Abstract: A continuous time delta sigma modulator is described in this application. In one example, the continuous time delta sigma modulator includes: a quantizer, a buffer module, a randomizer, and a reference module. The quantizer includes a comparator that generates a digital output based on a comparison of a reference potential with an input generated based on a sample of an analog signal. The buffer module stores the digital output for a predetermined delay period and outputs the digital output after the predetermined delay period as a delayed digital output. The randomizer randomizes the delayed digital output to generate a randomized digital output. The reference module modifies the reference potential based on the randomized digital output.

Abstract: A continuous time delta sigma modulator is disclosed. In one example, the continuous time delta sigma modulator includes: a quantizer, a buffer module, a randomizer, and a reference module. The quantizer includes a comparator that generates a digital output based on a comparison of a reference potential with an input generated based on a sample of an analog signal. The buffer module stores the digital output for a predetermined delay period and outputs the digital output after the predetermined delay period as a delayed digital output. The randomizer randomizes the delayed digital output to generate a randomized digital output. The reference module modifies the reference potential based on the randomized digital output.

Abstract: A multi-chip module and a method for manufacturing the multi-chip module that mitigates wire breakage. A first semiconductor chip is mounted and wirebonded to a support substrate. A spacer is coupled to the first semiconductor chip. A support material is disposed on the spacer and a second semiconductor chip is positioned on the support material. The second semiconductor chip is pressed into the support material squeezing it into a region adjacent the spacer and between the first and second semiconductor chips. Alternatively, the support material is disposed on the first semiconductor chip and a die attach material is disposed on the spacer. The second semiconductor chip is pressed into the die attach material and the support material, squeezing a portion of the support material over the spacer edges. Wirebonds are formed between the support substrate and the first and second semiconductor chips.