Patents by Inventor Cheng-Ming Lee
Cheng-Ming Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12010811Abstract: A cable clip assembly for a computing device includes a primary clip with a primary surface between first and second primary ends. The first side extends in a first transverse direction from the first primary end, and the second side extends in the first transverse direction from the second primary end. Cable-receiving holes are arranged longitudinally between the first and second sides. A secondary clip has a secondary surface and is attached to the primary clip via the first and second sides. The secondary clip is movable relative to the primary clip between a cable installation position and a secured cable position, and is removably attached at one or more of the first and second sides. A compressible interface is attached to the primary surface, includes a flexible material that compresses when subjected to an installation force, and creates an airflow barrier in an installed position within the computing device.Type: GrantFiled: March 30, 2023Date of Patent: June 11, 2024Assignee: QUANTA COMPUTER INC.Inventors: Chao-Jung Chen, Chih-Hsiang Lee, Chih-Ming Chen, Cheng-Hsiang Huang
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Publication number: 20240184195Abstract: In a method of manufacturing a photo mask, a resist layer is formed over a mask blank, which includes a mask substrate, a phase shift layer disposed on the mask substrate and a light blocking layer disposed on the phase shift layer. A resist pattern is formed by using a lithographic operation. The light blocking layer is patterned by using the resist pattern as an etching mask. The phase shift layer is patterned by using the patterned light blocking layer as an etching mask. A border region of the mask substrate is covered with an etching hard cover, while a pattern region of the mask substrate is opened. The patterned light blocking layer in the pattern region is patterned through the opening of the etching hard cover. A photo-etching operation is performed on the pattern region to remove residues of the light blocking layer.Type: ApplicationFiled: January 12, 2024Publication date: June 6, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chun-Chieh TIEN, Cheng-Hsuen CHIANG, Chih-Ming CHEN, Cheng-Ming LIN, Yen-Wei HUANG, Hao-Ming CHANG, Kuo-Chin LIN, Kuan-Shien LEE
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Publication number: 20240145596Abstract: A device includes a fin extending from a semiconductor substrate; a gate stack over the fin; a first spacer on a sidewall of the gate stack; a source/drain region in the fin adjacent the first spacer; an inter-layer dielectric layer (ILD) extending over the gate stack, the first spacer, and the source/drain region, the ILD having a first portion and a second portion, wherein the second portion of the ILD is closer to the gate stack than the first portion of the ILD; a contact plug extending through the ILD and contacting the source/drain region; a second spacer on a sidewall of the contact plug; and an air gap between the first spacer and the second spacer, wherein the first portion of the ILD extends across the air gap and physically contacts the second spacer, wherein the first portion of the ILD seals the air gap.Type: ApplicationFiled: January 2, 2024Publication date: May 2, 2024Inventors: Su-Hao Liu, Kuo-Ju Chen, Kai-Hsuan Lee, I-Hsieh Wong, Cheng-Yu Yang, Liang-Yin Chen, Huicheng Chang, Yee-Chia Yeo, Syun-Ming Jang, Meng-Han Chou
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Publication number: 20240102194Abstract: A plating system and a method thereof are disclosed. The plating system performs a N-stage plating drilling filling process in which a M-th stage plating drilling filling process with a M-th current density is performed on a hole of a substrate for a M-th plating time to form a M-th plating layer on the to-be-plated layer, wherein N is a positive integer equal to or greater than 3, and M is a positive integer positive integer in a range of 1 to N. Therefore, the technical effect of providing a higher drilling filling rate than conventional plating filling technology under a condition that a total thickness of plating layers is fixed can be achieved.Type: ApplicationFiled: August 7, 2023Publication date: March 28, 2024Inventors: Cheng-EN HO, Yu-Lian CHEN, Cheng-Chi WANG, Yu-Jen CHANG, Yung-Sheng LU, Cheng-Yu LEE, Yu-Ming LIN
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Publication number: 20240098959Abstract: A method includes etching a first semiconductor fin and a second semiconductor fin to form first recesses. The first and the second semiconductor fins have a first distance. A third semiconductor fin and a fourth semiconductor fin are etched to form second recesses. The third and the fourth semiconductor fins have a second distance equal to or smaller than the first distance. An epitaxy is performed to simultaneously grow first epitaxy semiconductor regions from the first recesses and second epitaxy semiconductor regions from the second recesses. The first epitaxy semiconductor regions are merged with each other, and the second epitaxy semiconductor regions are separated from each other.Type: ApplicationFiled: November 22, 2023Publication date: March 21, 2024Inventors: Kai-Hsuan Lee, Chia-Ta Yu, Cheng-Yu Yang, Sheng-Chen Wang, Sai-Hooi Yeong, Feng-Cheng Yang, Yen-Ming Chen
