Patents by Inventor Cheng-Nan Lee
Cheng-Nan Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240177893Abstract: An over-current protection device includes a heat-sensitive layer and an electrode layer. The electrode layer includes a top metal layer and a bottom metal layer, and the heat-sensitive layer attached therebetween. The heat-sensitive layer exhibits a positive temperature coefficient (PTC) characteristic and includes a polymer matrix and a conductive filler. The polymer matrix includes a polyolefin-based homopolymer and a polyolefin-based copolymer. The polyolefin-based homopolymer has a first coefficient of thermal expansion (CTE), and the polyolefin-based copolymer has a second CTE lower than the first CTE. The polyolefin-based homopolymer and the polyolefin-based copolymer together form an interpenetrating polymer network (IPN).Type: ApplicationFiled: May 3, 2023Publication date: May 30, 2024Inventors: CHENG-YU TUNG, Chia-Yuan Lee, HSIU-CHE YEN, CHEN-NAN LIU, YUNG-HSIEN CHANG, Yao-Te Chang, FU-HUA CHU, Takashi Hasunuma
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Patent number: 11990258Abstract: An over-current protection device includes first and second electrode layers and a PTC material layer laminated therebetween. The PTC material layer includes a polymer matrix, a conductive filler, and a titanium-containing dielectric filler. The polymer matrix has a fluoropolymer. The titanium-containing dielectric filler has a compound represented by a general formula of MTiO3, wherein the M represents transition metal or alkaline earth metal. The total volume of the PTC material layer is calculated as 100%, and the titanium-containing dielectric filler accounts to for 5-15% by volume of the PTC material layer.Type: GrantFiled: September 28, 2022Date of Patent: May 21, 2024Assignee: POLYTRONICS TECHNOLOGY CORP.Inventors: Hsiu-Che Yen, Yung-Hsien Chang, Cheng-Yu Tung, Chen-Nan Liu, Chia-Yuan Lee, Yu-Chieh Fu, Yao-Te Chang, Fu-Hua Chu
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Publication number: 20240145132Abstract: An over-current protection device includes first and second electrode layers and a PTC material layer laminated therebetween. The PTC material layer includes a polymer matrix, and a conductive filler. The polymer matrix has a fluoropolymer. The total volume of the PTC material layer is calculated as 100%, and the fluoropolymer accounts for 47-62% by volume of the PTC material layer. The fluoropolymer has a melt viscosity higher than 3000 Pa·s.Type: ApplicationFiled: March 16, 2023Publication date: May 2, 2024Inventors: CHENG-YU TUNG, CHEN-NAN LIU, Chia-Yuan Lee, HSIU-CHE YEN, YUNG-HSIEN CHANG, Yao-Te Chang, FU-HUA CHU
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Publication number: 20240145133Abstract: An over-current protection device includes a first metal layer, a second metal layer and a heat-sensitive layer laminated therebetween. The heat-sensitive layer exhibits a positive temperature coefficient (PTC) characteristic and includes a polymer matrix and a first conductive filler. The polymer matrix includes a polyolefin-based polymer and a fluoropolymer. The fluoropolymer has a melt flow index higher than 1.9 g/10 min, and the polyolefin-based polymer and the fluoropolymer together form an interpenetrating polymer network (IPN). The first conductive filler has a metal-ceramic compound dispersed in the polymer matrix.Type: ApplicationFiled: April 5, 2023Publication date: May 2, 2024Inventors: CHEN-NAN LIU, YUNG-HSIEN CHANG, CHENG-YU TUNG, HSIU-CHE YEN, Chia-Yuan LEE, Yao-Te CHANG, FU-HUA CHU
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Publication number: 20240127988Abstract: An over-current protection device includes a first metal layer, a second metal layer and a heat-sensitive layer laminated therebetween. The heat-sensitive layer exhibits a positive temperature coefficient (PTC) characteristic and includes a first polymer and a conductive filler. The first polymer consists of polyvinylidene difluoride (PVDF), and PVDF exists in different phases such as ?-PVDF, ?-PVDF and ?-PVDF. The total amount of ?-PVDF, ?-PVDF and ?-PVDF is calculated as 100%, and the amount of ?-PVDF accounts for 48% to 55%. The conductive filler has a metal-ceramic compound.Type: ApplicationFiled: March 2, 2023Publication date: April 18, 2024Inventors: HSIU-CHE YEN, YUNG-HSIEN CHANG, CHENG-YU TUNG, Chia-Yuan Lee, CHEN-NAN LIU, Yao-Te Chang, FU-HUA CHU
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Publication number: 20240127989Abstract: An over-current protection device includes a first metal layer, a second metal layer and a heat-sensitive layer laminated therebetween. The heat-sensitive layer exhibits a positive temperature coefficient (PTC) characteristic and includes a first polymer and a conductive filler. The first polymer consists of polyvinylidene difluoride (PVDF), and PVDF exists in different phases such as ?-PVDF, ?-PVDF and ?-PVDF. The total amount of ?-PVDF, ?-PVDF and ?-PVDF is calculated as 100%, and the amount of ?-PVDF accounts for 33% to 42%.Type: ApplicationFiled: January 25, 2023Publication date: April 18, 2024Inventors: CHIA-YUAN LEE, CHENG-YU TUNG, HSIU-CHE YEN, CHEN-NAN LIU, YUNG-HSIEN CHANG, YAO-TE CHANG, FU-HUA CHU
