Patents by Inventor Cheng Hsu

Cheng Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240170709
    Abstract: A motion synchronized multi-tier pallet rack and a battery formation apparatus are provided. The pallet rack includes a fixation rack, two movable frames, and two actuators. The movable frames are coupled to two corresponding sides of the fixation rack and each includes telescopic arms, a motor, and a drive rod. The actuators are disposed on other the two corresponding sides of the fixation rack to drive the movable frames to move toward or away from each other. The telescopic arms are kinematically connected to the motor through the drive rod to extend from or retract into the movable frame. The battery formation apparatus includes a motion synchronized multi-tier pallet rack, a conveyor module, a formation cabinet, and a controller. The conveyor module carries a battery module. The controller controls the pallet rack to obtain the battery module from the conveyor module and place the battery module in the formation cabinet.
    Type: Application
    Filed: September 27, 2023
    Publication date: May 23, 2024
    Applicant: CHROMA ATE INC.
    Inventors: Ming-Cheng Huang, Jiun-Ren Chen, Chao-Cheng Wu, Yi-Sheng Hsu
  • Publication number: 20240170225
    Abstract: This invention describes a packaging structure for roll-type (wound-type) aluminum conductive polymer capacitor element. Two protective substrates are applied to sandwich a roll-type capacitor element in between with an insulating material surrounding the capacitor element also in between the protective substrates. The protective substrates comprise electrically separated anodic conductive pad and cathodic conductive pad on their surfaces and through holes that pass through the conductive pads. The capacitor element is oriented with its axis perpendicular to the two substrates. The anodic and cathodic leads of the capacitor element pass through the through holes. An anodic external terminal is plated over the anodic conductive pad and a cathodic external terminal is plated over the cathodic conductive pad so that the anodic external terminal is electrically connected to the anodic lead and the cathodic external terminal is electrically connected to the cathodic lead.
    Type: Application
    Filed: November 22, 2022
    Publication date: May 23, 2024
    Inventors: Yu-Peng Chung, Chia-Wei Li, Wen Cheng Hsu, En-Ming Chen, Che-Chih Tsao
  • Publication number: 20240168160
    Abstract: An angle sensing device includes a base, a rotation shaft, a detected target, and a proximity sensor. The rotation shaft is rotatably arranged on the base, and includes a side surface and a virtual axis. The detected target is arranged on the side surface, and an outer contour of a cross section of the detected target along a radial direction of the rotation shaft includes a first detected position and a second detected position, where a distance of the first detected position with respect to the virtual axis is different from that of the second detected position. The proximity sensor is fixedly arranged on the base and faces the detected target. When the detected target rotates together with the rotation shaft, the proximity sensor emits light toward the detected target and detects reflected light from the outer contour of the detected target to generate measurement data.
    Type: Application
    Filed: March 28, 2023
    Publication date: May 23, 2024
    Inventors: Hann Shiang YANG, Kaiyu HSU, Cheng Wei CHEN
  • Patent number: 11988953
    Abstract: A method includes forming a multi-layered reflective layer over a substrate; depositing a metal capping layer over the multi-layered reflective layer; depositing a first metal oxide layer over the metal capping layer; depositing a metal nitride layer over the first metal oxide layer; depositing a second metal oxide layer over the metal nitride layer; forming a plurality of features on the second metal oxide layer and the metal nitride layer.
    Type: Grant
    Filed: January 6, 2023
    Date of Patent: May 21, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Pei-Cheng Hsu, Ta-Cheng Lien, Hsin-Chang Lee
  • Patent number: 11989046
    Abstract: Disclosed herein are related to an integrated circuit to regulate a supply voltage. In one aspect, the integrated circuit includes a metal rail including a first point, at which a first functional circuit is connected, and a second point, at which a second functional circuit is connected. In one aspect, the integrate circuit includes a voltage regulator coupled between the first point of the metal rail and the second point of the metal rail. In one aspect, the voltage regulator senses a voltage at the second point of the metal rail and adjusts a supply voltage at the first point of the metal rail, according to the sensed voltage at the second point of the metal rail.
