Abstract: The present disclosure describes embodiments of a memory device with a pre-charge circuit. The memory device can include a memory cell, and the pre-charge circuit can include a first transistor and a second transistor. The first transistor includes a first gate terminal, a first source/drain (S/D) terminal coupled to a reference voltage, and a second S/D terminal coupled to a first terminal of the memory cell. The second transistor includes a second gate terminal, a third S/D terminal coupled to the reference voltage, and a fourth S/D terminal coupled to the second terminal of the memory cell. The first and second transistors are configured to pass the reference voltage in response to the control signal being applied to the first and second gate terminals, respectively.

Abstract: A memory device includes a plurality of memory cells; a word line, connected to one of the plurality of memory cells, that is configured to provide a first WL pulse having a rising edge and a falling edge that define a pulse width of the first WL pulse; a first tracking WL, formed adjacent to the memory cells, that is configured to provide, via being physically or operatively coupled to a bit line (BL) configured to write a logic state to the memory cell, a second WL pulse having a rising edge with a decreased slope; and a first tracking BL, configured to emulate the BL, that is coupled to the first tracking WL such that the pulse width of the first WL pulse is increased based on the decreased slope of the rising edge of the second WL pulse.

Abstract: The disclosure is directed to a memory circuit, an electronic device, and a method of operating the memory circuit. According to an exemplary embodiment, the disclosure is directed to a memory circuit which includes not limited to a voltage equalizing circuit configured to equalize and pre-charge a first data line and a second data line to a reference voltage, a sense amplifier circuit configured to sense a binary data based on a relative voltage between the first data line and the second data line, a read-out latch circuit configured to receive the binary data which is to be transmitted to an external controller, and a write circuit configured to receive a first signal of the first data line and a second signal of the second data line so as to write the first signal to a first bit line and the second signal to a second bit line.

Abstract: The disclosure is directed to a memory circuit, an electronic device, and a method of operating the memory circuit. According to an exemplary embodiment, the disclosure is directed to a memory circuit which includes not limited to a voltage equalizing circuit configured to equalize and pre-charge a first data line and a second data line to a reference voltage, a sense amplifier circuit configured to sense a binary data based on a relative voltage between the first data line and the second data line, a read-out latch circuit configured to receive the binary data which is to be transmitted to an external controller, and a write circuit configured to receive a first signal of the first data line and a second signal of the second data line so as to write the first signal to a first bit line and the second signal to a second bit line.

Abstract: The present disclosure describes various exemplary memory storage devices that can be programmed to write electronic data into one or more memory cells in a write mode of operation and/or to read the electronic data from the one or more memory cells in a read mode of operation. The various exemplary memory storage devices can select various control lines to read the electronic data from the one or more memory cells onto data lines and/or to write the electronic data from these data lines into the one or more memory cells. In some situations, these data lines are charged, also referred to as pre-charged, to a first logical value, such as a logical one, before the various exemplary memory storage devices write the electronic data into the one or more memory cells. During this pre-charging of these data lines, the various exemplary memory storage devices electrically isolate these data lines from specialized circuitry within these exemplary memory storage devices.

Abstract: A memory circuit includes a first memory cell, a second memory cell and a sense amplifier. The sense amplifier is coupled to the first memory cell by a first bit line, and coupled to the second memory cell by a second bit line. The sense amplifier includes a header switch, a footer switch, a first cross-coupled inverter and a second cross-coupled inverter. The header switch has a first size, and is coupled to a first node and a first supply voltage. The footer switch has a second size, and is coupled to a second node and a second supply voltage. The first size is greater than the second size. The first size includes a first number of fins or a first channel width. The second size includes a second number of fins or a second channel width.

Abstract: A level shifter includes: a first inverter configured to receive an input signal in a low voltage domain and shift the input signal from the low voltage domain to a first output signal at a first output terminal in a high voltage domain higher than the low voltage domain in response to a logical high state of a first clock signal in the low voltage domain; a second inverter configured to receive a complement of the input signal and shift the complement of the input signal from the low voltage domain to a second output signal at a second output terminal in the high voltage domain in response to the logical high state; a first NMOS sensing transistor and a second NMOS sensing transistor; a PMOS transistor configured to equalize the first output signal and the second output signal in response to a logical low state of the first clock signal.

