Patents by Inventor Cheng-Hsiu Liu

Cheng-Hsiu Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of forming conductive feature including cleaning step
    Patent number: 11955329
    Abstract: A method of forming a semiconductor device includes forming a first conductive feature on a bottom surface of an opening through a dielectric layer. The forming the first conductive feature leaves seeds on sidewalls of the opening. A treatment process is performed on the seeds to form treated seeds. The treated seeds are removed with a cleaning process. The cleaning process may include a rinse with deionized water. A second conductive feature is formed to fill the opening.
    Type: Grant
    Filed: April 28, 2023
    Date of Patent: April 9, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Cheng-Wei Chang, Min-Hsiu Hung, Chun-I Tsai, Ken-Yu Chang, Yi-Ying Liu
  • DECORATION PLATE AND TOUCH PANEL
    Publication number: 20150029419
    Abstract: A decoration plate includes a substrate, a decoration pattern layer, and at least one color decoration layer. The decoration pattern layer is disposed on the substrate, and the decoration pattern layer has a pattern in a projection direction perpendicular to the substrate. The color decoration layer is disposed on and covers the decoration pattern layer, and extends onto the substrate.
    Type: Application
    Filed: July 21, 2014
    Publication date: January 29, 2015
    Inventors: Chun-Ming Huang, Jen-Wei Chou, Cheng-Hsiu Liu, Ta-Wei Yeh