Abstract: Examples pertaining to preamble puncturing negotiation in wireless communications are described. A station (STA) may receive a control frame, and, in response, apply the MRU pattern for one or more transmissions or receptions in a transmission opportunity (TXOP). In the control frame, either a plurality of first reserved bits in a SERVICE field or a plurality of bits in a User Info field are set to indicate a multiple resource unit (MRU) pattern regarding preamble puncturing.

Abstract: A semiconductor device includes a first set of nanostructures stacked over a substrate in a vertical direction, and each of the first set of nanostructures includes a first end portion and a second end portion, and a first middle portion laterally between the first end portion and the second end portion. The first end portion and the second end portion are thicker than the first middle portion. The semiconductor device also includes a first plurality of semiconductor capping layers around the first middle portions of the first set of nanostructures, and a gate structure around the first plurality of semiconductor capping layers.

Abstract: A power supply unit supplies power to a load, and the power supply unit includes a power factor corrector, a DC conversion module, and an isolated conversion module. The power factor corrector is plugged into a first main circuit board and converts an AC power into a DC power. The DC conversion module is plugged into the first main circuit board and converts the DC power into a main power. The isolated conversion module includes a bus capacitor, the bus capacitor is coupled to the DC conversion module through a first power copper bar, and coupled to the power factor corrector through a second power copper bar. The first power copper bar and the second power copper bar are arranged on a side opposite to the first main circuit board, and are arranged in parallel with the first main circuit board.

Abstract: A body-worn camera and an operation method thereof are provided, and the body-worn camera a central processing unit, a video recording module, a turntable, and a main button. The video recording module is electrically connected to the central processing unit. The turntable is electrically connected to the central processing unit. The main button is electrically connected to the central processing unit. After the video recording module completes recording a video, when the central processing unit receives a category mode signal from the turntable and receives a category name confirmation signal from the main button, the central processing unit executes a video tagging program, and the video tagging program saves a corresponding relationship between a category name and the video.

Abstract: An operation-indication mode switching structure, a circuit, and a method for operating the same are provided. The operation-indication mode switching structure is disposed on a housing of a device, and includes a switching mechanism that is used to switch multiple operation-indication modes. The switching mechanism is selectively connected with one of multiple signal terminals. When the switching mechanism is manipulated to switch to one of the operation-indication modes, a control unit of the device receives an operation-indication mode switching signal generated by the switching mechanism conducting or circuit-shorting one of the multiple signal terminals. A corresponding operation-indication mode that is a covert mode, a stealth mode, or a normal mode can be determined. The control unit is used to control an indication function of the device according to the operation-indication mode that is switched to.

Abstract: A vinyl-containing copolymer is copolymerized from (a) first compound, (b) second compound, and (c) third compound. (a) First compound is an aromatic compound having a single vinyl group. (b) Second compound is polybutadiene or polybutadiene-styrene having side vinyl groups. (c) Third compound is an acrylate compound. The vinyl-containing copolymer includes 0.003 mol/g to 0.010 mol/g of benzene ring, 0.0005 mol/g to 0.008 mol/g of vinyl group, and 1.2*10?5 mol/g to 2.4*10?4 mol/g of ester group.

Abstract: A plating system and a method thereof are disclosed. The plating system performs a N-stage plating drilling filling process in which a M-th stage plating drilling filling process with a M-th current density is performed on a hole of a substrate for a M-th plating time to form a M-th plating layer on the to-be-plated layer, wherein N is a positive integer equal to or greater than 3, and M is a positive integer positive integer in a range of 1 to N. Therefore, the technical effect of providing a higher drilling filling rate than conventional plating filling technology under a condition that a total thickness of plating layers is fixed can be achieved.

Abstract: A method for manufacturing a package structure includes providing a carrier board; providing at least one die having a top surface, a bottom surface, and a side surface on the carrier board; and forming a protective layer to cover at least a portion of the side surface of the die. The die includes a substrate, a semiconductor layer, a gate structure, a source structure and a drain structure, at least one dielectric layer, and at least one pad. The semiconductor layer is disposed on the substrate. The gate structure is disposed on the semiconductor layer. The source and the drain structures are disposed on opposite sides of the gate structure. The dielectric layer covers the gate, source, and drain structures. The pad is disposed on the dielectric layer and penetrates through the dielectric layer to electrically contact with the gate, source or drain structure.