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Patent number: 11960332Abstract: An electronic device including a hinge module, a first body, a second body, and a flexible display assembled to the first body and the second body is provided. Each of the first body and the second body is pivoted and slidably connected to the hinge module, and a cover of the hinge module is exposed out of the first body and the second body. The first body and the second body are rotated relatively via the hinge module to bend or flatten the flexible display, when the flexible display is bending from a flat state, a bending portion of the flexible display leans against the cover and pushes the cover away from the first body and the second body.Type: GrantFiled: November 30, 2022Date of Patent: April 16, 2024Assignee: Acer IncorporatedInventors: Yi-Ta Huang, Cheng-Nan Ling, Wu-Chen Lee, Wen-Chieh Tai, Kun-You Chuang
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Patent number: 7542742Abstract: A down converter includes a housing, a down conversion circuit, and a shielding structure. The down conversion circuit is disposed in the housing. The shielding structure is disposed above the down conversion circuit. The shielding structure comprises a cavity and a fine-tunable mechanism. A size of the cavity is adjusted by the fine-tunable mechanism.Type: GrantFiled: June 16, 2005Date of Patent: June 2, 2009Assignee: Wistron NeWeb CorporationInventors: Huang-Chen Shih, Cheng-Nan Lee, Tsung-Ying Chung, Yung-Chin Chen, Hung-Yuan Lin
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Patent number: 7324793Abstract: A wireless transmission device capable of transmitting media from different channels concurrently. The transmitter of the device places the inputted TV signals and an audio/video signal on different segments of a frequency spectrum, combines the signals of all segments into one combined signal, and transmits the combined signal as a radio frequency signal so as to transmit signals from different channels at the same time. Meanwhile, a controller in the receiver of the device selects a needed channel signal from the received radio frequency signal according to a selection signal. Therefore with one A/V transmitter and multiple A/V receivers, multiple-channel media transmission and multiple-channel media reception is achieved.Type: GrantFiled: April 11, 2005Date of Patent: January 29, 2008Assignee: Wistron NeWeb CorporationInventors: Cheng-Nan Lee, Chen-Chia Huang
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Publication number: 20060183452Abstract: A wireless transmission device capable of transmitting media from different channels concurrently. The transmitter of the device places the inputted TV signals and an audio/video signal on different segments of a frequency spectrum, combines the signals of all segments into one combined signal, and transmits the combined signal as a radio frequency signal so as to transmit signals from different channels at the same time. Meanwhile, a controller in the receiver of the device selects a needed channel signal from the received radio frequency signal according to a selection signal. Therefore with one A/V transmitter and multiple A/V receivers, multiple-channel media transmission and multiple-channel media reception is achieved.Type: ApplicationFiled: April 11, 2005Publication date: August 17, 2006Inventors: Cheng-Nan Lee, Chen-Chia Huang
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Publication number: 20060183445Abstract: A down converter includes a housing, a down conversion circuit, and a shielding structure. The down conversion circuit is disposed in the housing. The shielding structure is disposed above the down conversion circuit. The shielding structure comprises a cavity and a fine-tunable mechanism. A size of the cavity is adjusted by the fine-tunable mechanism.Type: ApplicationFiled: June 16, 2005Publication date: August 17, 2006Inventors: Huang-Chen Shih, Cheng-Nan Lee, Tsung-Ying Chung, Yung-Chin Chen, Hung-Yuan Lin
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Publication number: 20050212616Abstract: A radiowave receiving device including a waveguide, a probe, a circuit, and an impedance matching mechanism. The waveguide has a cavity for conveying radiowave. The probe, disposed in the cavity, converts radiowave conveyed by the waveguide into a circuit signal. The circuit, electrically coupled to the probe, receives the circuit signal. The impedance matching mechanism provides the waveguide with an impedance match with respect to the circuit. Affixed to the waveguide, the impedance matching mechanism includes a tuning element in a spatial position.Type: ApplicationFiled: March 15, 2005Publication date: September 29, 2005Inventors: Cheng-Nan Lee, Wei-Ya Liao
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Patent number: 6111547Abstract: This invention is a compact and cost effective multiple-feed signal receiver for use in conjunction with a parabolic dish antenna to receive electromagnetic signals from more than one satellite clusters. The multiple-feed signal receiver has a multi-layer structure to integrate circuit boards for different frequency bands or the same frequency band for different signal processing within a limited cross-section and to isolate these boards from signal interference with one another.Type: GrantFiled: October 13, 1998Date of Patent: August 29, 2000Assignees: Texas Instruments-Acer Incorporated, Hsinchu Science-Based Industrial ParkInventors: Jiahn-Rong Gau, Cheng-Geng Jan, Hsin-Tang Liu, Cheng-Nan Lee