Patents by Inventor Cheng Tai
Cheng Tai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240181598Abstract: In an embodiment, a chemical mechanical planarization (CMP) system includes: a monolithic platen within a platen housing, wherein the monolithic platen is formed of a single piece of material, wherein the monolithic platen includes: a first portion within a first opening, and a second portion within a second opening, wherein the first portion has a different diameter than the second portion; and a polishing fluid delivery module above the monolithic platen, wherein the polishing fluid delivery module is configured to deliver slurry to the monolithic platen during performance of CMP.Type: ApplicationFiled: February 9, 2024Publication date: June 6, 2024Inventors: Tsung-Lung LAI, Cheng-Ping CHEN, Shih-Chung CHEN, Sheng-Tai PENG
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Publication number: 20240176353Abstract: The present invention provides a method of alerting to stationary objects for vehicle. When a vehicle moves at a first speed, an optical scanning device, an infrared image extraction device, and an image extraction device extract a first optical scanning image, a first infrared image, and a first ambient image of the ambiance on one side of the vehicle. According to the fusion algorithm and the optical flow method, the first obstacle information of the first obstacle in the first image will be given. According to the location information of the first obstacle, the vehicle computer judges and generates an alert message when the relative distance is smaller than a distance threshold value and the obstacle volume is greater than a volume threshold value.Type: ApplicationFiled: July 6, 2023Publication date: May 30, 2024Inventors: TSUNG-HAN LEE, JINN-FENG JIANG, SHIH-CHUN HSU, TSU-KUN CHANG, CHENG-TAI LEI, HUNG-YUAN WEI
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Publication number: 20240175451Abstract: A system for storing energy includes an energy storage apparatus having one or more energy storage storing water and compressed gas; and a water pump for supplying water from an environmental water source to the energy storage. The water source includes oceans, rivers, streams, lakes, reservoirs, spring water, groundwater, and reused water.Type: ApplicationFiled: November 27, 2023Publication date: May 30, 2024Inventors: LIEN CHUN DING, CHIH CHENG TAI
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Publication number: 20240170053Abstract: A latch formed from a memory cell includes a clock input terminal configured to receive a clock signal, complementary first and second data terminals, and a latch circuit. The latch circuit has first and second inverters. The first inverter has an input terminal coupled to the first data terminal, and the second inverter has an input terminal coupled to the second data terminal. A first pass gate transistor is coupled between an output terminal of the second inverter and the first data terminal. A second pass gate transistor is coupled between an output terminal of the first inverter and the second data terminal. The first and second pass gate transistors each have a gate terminal coupled to the clock input terminal. The input terminal of the first inverter is not directly connected to the output terminal of the second inverter, and the input terminal of the second inverter is not directly connected to the output terminal of the first inverter.Type: ApplicationFiled: January 26, 2024Publication date: May 23, 2024Inventors: Hua-Hsin Yu, Cheng Hung Lee, Hung-Jen Liao, Hau-Tai Shieh
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Publication number: 20240162833Abstract: A power supply unit supplies power to a load, and the power supply unit includes a power factor corrector, a DC conversion module, and an isolated conversion module. The power factor corrector is plugged into a first main circuit board and converts an AC power into a DC power. The DC conversion module is plugged into the first main circuit board and converts the DC power into a main power. The isolated conversion module includes a bus capacitor, the bus capacitor is coupled to the DC conversion module through a first power copper bar, and coupled to the power factor corrector through a second power copper bar. The first power copper bar and the second power copper bar are arranged on a side opposite to the first main circuit board, and are arranged in parallel with the first main circuit board.Type: ApplicationFiled: November 13, 2023Publication date: May 16, 2024Inventors: Yi-Sheng CHANG, Cheng-Chan HSU, Chia-Wei CHU, Chun-Yu YANG, Deng-Cyun HUANG, Yi-Hsun CHIU, Chien-An LAI, Yu-Tai WANG, Chi-Shou HO, Zhi-Yuan WU, Ko-Wen LU