    Type: Grant
    Filed: February 6, 2023
    Date of Patent: May 21, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Haruki Mori, Hidehiro Fujiwara, Zhi-Hao Chang, Yangsyu Lin, Yu-Hao Hsu, Yen-Huei Chen, Hung-Jen Liao, Chiting Cheng
  • Publication number: 20240161381
    Abstract: A computer-executable method for generating a side-by-side three-dimensional (3D) image includes the steps of creating a 3D mesh and estimating depth information of the raw image. The method further includes the steps of updating the left mesh area and the right mesh area of the 3D mesh based on the estimated depth information of the raw image and projecting each of the mesh vertices of the left mesh area onto a coordinate system of the side-by-side 3D image based on a left eye position, and projecting each of the mesh vertices of the right mesh area onto the coordinate system of the side-by-side 3D image based on a right eye position. The method further obtains the side-by-side 3D image by coloring the left mesh area and the right mesh area projected onto the coordinate system of the side-by-side 3D image based on the raw image.
    Type: Application
    Filed: November 16, 2022
    Publication date: May 16, 2024
    Inventors: Sergio CANTERO CLARES, Wen-Cheng HSU, Shih-Hao LIN, Chih-Haw TAN
  • Publication number: 20240162809
    Abstract: A power supply circuit is provided. The power factor correction (PFC) circuit is used to perform a power factor correction according to a first voltage to generate an intermediate voltage. The first storage capacitor is used to store a first electrical energy related to the intermediate voltage. The boost conversion circuit is connected to the PFC circuit and used to generate an output voltage according to the intermediate voltage. The boost conversion circuit includes a first post-stage inductor, a first post-stage diode and a first post-stage transistor. The second storage capacitor is used to store a second electrical energy related to the output voltage. The capacitance value of the second storage capacitor is less than the capacitance value of the first storage capacitor; the first electrical energy is completely or partially transferred as the second electrical energy.
    Type: Application
    Filed: March 6, 2023
    Publication date: May 16, 2024
    Inventors: Yu-Cheng LIN, Te-Hung YU, Chia-Hui LIANG, Min-Hao HSU
  • Patent number: 11985324
    Abstract: Exemplary video processing methods and apparatuses for encoding or decoding a current block by inter prediction are disclosed. Input data of a current block is received and partitioned into sub-partitions and motion refinement is independently performed on each sub-partition. A reference block for each sub-partition is obtained from one or more reference pictures according to an initial motion vector (MV). A refined MV for each sub-partition is derived by searching around the initial MV with N-pixel refinement. One or more boundary pixels of the reference block for a sub-partition is padded for motion compensation of the sub-partition. A final predictor for the current block is generated by performing motion compensation for each sub-partition according to its refined MV. The current block is then encoded or decoded according to the final predictor.
    Type: Grant
    Filed: March 13, 2020
    Date of Patent: May 14, 2024
    Assignee: HFI INNOVATION INC.
    Inventors: Yu-Cheng Lin, Chun-Chia Chen, Chih-Wei Hsu, Ching-Yeh Chen, Tzu-Der Chuang, Yu-Wen Huang
  • Patent number: 11982866
    Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a stopping assembly. The fixed assembly has a main axis. The movable assembly is configured to connect an optical element, and the movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The stopping assembly is configured to limit the movement of the movable assembly relative to the fixed assembly within a range of motion.
    Type: Grant
    Filed: December 15, 2022
    Date of Patent: May 14, 2024
    Assignee: TDK TAIWAN CORP.
    Inventors: Chao-Chang Hu, Liang-Ting Ho, Chen-Er Hsu, Yi-Liang Chan, Fu-Lai Tseng, Fu-Yuan Wu, Chen-Chi Kuo, Ying-Jen Wang, Wei-Han Hsia, Yi-Hsin Tseng, Wen-Chang Lin, Chun-Chia Liao, Shou-Jen Liu, Chao-Chun Chang, Yi-Chieh Lin, Shang-Yu Hsu, Yu-Huai Liao, Shih-Wei Hung, Sin-Hong Lin, Kun-Shih Lin, Yu-Cheng Lin, Wen-Yen Huang, Wei-Jhe Shen, Chih-Shiang Wu, Sin-Jhong Song, Che-Hsiang Chiu, Sheng-Chang Lin
  • Publication number: 20240153840
    Abstract: A method for forming a package structure is provided. The method includes disposing a semiconductor die over a carrier substrate, wherein a removable film is formed over the semiconductor die, disposing a first stacked die package structure over the carrier substrate, wherein a top surface of the removable film is higher than a top surface of the first stacked die package structure, and removing the removable film to expose a top surface of the semiconductor die, wherein a top surface of the semiconductor die is lower than the top surface of the first stacked die package structure.