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Publication number: 20220223743Abstract: Semiconductor structures and methods are provided. A semiconductor structure according to the present disclosure includes a first fin structure and a second fin structure over a substrate, a first source/drain feature disposed over the first fin structure and a second source/drain feature disposed over the second fin structure, a dielectric feature disposed over the first source/drain feature, and a contact structure formed over the first source/drain feature and the second source/drain feature. The contact structure is electrically coupled to the second source/drain feature and is separated from the first source/drain feature by the dielectric feature.Type: ApplicationFiled: October 15, 2021Publication date: July 14, 2022Inventors: Chung-Hao Cai, Yen-Jun Huang, Ting Fang, Chia-Hsien Yao, Cheng-Ming Lee, Fu-Kai Yang, Mei-Yun Wang
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Publication number: 20220156171Abstract: To predict a temperature of a chip of a PCIe card of a server, use a gated recurrent unit of a recurrent neural network to define a temperature prediction model for the chip, collect training data of the temperature prediction model according to mutual response changes of control variables, use the training data to train the temperature prediction model to obtain a training result close to a measured temperature of the chip and evaluate the training result to obtain features that best reflect the temperature change of the chip, perform an error analysis on the training result to obtain a set of key features from the features, form a temperature predictor according to the set of key features and the temperature prediction model, and generate a predicted temperature of the chip by the temperature predictor.Type: ApplicationFiled: June 7, 2021Publication date: May 19, 2022Inventors: Cheng-Ming Lee, Kai-Yang Tung
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Patent number: 11333156Abstract: A method for controlling an angular speed of a fan of a computer system includes obtaining an error value; obtaining an adjusted error value by adjusting the error value using an adjustment constant when an absolute value of the error value is not larger than a predetermined value; obtaining a total output value according to at least the adjusted error value; and controlling the angular speed of the fan according to the total output value. The total output value is positively related to a pulse width modulation value, and the angular speed of the fan increases when the pulse width modulation value increases.Type: GrantFiled: December 8, 2019Date of Patent: May 17, 2022Assignees: Inventec (Pudong) Technology Corp., Inventec CorporationInventors: Cheng-Ming Lee, Kai-Yang Tung
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Publication number: 20210372004Abstract: A diamond manufacturing apparatus for forming at least one diamond is provided. The diamond manufacturing apparatus comprises a growth base and an electric field device. The growth base comprises a top portion and a bottom portion opposite to each other, and the top portion has a growth surface that is concave toward the bottom portion. A plurality of electric field lines of an electric field that is generated by the electric field device are substantially perpendicular to the growth surface.Type: ApplicationFiled: June 2, 2021Publication date: December 2, 2021Inventors: Chih-Shiue YAN, Cheng-Ming LEE
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Patent number: 11032938Abstract: A temperature control device comprises a fan, a temperature sensor, a modeling circuit and a PID controller, with the PID controller connected with the fan, the temperature sensor and the modeling circuit. The fan drives airflows for controlling the temperature of a controlled region. The temperature sensor is disposed in the controlled region and obtains a detected temperature indicating the temperature of the controlled region. The modeling circuit obtains at least one cooling parameter group based on a transfer function. The PID controller controls the fan based on an initial parameter group when the detected temperature is lower than a first temperature, and controls the fan based on said at least one cooling parameter group when the detected temperature is equal to or higher than the first temperature. The initial parameter group comprises initial parameters, with the value of each of the initial parameters equal to a preset value.Type: GrantFiled: January 10, 2018Date of Patent: June 8, 2021Assignees: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATIONInventors: Cheng-Ming Lee, Kai-Yang Tung, Mao-Ching Lin