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Patent number: 11980184Abstract: A flavonoid combination solution, and a manufacturing method and applications thereof for plant growth development are provided. The flavonoid combination solution are obtained by mixing a first solution with heating to >85° C. or without heating, a second solution without heating and a palm oil blend. The solution is effective in promoting plant growth, enhancing a seed germination rate, reducing pathogens, and reducing/eliminating stunting effects of a herbicide.Type: GrantFiled: November 14, 2019Date of Patent: May 14, 2024Assignee: THE BIO CONSULTING (PTY) LTDInventors: Pieter Theron van der Westhuizen, Dirk Cornelis Barnard, Kevin Khoa Anh Le, Chih-Cheng Tai
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Publication number: 20240153970Abstract: The invention provides a display device and a display panel. The display device includes the display panel and a reading circuit. The display panel includes an upper substrate, a lower substrate, a thin-film transistor (TFT) layer, and a photosensitive circuit. The TFT layer is disposed between the upper substrate and the lower substrate. A plurality of TFTs of a pixel array of the display panel are disposed in the TFT layer. The photosensitive circuit is disposed in the TFT layer to sense an ambient light. The reading circuit is coupled to the photosensitive circuit to read a sensing result.Type: ApplicationFiled: January 18, 2023Publication date: May 9, 2024Applicant: Novatek Microelectronics Corp.Inventors: Ya-Hsiang Tai, Yi-Cheng Yuan, Chen-Yu Lin
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Patent number: 11975421Abstract: The present disclosure provides a chemical mechanical polishing system having a unitary platen. The platen includes one or more recesses within the platen to house various components for the polishing/planarization process. In one embodiment, the platen includes a first recess and a second recess. The first recess is located under the second recess. An end point detector is placed in the first recess and a detector cover may be placed in the second recess. A sealing mean is provided in a space between the end point detector and the detector cover to prevent any external or foreign materials from coming in contact with the end point detector. A fastener used for fastening the detector cover to the platen also provides addition protection to prevent foreign materials from coming in contact with components received in the recesses.Type: GrantFiled: January 3, 2023Date of Patent: May 7, 2024Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Tsung-Lung Lai, Cheng-Ping Chen, Shih-Chung Chen, Sheng-Tai Peng, Rong-Long Hung
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Patent number: 11977274Abstract: An optical photographing lens assembly includes seven lens elements which are, in order from an object side to an image side: a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element, a sixth lens element and a seventh lens element. Each of the seven lens elements of the optical photographing lens assembly has an object-side surface facing toward the object side and an image-side surface facing toward the image side. The object-side surface of the first lens element is concave in a paraxial region thereof. The object-side surface of the first lens element is aspheric and has at least one critical point in an off-axis region thereof.Type: GrantFiled: November 2, 2022Date of Patent: May 7, 2024Assignee: LARGAN PRECISION CO., LTD.Inventors: Cheng-Chen Lin, Yu-Tai Tseng, Tzu-Chieh Kuo
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Publication number: 20240142833Abstract: An electronic device includes a substrate, a driving element, a first insulating layer, a pixel electrode layer, and a common electrode layer. The driving element is disposed on the substrate. The first insulating layer is disposed on the driving element. The pixel electrode layer is disposed on the first insulating layer. The first insulating layer comprises a hole, and the pixel electrode layer is electrically connected to the driving element through the hole. The common electrode layer is disposed on the pixel electrode layer. The common electrode layer comprises a slit, and the slit has an edge, and the edge is disposed in the hole.Type: ApplicationFiled: January 11, 2024Publication date: May 2, 2024Applicant: Innolux CorporationInventors: Wei-Yen Chiu, Ming-Jou Tai, You-Cheng Lu, Yi-Shiuan Cherng, Yi-Hsiu Wu, Chia-Hao Tsai, Yung-Hsun Wu