Abstract: Devices and methods are provided for word line pulse width control for a static random access memory (SRAM) devices. A control circuit includes a first transistor, an inverter coupled to the first transistor, and a second transistor comprising a gate, a first source/drain terminal and a second source/drain terminal. The second transistor is coupled to the inverter. The first source/drain terminal of the second transistor is coupled in series to the first transistor. The second source/drain terminal is coupled to a decoder driver circuit. The second transistor is configured to charge a load of a common decoder line so as to reduce an effective load of the decoder driver circuit.

Abstract: A method of fabricating an integrated circuit includes identifying an edge device of a plurality of devices, the plurality of devices being part of a first layout including gate structures and diffusion regions, modifying the first layout resulting in a second layout, and fabricating the integrated circuit based on the second layout. Modifying the first layout resulting in the second layout includes adding a dummy device next to the edge device, the dummy device and the edge device having a shared diffusion region, adding a dummy gate structure next to the dummy device, extending the shared diffusion region to at least the dummy device, and performing a design rule check on the second layout. The performing the design rule check considers a gate structure of the dummy device as one of two dummy gate structures next to the edge device.

Abstract: A power switch control circuit includes a supply rail configured to supply power to a memory array. A first header switch couples the supply rail to a first power supply that corresponds to a first power domain. A second header switch couples the supply rail to a second power supply that corresponds to a second power domain. A control circuit is configured to receive a select signal and a shutdown signal, and to output control signals to the first and second header switches to selectively couple the first and second header switches to the first and second power supplies, respectively, in response to the select signal and the shutdown signal. The control circuit is configured to output the control signals to the first and second header switches to disconnect both the first and second header switches from the first and second power supplies in response to the shutdown signal and irrespective of the select signal.

Abstract: A memory macro includes a first memory cell array, a first tracking circuit, a first and a second transistor. The first memory cell array includes rows of memory cells and columns of memory cells. The first tracking circuit includes a first set of memory cells configured as a first set of loading cells responsive to a first control signal, a second set of memory cells configured as a first set of pull-down cells responsive to a second control signal, and a first tracking bit line coupled to the first and second set of memory cells. The first set of pull-down cells or loading cells is configured to track a memory cell of the first memory cell array. The first and second transistor are coupled to the first tracking bit line, and configured to charge the first tracking bit line to a pre-charge voltage level responsive to a tracking enable signal.

Abstract: A semiconductor memory device comprising a plurality of memory cells configured to store digital data and an input multiplexer configured to enable the selection of a particular memory cell from the plurality of memory cells. The semiconductor memory device further comprises a read/write driver circuit configured to read data from the selected memory cell and write data to the selected memory cell, and a write logic block configured to provide logical control to the read/write driver circuit for writing data to the selected of memory cell. The read/write driver circuit may be coupled to the read/write input multiplexer by a data line and an inverted data line and the read and the write operations to the selected memory cell occur over the same data line and inverted data line.

Abstract: A method of making a semiconductor device includes forming a first memory device, connecting a first word line to the first memory device, forming at least a first via, forming a second memory device, connecting a second word line to the second memory device, connecting a bit line to the first memory device and connecting the bit line to the second memory device by the first via. The first and second memory devices are separated by an inter-layer dielectric, and the first via connects the first memory device and the second memory device.

Abstract: A power management circuit suitable for a memory device and a memory device is provided. The power management circuit includes a first logic circuit, a second logic circuit, and a transmission gate. The first logic circuit is configured to receive an inverted first input signal and a second input signal and generates a first output signal. The second logic circuit is configured to receive a first input signal and the second input signal and generates a second output signal. The transmission gate is configured to receive the first output signal and generates a control signal to at least one power transistor coupled between the power management circuit and the memory device. During a standby mode, the power transistor is turned on to make a first voltage equal to a predetermined voltage and during a sleep mode, the control signal is coupled to a first voltage. The predetermined voltage is greater than the first voltage.