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Publication number: 20200386236Abstract: A method for controlling an angular speed of a fan of a computer system includes obtaining an error value; obtaining an adjusted error value by adjusting the error value using an adjustment constant when an absolute value of the error value is not larger than a predetermined value; obtaining a total output value according to at least the adjusted error value; and controlling the angular speed of the fan according to the total output value. The total output value is positively related to a pulse width modulation value, and the angular speed of the fan increases when the pulse width modulation value increases.Type: ApplicationFiled: December 8, 2019Publication date: December 10, 2020Inventors: Cheng-Ming Lee, Kai-Yang Tung
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Patent number: 10379552Abstract: After a temperature point of the cooling fan is set according to a plurality of temperatures corresponding to a plurality of first consecutive time intervals, control a duty cycle of the cooling fan according to the temperature point, acquire temperature variation data of the cooling fan during a plurality of second consecutive time intervals, generate a gain factor and a frequency factor of the cooling fan according to the temperature variation data, and generate a proportional gain factor, an integral time factor and a derivative time factor of a proportional-integral-derivative controller of the cooling fan according to the gain factor and the frequency factor of the cooling fan. The plurality of first consecutive time intervals are followed by the plurality of second consecutive time intervals.Type: GrantFiled: March 27, 2017Date of Patent: August 13, 2019Assignees: Inventec (Pudong) Technology Corp., Inventec CorporationInventors: Cheng-Ming Lee, Kai-Yang Tung, Mao-Ching Lin
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Patent number: 10362821Abstract: A gift packaging device includes a support member, a stem slidably engaged through the support member and moveable up and down relative to the support member, a carrier member disposed on the stem for supporting a gift, a number of flaps pivotally attached to the support member and rotateable relative to the support member between a folded position where the gift is shielded with the flaps, and an opened position where the gift is viewable, and a number of links are coupled between the stem and the flaps for allowing the flaps to be rotated relative to the support member between the folded position and the opened position when the stem is moved relative to the support member of the support device.Type: GrantFiled: August 17, 2017Date of Patent: July 30, 2019Assignee: Imprint Diamond Corp.Inventor: Cheng Ming Lee
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Publication number: 20190159366Abstract: A temperature-controlling method adapted to a server comprises: getting a detected temperature; selecting a schedule from a plurality of schedules according to the detected temperature by a gain-scheduling unit, wherein the plurality of schedules comprises an initial parameter set and at least one cooling parameter set; calculating and outputting a control signal of fan speed according to the initial parameter set or said at least one cooling parameter set by a PID controller; and adjusting a rotating speed according to the control signal of fan speed by a fan.Type: ApplicationFiled: January 10, 2018Publication date: May 23, 2019Applicants: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATIONInventors: Cheng-Ming LEE, Kai-Yang TUNG, Mao-Ching LIN, Shan-Heng WU, Wei-Yu CHEN
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Publication number: 20190132990Abstract: A temperature control device comprises a fan, a temperature sensor, a modeling circuit and a PID controller, with the PID controller connected with the fan, the temperature sensor and the modeling circuit. The fan drives airflows for controlling the temperature of a controlled region. The temperature sensor is disposed in the controlled region and obtains a detected temperature indicating the temperature of the controlled region. The modeling circuit obtains at least one cooling parameter group based on a transfer function. The PID controller controls the fan based on an initial parameter group when the detected temperature is lower than a first temperature, and controls the fan based on said at least one cooling parameter group when the detected temperature is equal to or higher than the first temperature. The initial parameter group comprises initial parameters, with the value of each of the initial parameters equal to a preset value.Type: ApplicationFiled: January 10, 2018Publication date: May 2, 2019Applicants: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATIONInventors: Cheng-Ming LEE, Kai-Yang TUNG, Mao-Ching LIN