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Patent number: 11959101Abstract: A cell activation reactor and a cell activation method are provided. The cell activation reactor includes a body, a rotating part, an upper cover, a microporous film, and multiple baffles. The body has an accommodating space, which is suitable for accommodating multiple cells and multiple magnetic beads. The rotating part is disposed in the accommodating space and includes multiple impellers. The microporous film is disposed in the accommodating space and covers multiple holes of the accommodating space. The baffles are disposed in the body. When the rotating part is driven to rotate, the interaction between the baffles and the impellers separates the cells and the magnetic beads.Type: GrantFiled: November 26, 2021Date of Patent: April 16, 2024Assignee: Industrial Technology Research InstituteInventors: Ting-Hsuan Chen, Kuo-Hsing Wen, Ya-Hui Chiu, Nien-Tzu Chou, Ching-Fang Lu, Cheng-Tai Chen, Ting-Shuo Chen, Pei-Shin Jiang
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Publication number: 20240094094Abstract: A pump health analysis method and a pump health analysis device using the same are provided. A standard vibration curve of a standard pump is obtained. The standard vibration curve is converted from a time domain to a frequency domain to obtain a first frequency distribution curve. A sample vibration curve of a sample pump is obtained. The sample vibration curve is converted from the time domain to the frequency domain to obtain a second frequency distribution curve. The first frequency distribution curve is compared with the second frequency distribution curve by using a cosine similarity algorithm to obtain a health index of the sample pump.Type: ApplicationFiled: November 9, 2022Publication date: March 21, 2024Inventors: Wei-Chen WU, Cheng-Tai PENG, Chih-Chung KUO
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Publication number: 20240096400Abstract: A memory device includes a memory bank with a memory cell connected to a local bit line and a word line. A first local data latch is connected to the local bit line and has an enable terminal configured to receive a first local clock signal. A word line latch is configured to latch a word line select signal, and has an enable terminal configured to receive a second local clock signal. A first global data latch is connected to the first local data latch by a global bit line, and the first global data latch has an enable terminal configured to receive a global clock signal. A global address latch is connected to the word line latch and has an enable terminal configured to receive the global clock signal. A bank select latch is configured to latch a bank select signal, and has an enable terminal configured to receive the second local clock signal.Type: ApplicationFiled: January 23, 2023Publication date: March 21, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chien-Yuan CHEN, Hau-Tai SHIEH, Cheng Hung LEE
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Publication number: 20240084787Abstract: A concentrated solar power storage system and method convert water into water vapor by the solar thermal energy, and the water vapor further operates a hydroelectric power generation system with a water storage (or an energy storage capsule) through a repeated conversion process.Type: ApplicationFiled: September 12, 2023Publication date: March 14, 2024Inventors: LIEN CHUN DING, CHIH CHENG TAI
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Publication number: 20240088307Abstract: A semiconductor package is provided. The semiconductor package includes a heat dissipation substrate including a first conductive through-via embedded therein; a sensor die disposed on the heat dissipation substrate; an insulating encapsulant laterally encapsulating the sensor die; a second conductive through-via penetrating through the insulating encapsulant; and a first redistribution structure and a second redistribution structure disposed on opposite sides of the heat dissipation substrate. The second conductive through-via is in contact with the first conductive through-via. The sensor die is located between the second redistribution structure and the heat dissipation substrate. The second redistribution structure has a window allowing a sensing region of the sensor die receiving light. The first redistribution structure is electrically connected to the sensor die through the first conductive through-via, the second conductive through-via and the second redistribution structure.Type: ApplicationFiled: November 20, 2023Publication date: March 14, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chih-Hsuan Tai, Hao-Yi Tsai, Yu-Chih Huang, Chih-Hao Chang, Chia-Hung Liu, Ban-Li Wu, Ying-Cheng Tseng, Po-Chun Lin
