Abstract: A wafer image capturing apparatus, including a loud/unload system, at least one imaging station and a conveying device, are provided. The loud/unload system contains a plurality of wafers. The at least one imaging includes a platform and an image capturing device. The conveying device includes a movable component for moving the wafer to a platform of at least one imaging station. An image capturing device is configured to capture an image of the wafer. A method for image capturing is also provided, including: operating a conveying device to pick a wafer from a load/unload system and move the wafer to at least one imaging station; and operating at least one image capturing device to capture an image from above or below the imaging station. Thus, the flexibility and efficiency of wafer image capturing can be improved.

Abstract: An image calibration method for imaging system is provided, including: specifying a detection area located in an image capture scope and the detection area having a unit to be tested; capturing a detection image respectively when the detection area is located in at least two locations within the image capture scope; combining the plurality of detection images and calculating to obtain a calibration figure; and applying the calibration figure to a captured image to complete the calibration. In this way, the calibration figure that adapt to the luminescent type and size of the unit to be tested can be obtained.

Abstract: A method of spectral analyzing with a color camera is provided, and the method includes: calibrating a color camera to obtain a quantum efficiency database of the color camera; shooting a detection area with the color camera, the detection area including at least one object, to obtain the color content data of the at least one object; and comparing the color content data to the quantum efficiency database to analyze the at least one object.

Abstract: An optical measuring apparatus with a light source, an optical fiber connector, an optical probe, a plurality of optical fibers and an imaging processor is provided. The light source emits a first light beam. The optical fiber connector is disposed adjacent to the light source. The optical probe is disposed adjacent to the fiber connector and opposite the light source. The optical fibers are utilized to connect the light source, the optical fiber connector and the optical probe. The imaging processor is disposed on the same side as the light source, and is connected with the optical fiber connector.

Abstract: An optical measuring method for measuring the surface of a patterned sapphire substrate is provided. The method has the following steps: using an automated optical inspection procedure to check the surface of the patterned sapphire substrate and define a non-defective area and a defective area; providing a light source to emit a first light beam; making the first light beam pass through an optical fiber connector and an optical probe, and focus on a measurement focal point defined on the surface of the patterned sapphire substrate. The measurement focal point is disposed on the non-defective area. The optical probe has a pinhole disposed opposite the measurement focal point. The first light beam is emitted into the pinhole. The pinhole and the measurement focal point are conjugated.

Abstract: A light deflection detection module with a detection stage, a surface light source, at least two scanning cameras and a standard surface is provided. The detection stage is utilized for supporting an object. The surface light source is disposed above the detection stage, and emits a planar light to the detection stage. The at least two scanning cameras are disposed opposite the surface light source. The standard surface is disposed adjacent to the detection stage. When the surface light source emits the planar light to the detection stage, the planar light will be reflected by the surface of the object and the standard surface first, and then received by the at least two scanning cameras. A processor will perform a numerical analysis on the reflected planar light to obtain the detection data and to make the error correction.

Abstract: A system separating defective dies from a wafer comprises a film frame platform and a pick-and-place device. The film frame platform comprises a support table assembly configured for supporting a film frame assembly and a platform surface configured to receive the placement of bins thereupon. The pick-and-place device is configured for moving in a linear manner between the support table assembly and the platform surface.

Abstract: A system for inspecting chips in a tray comprises a three-dimensional sensor, a focus computing unit, an image sensor and a focusing device. The three-dimensional sensor is used to obtain the height signals of surfaces of the chips. The focus computing unit calculates the focusing positions of chips. The surface inspection sensor is used to inspect the surfaces of the chips. The focusing device is used to bring the images of the surfaces of the chips into the focus of the image sensor.

Abstract: A tray handling apparatus comprises a plurality of guides, a chuck device, a linear movement device, and a rack and pinion device. A space defined by the erected guides is used to hold a tray stack. The chuck of the chuck device is located at the center position of the bottom area of the space. The linear movement device is used to move the chuck relative to the guides. The rack and pinion device is used to cause the guides to move symmetrically. When an operator moves any one of the guides, the other guides move symmetrically and the center of the bottom area of the space surrounded by the guides remains at the same location during the movement of the guides. The operator does not need to adjust the position of the chuck if the positions of the guides are changed.

Abstract: A system for inspection of chips on a tray comprises an unloading arm device, a first support platform, and a plurality of first tray-handling apparatuses. The first support platform is disposed adjacent to the unloading arm device, movable along a first direction. The plurality of first tray-handling apparatuses are arrayed along the first direction on the first support platform. Each of the plurality of first tray-handling apparatuses provides a particular size of tray for inspection, different from the size of tray provided by other first tray-handling apparatuses, wherein the first platform is configured to move a desired one of the plurality of first tray handling apparatuses before the unloading arm device.