Abstract: Disclosed is an input/output circuit for a physical unclonable function generator circuit. In one embodiment, a physical unclonable function (PUF) generator includes: a PUF cell array comprising a plurality of bit cells configured in a plurality of columns and at least one row, and at least one input/output (I/O) circuit each coupled to at least two neighboring columns of the PUF cell array, wherein the at least one I/O circuit each comprises a sense amplifier (SA) with no cross-coupled pair of transistors, wherein the SA comprises two cross-coupled inverters with no access transistor and a SA enable transistor, and wherein the at least one I/O circuit each is configured to access and determine logical states of at least two bit cells in the at least two neighboring columns; and based on the determined logical states of the plurality of bit cells, to generate a PUF signature.

Abstract: A device disclosed includes first and second rows of memory cells, a first data line, and a first continuous data line. The first and second rows of memory cells are arranged in a first sub-bank and a second sub-bank, separated from the first sub-bank, respectively. The first data line is arranged across the first sub-bank and coupled to a first memory cell in the first row of memory cells. The first continuous data line includes a first portion arranged across the first sub-bank and a second portion arranged across the second sub-bank. The first continuous data line is coupled to a second memory cell in the second row of memory cells. The first portion of the first continuous data line is disposed in a first metal layer. The first data line and the second portion of the first continuous data line are in a second metal layer.

Abstract: Devices and methods are provided for word line pulse width control for a static random access memory (SRAM) devices. A control circuit includes a first transistor, an inverter coupled to the first transistor, and a second transistor comprising a gate, a first source/drain terminal and a second source/drain terminal. The second transistor is coupled to the inverter. The first source/drain terminal of the second transistor is coupled in series to the first transistor. The second source/drain terminal is coupled to a decoder driver circuit. The second transistor is configured to charge a load of a common decoder line so as to reduce an effective load of the decoder driver circuit.

Abstract: A level shifter includes: a first inverter configured to receive an input signal in a first voltage domain and shift the input signal from the first voltage domain to a first output signal at a first output terminal in a second voltage domain higher than the first voltage domain in response to a logical high state of a first clock signal in the first voltage domain; a second inverter configured to receive a complement of the input signal and shift the complement of the input signal from the first voltage domain to a second output signal at a second output terminal in the second voltage domain in response to the logical high state; a pair of NMOS sensing transistors; a PMOS transistor configured to equalize the first output signal and the second output signal in response to a logical low state of the first clock signal.

Abstract: A latch formed from a memory cell includes a clock input terminal configured to receive a clock signal, complementary first and second data terminals, and a latch circuit. The latch circuit has first and second inverters. The first inverter has an input terminal coupled to the first data terminal, and the second inverter has an input terminal coupled to the second data terminal. A first pass gate transistor is coupled between an output terminal of the second inverter and the first data terminal. A second pass gate transistor is coupled between an output terminal of the first inverter and the second data terminal. The first and second pass gate transistors each have a gate terminal coupled to the clock input terminal. The input terminal of the first inverter is not directly connected to the output terminal of the second inverter, and the input terminal of the second inverter is not directly connected to the output terminal of the first inverter.

Abstract: A clock circuit includes a latch circuit, a memory state latch circuit, a memory state trigger circuit and a clock trigger circuit. The latch circuit is configured to latch an enable signal, and to generate a latch output signal based on a first clock signal or an output clock signal. The memory state latch circuit is configured to generate the output clock signal responsive to a first control signal. The memory state trigger circuit is coupled to the memory state latch circuit, and configured to adjust the output clock signal responsive to the latch output signal. The clock trigger circuit is coupled to the latch circuit or the memory state trigger circuit by a first node, configured to generate the first clock signal responsive to a second clock signal, and configured to control the latch circuit and the memory state trigger circuit based on the first clock signal.