Abstract: A deciding system for stopping and dispatching vehicles includes a memory and a cloud processing unit. The cloud processing unit is configured to determine one of a fixed vehicle dispatching algorithm and a non-fixed vehicle dispatching algorithm to be executed by the cloud processing unit according to a temporary car-hailing order message; execute the one of the fixed vehicle dispatching algorithm and the non-fixed vehicle dispatching algorithm to generate a stop message corresponding to a stop station according to a dispatch parameter set from the memory, and generate a stop number set corresponding to the first vehicle according to the stop message; and execute the one of the fixed vehicle dispatching algorithm and the non-fixed vehicle dispatching algorithm to generate a dispatch message according to the dispatch parameter set, and generate a dispatch vehicle number set corresponding to the second vehicle according to the dispatch message.

Abstract: A heat dissipation system of an electronic device including a body, a plurality of heat sources disposed in the body, and at least one centrifugal heat dissipation fan disposed in the body is provided. The centrifugal heat dissipation fan includes a housing and an impeller disposed in the housing on an axis. The housing has at least one inlet on the axis and has a plurality of outlets in different radial directions, and the plurality of outlets respectively correspond to the plurality of heat sources.

Abstract: A package structure including a photonic, an electronic die, an encapsulant and a waveguide is provided. The photonic die includes an optical coupler. The electronic die is electrically coupled to the photonic die. The encapsulant laterally encapsulates the photonic die and the electronic die. The waveguide is disposed over the encapsulant and includes an upper surface facing away from the encapsulant. The waveguide includes a first end portion and a second end portion, the first end portion is optically coupled to the optical coupler, and the second end portion has a groove on the upper surface.

Abstract: A package includes a photonic layer on a substrate, the photonic layer including a silicon waveguide coupled to a grating coupler; an interconnect structure over the photonic layer; an electronic die and a first dielectric layer over the interconnect structure, where the electronic die is connected to the interconnect structure; a first substrate bonded to the electronic die and the first dielectric layer; a socket attached to a top surface of the first substrate; and a fiber holder coupled to the first substrate through the socket, where the fiber holder includes a prism that re-orients an optical path of an optical signal.

Abstract: A semiconductor package includes a first die stack structure and a second die stack structure, an insulating encapsulation, a redistribution structure, at least one prism structure and at least one reflector. The first die stack structure and the second die stack structure are laterally spaced apart from each other along a first direction, and each of the first die stack structure and the second die stack structure comprises an electronic die; and a photonic die electronically communicating with the electronic die. The insulating encapsulation laterally encapsulates the first die stack structure and the second die stack structure. The redistribution structure is disposed on the first die stack structure, the second die stack structure and the insulating encapsulation, and electrically connected to the first die stack structure and the second die stack structure. The at least one prism structure is disposed within the redistribution structure and optically coupled to the photonic die.

Abstract: A centrifugal heat dissipation fan including a housing and an impeller disposed in the housing on an axis is provided. The housing has at least one inlet on the axis and has a plurality of outlets in different radial directions. A heat dissipation system of an electronic device is also provided.

Abstract: A clock with luminous hands has a clock panel with a front clock surface and a rear surface to which a hand-driving assembly and a power inverter are mounted. The hand-driving assembly has a pin protruding through the clock panel and extending from the front clock surface. An hour hand and a minute hand both formed by single-pole CCFLs are mounted around the pin with one end. When the power inverter produces a high voltage conducting to the pin, both the hands are energized to generate light.

Abstract: A clock with luminous hands has a clock panel with a front clock surface and a rear surface to which a hand-driving assembly and a power inverter are mounted. The hand-driving assembly has a pin protruding through the clock panel and extending from the front clock surface. An hour hand and a minute hand both formed by single-pole CCFLs are mounted around the pin with one end. When the power inverter produces a high voltage conducting to the pin, both the hands are energized to generate light.

Abstract: A packaging structure of a chip is disclosed. The packaging structure has high heat conductivity and a preferred electric insulation and can protect the chip. The packaging structure includes a chip, a lead frame, a signal transmission device for being connected to the chip and lead frame, a protecting gel layer, a diamond-like carbon layer, and an electric insulating layer. By aforesaid structure, when the chip is working, the heat from the chip is dissipated through the diamond-like carbon layer under the hollowed portion so that a working temperature of the chip is retained in a normal temperature.