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Patent number: 11929318Abstract: A package structure includes a thermal dissipation structure, a first encapsulant, a die, a through integrated fan-out via (TIV), a second encapsulant, and a redistribution layer (RDL) structure. The thermal dissipation structure includes a substrate and a first conductive pad disposed over the substrate. The first encapsulant laterally encapsulates the thermal dissipation structure. The die is disposed on the thermal dissipation structure. The TIV lands on the first conductive pad of the thermal dissipation structure and is laterally aside the die. The second encapsulant laterally encapsulates the die and the TIV. The RDL structure is disposed on the die and the second encapsulant.Type: GrantFiled: May 10, 2021Date of Patent: March 12, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chih-Hsuan Tai, Hao-Yi Tsai, Tsung-Hsien Chiang, Yu-Chih Huang, Chia-Hung Liu, Ban-Li Wu, Ying-Cheng Tseng, Po-Chun Lin
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Patent number: 11919126Abstract: In an embodiment, a chemical mechanical planarization (CMP) system includes: a monolithic platen within a platen housing, wherein the monolithic platen is formed of a single piece of material, wherein the monolithic platen includes: a first portion within a first opening, and a second portion within a second opening, wherein the first portion has a different diameter than the second portion; and a polishing fluid delivery module above the monolithic platen, wherein the polishing fluid delivery module is configured to deliver slurry to the monolithic platen during performance of CMP.Type: GrantFiled: May 12, 2021Date of Patent: March 5, 2024Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Tsung-Lung Lai, Cheng-Ping Chen, Shih-Chung Chen, Sheng-Tai Peng
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Publication number: 20240071981Abstract: A method of fabricating a semiconductor structure includes the following steps. A semiconductor wafer is provided. A plurality of first surface mount components and a plurality of second surface mount components are bonded onto the semiconductor wafer, wherein a first portion of each of the second surface mount components is overhanging a periphery of the semiconductor wafer. A first barrier structure is formed in between the second surface mount components and the semiconductor wafer. An underfill structure is formed under a second portion of each of the second surface mount components, wherein the first barrier structure blocks the spreading of the underfill structure from the second portion to the first portion.Type: ApplicationFiled: November 1, 2023Publication date: February 29, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Mao-Yen Chang, Chih-Wei Lin, Hao-Yi Tsai, Kuo-Lung Pan, Chun-Cheng Lin, Tin-Hao Kuo, Yu-Chia Lai, Chih-Hsuan Tai
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Publication number: 20240071428Abstract: A device is disclosed and includes an input stage circuit, a switching circuit, and a first latch circuit. The input stage circuit generates a first input signal having a first voltage and a second input signal based on a third input signal. The switching circuit operates in response to a first control signal, and adjusts a voltage level of a first data line according to the first input signal and a voltage level of a second data line according to the second input signal. The first latch circuit is coupled to the switching circuit by the first data line and the second data line. The first latch circuit latches a data in response to the first control signal and a second control signal, and adjusts the voltage level of the first data line based on a second voltage different from the first voltage.Type: ApplicationFiled: November 8, 2023Publication date: February 29, 2024Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Hua-Hsin YU, Hung-Jen LIAO, Cheng-Hung LEE, Hau-Tai SHIEH
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Publication number: 20240071330Abstract: A display device includes a display panel. The display panel has a functional display area. The functional display area includes a plurality of display pixels and a plurality of light transmitting regions. The plurality of display pixels are around by the plurality of the light transmitting regions. A boundary between one of the plurality of display pixels and one of the plurality of light transmitting regions comprises an arc segment.Type: ApplicationFiled: November 3, 2023Publication date: February 29, 2024Applicant: Innolux CorporationInventors: Chia-Hao Tsai, Ming-Jou Tai, Yi-Shiuan Cherng, Yu-Shih Tsou, You-Cheng Lu, Yung-Hsun Wu