    Type: Application
    Filed: January 18, 2024
    Publication date: May 9, 2024
    Inventors: Shin-Puu JENG, Po-Yao LIN, Feng-Cheng HSU, Shuo-Mao CHEN, Chin-Hua WANG
  • Publication number: 20240153979
    Abstract: A method of manufacturing an image sensor structure includes forming an isolation structure in a substrate to divide the substrate into a first region and a second region, forming a first light sensing region in the first region and a second light sensing region in the second region, forming a first gate structure over the first light sensing region and a second gate structure over the second light sensing region, forming gate spacers on sidewalls of the first and second gate structures, and depositing a blocking layer on sidewalls of the gate spacers. The blocking layer has an opening positioned between the first and second gate structures. A source/drain structure is formed directly under the opening in the blocking layer. The method also includes forming an interlayer dielectric layer over the first and second gate structures and the blocking layer.
    Type: Application
    Filed: April 13, 2023
    Publication date: May 9, 2024
    Inventors: Wei Long CHEN, Wen-I HSU, Feng-Chi HUNG, Jen-Cheng LIU, Dun-Nian YAUNG
  • Publication number: 20240154632
    Abstract: A switching circuit and a method of providing the switching circuit are provided. The switching circuit includes a first transmission amplifier, a second transmission amplifier, a third transmission amplifier, and a fourth transmission amplifier. The first transmission amplifier amplifies a first signal at a first connection port and transmits the first signal to a second connection port in a first mode. The second transmission amplifier amplifies a second signal at a third connection port and transmits the second signal to a fourth connection port in the first mode. The third transmission amplifier amplifies the first signal at the first connection port and transmits the first signal to the fourth connection port in the second mode. The fourth transmission amplifier amplifies the second signal at the third connection port and transmits the second signal to the second connection port in the second mode.
    Type: Application
    Filed: December 16, 2022
    Publication date: May 9, 2024
    Applicant: Industrial Technology Research Institute
    Inventors: Yu-Teng Chang, Yu-Cheng Hsu
  • Patent number: 11976170
    Abstract: The present invention provides a polybenzoxazole precursor, which comprises a structure of formula (I): wherein the definitions of Y, Z, R1, i, j, and V are provided herein. By means of the polybenzoxazole precursor, the resin composition of the present invention is able to form a film with high frequency characteristics and high contrast.
    Type: Grant
    Filed: July 5, 2022
    Date of Patent: May 7, 2024
    Assignee: MICROCOSM TECHNOLOGY CO., LTD.
    Inventors: Steve Lien-chung Hsu, Yu-Ching Lin, Yu-Chiao Shih, Hou-Chieh Cheng
  • Publication number: 20240145389
    Abstract: A semiconductor chip includes a first intellectual property block. There are a second intellectual property block and a third intellectual property block around the first intellectual property block. There is a multiple metal layer stack over the first intellectual property block, the second intellectual property block, and the third intellectual property block. An interconnect structure is situated in the upper portion of the multiple metal layer stack. The interconnect structure is configured for connecting the first intellectual property block and the second intellectual property block. In addition, at least a part of the interconnect structure extends across and over the third intellectual property block.
    Type: Application
    Filed: July 28, 2023
    Publication date: May 2, 2024
    Inventors: Li-Chiu WENG, Yew Teck TIEO, Ming-Hsuan WANG, Chia-Cheng CHEN, Wei-Yi CHANG, Jen-Hang YANG, Chien-Hsiung HSU
  • Publication number: 20240145470
    Abstract: A method for processing an integrated circuit includes forming first and second gate all around transistors. The method forms a dipole oxide in the first gate all around transistor without forming the dipole oxide in the second gate all around transistor. This is accomplished by entirely removing an interfacial dielectric layer and a dipole-inducing layer from semiconductor nanosheets of the second gate all around transistor before redepositing the interfacial dielectric layer on the semiconductor nanosheets of the second gate all around transistor.
