Abstract: Provided are a passivation layer for forming a semiconductor bonding structure, a sputtering target making the same, a semiconductor bonding structure and a semiconductor bonding process. The passivation layer is formed on a bonding substrate by sputtering the sputtering target; the passivation layer and the sputtering target comprise a first metal, a second metal or a combination thereof. The bonding substrate comprises a third metal. Based on a total atom number of the surface of the passivation layer, O content of the surface of the passivation layer is less than 30 at %; the third metal content of the surface of the passivation layer is less than or equal to 10 at %. The passivation layer has a polycrystalline structure. The semiconductor bonding structure sequentially comprises a first bonding substrate, a bonding layer and a second bonding substrate: the bonding layer is mainly formed by the passivation layer and the third metal.

Abstract: A manufacturing method of a display device includes forming light emitting components on a first substrate, the light emitting components include a first side and a second side, and the second side is away from the first substrate; forming a circuit layer on the first substrate and on the second side of the light emitting components; forming a first protective layer on the circuit layer and forming an insulating layer on the first protective layer; removing the first substrate after forming a second substrate on the insulating layer; forming a black matrix layer on the first side of the light emitting components, and the black matrix layer includes openings; forming light conversion layers in the openings of the black matrix layer; forming a second protective layer on the black matrix layer and the light conversion layers; and forming a third substrate on the second protective layer.

Abstract: An apparatus includes a six-axis correction stage, an auto-collimation measurement device, a light splitter, a telecentric image measurement device, and a controller. The six-axis correction stage carries a device under test; the auto-collimation measurement device is arranged above the six-axis correction stage along a measurement optical axis; the light splitter is arranged on the measurement optical axis and is interposed between the six-axis correction stage and the auto-collimation measurement device. A method controls the six-axis correction stage to correct rotation errors in at least two degrees of freedom of the device under test according to a measurement result of the auto-collimation measurement device, and controls the six-axis correction stage to correct translation and yaw errors in at least three degrees of freedom of the device under test according to a measurement result of the telecentric image measurement device by means of the controller.

Abstract: A bathroom rack may include a main body and at least two positioning units. The main body has a hanging portion at a rear portion thereof. Each of the positioning unit has a connecting head, a screw, and a cover. The connecting head has a first end and a second end, and the second end has a threaded connecting section. The cover has an inner hole that has a threaded connecting portion corresponding to the connecting section. A notch is formed at a periphery near a center portion of the positioning unit, and a locking hole toward the direction of the first end is located at a rear end of the notch, and the main body is configured to horizontally slide into the notch of the connecting head through the hanging portion to engage with the connecting head.

Abstract: A bathroom rack may include a main body and at least two positioning units. The main body has a hanging portion at a rear portion thereof. Each of the positioning unit has a connecting head, a screw, and a cover. The connecting head has a first end and a second end, and the second end has a threaded connecting section. The cover has an inner hole that has a threaded connecting portion corresponding to the connecting section. A notch is formed at a periphery near a center portion of the positioning unit, and a locking hole toward the direction of the first end is located at a rear end of the notch, and the main body is configured to horizontally slide into the notch of the connecting head through the hanging portion to engage with the connecting head.