Abstract: A semiconductor device comprises a fin structure disposed over a substrate; a gate structure disposed over part of the fin structure; a source/drain structure, which includes part of the fin structure not covered by the gate structure; an interlayer dielectric layer formed over the fin structure, the gate structure, and the source/drain structure; a contact hole formed in the interlayer dielectric layer; and a contact material disposed in the contact hole. The fin structure extends in a first direction and includes an upper layer, wherein a part of the upper layer is exposed from an isolation insulating layer. The gate structure extends in a second direction perpendicular to the first direction. The contact material includes a silicon phosphide layer and a metal layer.

Abstract: A semiconductor device includes a first set of nanostructures stacked over a substrate in a vertical direction, and each of the first set of nanostructures includes a first end portion and a second end portion, and a first middle portion laterally between the first end portion and the second end portion. The first end portion and the second end portion are thicker than the first middle portion. The semiconductor device also includes a first plurality of semiconductor capping layers around the first middle portions of the first set of nanostructures, and a gate structure around the first plurality of semiconductor capping layers.

Abstract: An alignment pipeline is arranged on an outer casing and configured to connect to a communication pipe which has a communication pipe axis line. The alignment pipeline includes a pipe body, a connection piece, and a plurality of balls. The pipe body has a pipe body axis line, and includes a first end and a second end opposite to the first end. The first end is configured to connect to the communication pipe. The connection piece surrounds the pipe body, is arranged at the second end, and is movably connected to the outer casing. The plurality of balls is arranged on the connection piece in a rolling and dispersing manner. At least a part of the balls are in contact with the outer casing, so that the connection piece is movable relative to the outer casing along a radial direction of the pipe body axis line.

Abstract: A three-stage dust sampler makes use of a porous foam as the impactor substrates. The sampler includes an annular inlet which conforms to ISO/CEN/ACGIH inhalable sampling criteria, two impactor stages to classify thoracic and respirable particles and a final filter to collect respirable particles after the impactors. For 100 ppi polymer foam substrates, and a flow rate of 3.2 lpm, the collection efficiency curves of the thoracic and respirable dust matches ISO/CEN/ACGIH criteria when the jet-to-plate distance is 1.0. The cut-off aerodynamic diameter is 9.6 and 4.0 ?m for the first and second impactor stages, respectively, and ?{square root over (stk50)} is 0.39 for both stages. The collection efficiencies for solid particles is equal to that for liquid particles, indicating that there is no solid particle bouncing from the foam substrates.

Abstract: A three-stage dust sampler makes use of a porous foam as the impactor substrates. The sampler includes an annular inlet which conforms to ISO/CEN/ACGIH inhalable sampling criteria, two impactor stages to classify thoracic and respirable particles and a final filter to collect respirable particles after the impactors. For 100 ppi polymer foam substrates, and a flow rate of 3.2 lpm, the collection efficiency curves of the thoracic and respirable dust matches ISO/CEN/ACGIH criteria when the jet-to-plate distance is 1.0. The cut-off aerodynamic diameter is 9.6 and 4.0 ?m for the first and second impactor stages, respectively, and ?{square root over (stk50)} is 0.39 for both stages. The collection efficiencies for solid particles is equal to that for liquid particles, indicating that there is no solid particle bouncing from the foam substrates.

Abstract: An adjustable connector is electrically connected with corresponding signal contacts on a circuit board by a multiple of leaf springs. As a result of the flexibility of the leaf springs, the adjustable connector can move within a small range in relation to the circuit board while keeping in electrical connection with the circuit board so as to adjust the position of the adjustable connector on the circuit board.

Abstract: An adjustable connector is electrically connected with corresponding signal contacts on a circuit board by a multiple of leaf springs. As a result of the flexibility of the leaf springs, the adjustable connector can move within a small range in relation to the circuit board while keeping in electrical connection with the circuit board so as to adjust the position of the adjustable connector on the circuit board.

Abstract: A thin display stand with a sub-woofer includes a sub-woofer, a stand body, a damper and a fastener. The damper separates the sub-woofer and the stand body and is coupled with both, so that the sub-woofer and the stand body are prevented from contacting each other, and a shock from the sub-woofer is absorbed by the damper. The fastener is adapted for fixing the damper.