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Publication number: 20190053559Abstract: A gift packaging device includes a support member, a stem slidably engaged through the support member and moveable up and down relative to the support member, a carrier member disposed on the stem for supporting a gift, a number of flaps pivotally attached to the support member and rotateable relative to the support member between a folded position where the gift is shielded with the flaps, and an opened position where the gift is viewable, and a number of links are coupled between the stem and the flaps for allowing the flaps to be rotated relative to the support member between the folded position and the opened position when the stem is moved relative to the support member of the support device.Type: ApplicationFiled: August 17, 2017Publication date: February 21, 2019Inventor: Cheng Ming LEE
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Publication number: 20180088610Abstract: After a temperature point of the cooling fan is set according to a plurality of temperatures corresponding to a plurality of first consecutive time intervals, control a duty cycle of the cooling fan according to the temperature point, acquire temperature variation data of the cooling fan during a plurality of second consecutive time intervals, generate a gain factor and a frequency factor of the cooling fan according to the temperature variation data, and generate a proportional gain factor, an integral time factor and a derivative time factor of a proportional-integral-derivative controller of the cooling fan according to the gain factor and the frequency factor of the cooling fan. The plurality of first consecutive time intervals are followed by the plurality of second consecutive time intervals.Type: ApplicationFiled: March 27, 2017Publication date: March 29, 2018Inventors: Cheng-Ming Lee, Kai-Yang Tung, Mao-Ching Lin
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Publication number: 20130127338Abstract: A drive circuit structure for LED lamp tube is disclosed, wherein the LED lamp tube comprises a lampshade, at least an LED lamp strap and at least a drive circuit structure. The LED lamp strap is disposed inside the lampshade, and drive circuit structure connected with the LED lamp strap is disposed on any side within the lampshade. Moreover, the drive circuit structure includes multiple general-sized electronic components, at least a large-sized electronic component and a drive circuit board, wherein such general-sized electronic components are inserted on a plane of the drive circuit board, and the large-sized electronic component is disposed upright on any side of the drive circuit board. Accordingly, though the large-sized electronic component becomes voluminous, by disposing it upright on one side of the drive circuit board, it is possible to prevent the drive circuit structure from occupying larger accommodation space due to the large-sized electronic component.Type: ApplicationFiled: June 12, 2012Publication date: May 23, 2013Inventors: Cheng-Ming LEE, Ruei-Jhih Jheng, Feng-Pin Lee
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Publication number: 20130128567Abstract: An improved light emitting diode (LED) lamp tube structure, comprising a lampshade, at least an LED lamp strap installed inside the lampshade and at least a drive circuit installed on any side of the interior of the lampshade, wherein the drive circuit includes multiple electronic components and a drive circuit board, in which the electronic components are insertion installed on one side of the drive circuit board, and at least an LED is insertion installed on the other side of the drive circuit board. Therefore, when the drive circuit drives the LED lamp strap to illuminate, it also drives the LEDs insertion installed on the other side of the drive circuit board to light up at the same time so the entire lampshade can illuminate completely.Type: ApplicationFiled: August 22, 2012Publication date: May 23, 2013Inventors: Cheng-Ming Lee, Chun-Chen Liu, Yu-Kuan Chang
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Publication number: 20120167733Abstract: A cooling device for a diamond-wire cutting system includes a fluid retarding space as a cooling tank enclosed and defined by one or more surfaces for temporarily holding a cooling fluid. The surfaces provide a closed or semi-open sidewall that allows a cutting part of a diamond wire for cutting a workpiece to pass through the cooling tank and get immersed in the cooling fluid. A sorting collector is connected to the cooling tank. Thereby, cutting the hard-brittle workpiece is always performed in the cooling fluid, so as to prevent the cooling fluid and cutting chips from splashing, and improve heat dissipation and dust removal, thereby enhancing the cutting capability and efficiency. The tooled workpiece has cut surfaces with improved smoothness. The sorting collector performs solid-liquid separation to the cooling fluid containing cutting chips, so that the cutting chips and the cooling fluid can be recycled.Type: ApplicationFiled: March 2, 2011Publication date: July 5, 2012Inventors: Cheng Ming Lee, Ping Feng Lee