Patents by Inventor Cheng-Rong Yi-Li

Cheng-Rong Yi-Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7811938
    Abstract: An exemplary method for forming gaps in a micromechanical device includes providing a substrate. A first material layer is deposited over the substrate. A sacrificial layer is deposited over the first material layer. A second material layer is deposited over the sacrificial layer such that at least a portion of the sacrificial layer is exposed. The exposed portion of the sacrificial layer is etched by dry etching. The remaining portion of the sacrificial layer is etched by wet etching to form gaps between the first material layer and the second material layer. One or more bulges are formed at one side of the second material layer facing the first material layer, and are a portion of the sacrificial layer remaining after the wet etching.
    Type: Grant
    Filed: October 9, 2008
    Date of Patent: October 12, 2010
    Assignees: Tsinghua University, Hon Hai Precision Industry Co., Ltd.
    Inventors: Cheng-Rong Yi-Li, Qun-Qing Li, Shou-Shan Fan
  • Publication number: 20090160028
    Abstract: An exemplary method for forming gaps in a micromechanical device includes providing a substrate. A first material layer is deposited over the substrate. A sacrificial layer is deposited over the first material layer. A second material layer is deposited over the sacrificial layer such that at least a portion of the sacrificial layer is exposed. The exposed portion of the sacrificial layer is etched by dry etching. The remaining portion of the sacrificial layer is etched by wet etching to form gaps between the first material layer and the second material layer. One or more bulges are formed at one side of the second material layer facing the first material layer, and are a portion of the sacrificial layer remaining after the wet etching.
    Type: Application
    Filed: October 9, 2008
    Publication date: June 25, 2009
    Applicants: TSINGHUA UNIVERSITY, HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: CHENG-RONG YI-LI, QUN-QING LI, SHOU-SHAN FAN