    Type: Application
    Filed: January 5, 2024
    Publication date: May 2, 2024
    Inventors: Lung-Kun CHU, Mao-Lin HUANG, Chung-Wei HSU, Jia-Ni YU, Kuo-Cheng CHIANG, Kuan-Lun CHENG, Chih-Hao WANG
  • Publication number: 20240146085
    Abstract: The present disclosure provides a battery charging system and method. The battery charging method includes: determining a degree of healthy of a battery module according to an evaluation mechanism; setting a charging standard according to the degree of healthy; by handshaking with a charger, setting a charging voltage for the charger according to the charging standard to charge the battery module; and by the charger, perform a charging operation on the battery module until a fully charged condition is satisfied.
    Type: Application
    Filed: October 31, 2023
    Publication date: May 2, 2024
    Inventors: Tsung-Nan WU, Chih-Hsiang HSU, Wei-Cheng CHEN
  • Publication number: 20240147405
    Abstract: A controlling method for a wireless communication device is provided. The controlling method for the wireless communication device includes: attaching a first Universal Subscriber Identity Module (USIM) to a Long-Term Evolution (LTE) network; determining whether a second USIM is camped on the LTE network; detecting whether a paging collision is happened, if the second USIM is camped on the LTE network; generating a requested International Mobile Subscriber Identity (IMSI) offset for the second USIM, if the paging collision is happened, wherein the requested IMSI offset is 1 or min(T, nB)?1, T is a default paging period and nB is a number of paging occurrences within the default paging period; transmitting an attach request with the requested IMSI offset to the LTE network for the second USIM; receiving a negotiated IMSI offset from the LTE network; and attaching the second USIM to the LTE network with the negotiated IMSI offset.
    Type: Application
    Filed: November 1, 2023
    Publication date: May 2, 2024
    Inventors: Kuan-Yu LIN, Ya-ling Hsu, Wan-Ting Huang, Yi-Han CHUNG, Yi-Cheng CHEN
  • Publication number: 20240138709
    Abstract: A care system monitoring method for sensing the movement state of a bedridden person is provided. The care system monitoring method includes the following stages. Initial-state information is sensed. A first warning signal is issued to remind the caregiver to perform a movement action on the bedridden person when the time that the bedridden person has been in the initial state exceeds the threshold period. First-state information (which is information that is collected when the bedridden person is in the first state) is sensed after completing the movement action. It is determined whether the bedridden person was moved correctly according to the initial-state information and the first-state information. The first-state information is reset as the initial-state information if it is determined that the bedridden person has been moved correctly. A second warning signal is issued if it is determined that the bedridden person has been moved incorrectly.
    Type: Application
    Filed: September 7, 2023
    Publication date: May 2, 2024
    Inventors: Cheng-Hsu CHOU, Wei-Chih LIU, Fang-Iy WU
  • Publication number: 20240145898
    Abstract: An electronic device including a metal casing and at least one antenna module is provided. The metal casing includes at least one window. The at least one antenna module is disposed in the at least one window. The at least one antenna module includes a first radiator and a second radiator. The first radiator includes a feeding end, a first ground end joined to the metal casing, a second ground end, a first portion extending from the feeding end to the first ground end, and a second portion extending from the feeding end to the second ground end. A first coupling gap is between the second radiator and the first portion. A second coupling gap is between at least part of the second radiator and the metal casing, and the second radiator includes a third ground end joined to the metal casing.
    Type: Application
    Filed: September 8, 2023
    Publication date: May 2, 2024
    Applicant: PEGATRON CORPORATION
    Inventors: Chien-Yi Wu, Chao-Hsu Wu, Sheng-Chin Hsu, Chih-Wei Liao, Hau Yuen Tan, Cheng-Hsiung Wu, Shih-Keng Huang
  • Publication number: 20240146883
    Abstract: A method for adjusting a projection parameter and a projection system are disclosed. In the projection system, a processor is configured to drive multiple projectors to project multiple projection images respectively and obtain a full projection range through calculation, select a target area from at least one overlapping area included in the full projection range and obtain a target projection parameter value of the target area, obtain multiple intersection points of the overlapping area on a boundary of the full projection range, define connecting lines between a center point of the target area and the intersection points as dividing lines to divide the full projection range into multiple sub-areas, respectively adjust a projection parameter value of each of the sub-areas according to the target projection parameter value of the target area, and perform projection through the corresponding projector based on the adjusted projection parameter value of each of the sub-areas.
    Type: Application
    Filed: October 26, 2023
    Publication date: May 2, 2024
    Applicant: Coretronic Corporation
    Inventors: Chien-Chun Peng, Chia-Yen Ou, Kang-Shun Hsu, Hsun-Cheng Tu