic element and a second protective cover. The first protective cover covers the first knife and has a first comb installed at a front end of the first knife, and the pair of movable plates are linked with both external sides of the second knife and the first knife, and the second protective cover is installed at a front end of the pair of movable plates, and a second comb is disposed between the first comb and the cutting blade, such that the movable plate is linked to the second comb. When use, hairs of different lengths are bent and fixed and then cut to achieve layered hair styling without any discomfort caused by tearing the hair.Type: GrantFiled: May 3, 2013Date of Patent: July 7, 2015Assignee: Tzeng Fong Industrial CorporationInventors: Chin-Chuan Chen, Yu-Hsia Yang, Hung-Chieh Chen, Cheng-I Chen, Cheng-Hsiang Chen
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Publication number: 20140325848Abstract: A hair trimming device has a first knife, a second knife, a first protective cover, a pair of movable plates, an elastic element and a second protective cover. The first protective cover covers the first knife and has a first comb installed at a front end of the first knife, and the pair of movable plates are linked with both external sides of the second knife and the first knife, and the second protective cover is installed at a front end of the pair of movable plates, and a second comb is disposed between the first comb and the cutting blade, such that the movable plate is linked to the second comb. When use, hairs of different lengths are bent and fixed and then cut to achieve layered hair styling without any discomfort caused by tearing the hair.Type: ApplicationFiled: May 3, 2013Publication date: November 6, 2014Applicant: TZENG FONG INDUSTRIAL CORPORATIONInventors: CHIN-CHUAN CHEN, YU-HSIA YANG, HUNG-CHIEH CHEN, CHENG-I CHEN, CHENG-HSIANG CHEN
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Patent number: D1010586Type: GrantFiled: October 29, 2019Date of Patent: January 9, 2024Assignee: BKS TEC CORP.Inventors: Cheng Hsiang Chen, Chun Mou Yu
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Patent number: D1010587Type: GrantFiled: November 7, 2019Date of Patent: January 9, 2024Assignee: BKS TEC CORP.Inventors: Cheng Hsiang Chen, Chun Mou Yu