Abstract: A system separating defective dies from a wafer comprises a film frame platform and a pick-and-place device. The film frame platform comprises a support table assembly configured for supporting a film frame assembly and a platform surface configured to receive the placement of bins thereupon. The pick-and-place device is configured for moving in a linear manner between the support table assembly and the platform surface.

Abstract: A system for inspection of chips on a tray comprises an unloading arm device, a first support platform, and a plurality of first tray-handling apparatuses. The first support platform is disposed adjacent to the unloading arm device, movable along a first direction. The plurality of first tray-handling apparatuses are arrayed along the first direction on the first support platform. Each of the plurality of first tray-handling apparatuses provides a particular size of tray for inspection, different from the size of tray provided by other first tray-handling apparatuses, wherein the first platform is configured to move a desired one of the plurality of first tray handling apparatuses before the unloading arm device.

Abstract: A tray handling apparatus comprises a plurality of guides, a chuck device, a linear movement device, and a rack and pinion device. A space defined by the erected guides is used to hold a tray stack. The chuck of the chuck device is located at the center position of the bottom area of the space. The linear movement device is used to move the chuck relative to the guides. The rack and pinion device is used to cause the guides to move symmetrically. When an operator moves any one of the guides, the other guides move symmetrically and the center of the bottom area of the space surrounded by the guides remains at the same location during the movement of the guides. The operator does not need to adjust the position of the chuck if the positions of the guides are changed.

Abstract: A system for inspecting chips in a tray comprises a three-dimensional sensor, a focus computing unit, an image sensor and a focusing device. The three-dimensional sensor is used to obtain the height signals of surfaces of the chips. The focus computing unit calculates the focusing positions of chips. The surface inspection sensor is used to inspect the surfaces of the chips. The focusing device is used to bring the images of the surfaces of the chips into the focus of the image sensor.

Abstract: A lock includes a main body, a shining device, and a switch; the main body has a holding portion on one side thereof, which is formed with a through hole; the shining device is held in the holding portion of the main body, and it includes a power source, and a light emitting element; the light emitting element is held in the through hole of the holding portion of the main body such that light emitted from it will travel outside the main body; the switch is connected to the shining device for turning on/off the power for the light emitting element.

Abstract: A combination lock includes a lock head, a pivotal seat pivotal to the head, and a cable including an insertion portion, and a stopping portion; the pivotal seat has a hole, and the cable is joined to the pivotal seat in a replaceable manner with the insertion portion being passed through the hole, and with the stopping portion being prevented from passing through the hole of the pivotal seat; the lock head has a tapering eccentric lock hole therefore when the lock is in the locking position with the cable insertion portion being fastened in the eccentric lock hole, the insertion portion can be moved further into the eccentric lock hole for reducing the loop size formed by the cable; the combination lock can be reset after toothed disks in dials are linearly displaced so as to disengage the dials by means of pressing a sliding member thereof.

Abstract: A lock includes a main body, a shining device, and a switch; the main body has a holding portion on one side thereof, which is formed with a through hole; the shining device is held in the holding portion of the main body, and it includes a power source, and a light emitting element; the light emitting element is held in the through hole of the holding portion of the main body such that light emitted from it will travel outside the main body; the switch is connected to the shining device for turning on/off the power for the light emitting element.

Abstract: An electric stapler includes a clinching mechanism and an anvil device. The clinching mechanism bends protruding legs of a staple to fasten objects together. The anvil device includes a stationary frame, a cover and a sliding anvil mechanism. The cover is mounted on the stationary frame and has a through hole through which the legs of the driven staple protrude. The sliding anvil mechanism is mounted in the stationary frame and includes a first and a second anvil device. Each of the anvil devices includes a sliding anvil. The sliding anvils are driven toward the through hole to bend respectively the legs in the through hole. Consequently, the sliding anvils completely bend the legs protruded from the bottom of the objects to keep a person handling the stapled object from potential injury.

Abstract: An electric stapler includes a clinching mechanism and an anvil device. The clinching mechanism bends protruding legs of a staple to fasten objects together. The anvil device includes a stationary frame, a cover and a sliding anvil mechanism. The cover is mounted on the stationary frame and has a through hole through which the legs of the driven staple protrude. The sliding anvil mechanism is mounted in the stationary frame and includes a first and a second anvil device. Each of the anvil devices includes a sliding anvil. The sliding anvils are driven toward the through hole to bend respectively the legs in the through hole. Consequently, the sliding anvils completely bend the legs protruded from the bottom of the objects to keep a person handling the stapled object from potential injury.

Abstract: A combination lock includes a female member, a lock rod inserted in the female member; the female member is inserted through single dial, several actuating rings, and co-moving rings; the dial and the actuating rings are arranged side by side, and releaseably engaged with respective co-moving rings; the dial and an actuating ring adjacent thereto have a projecting portion on opposing sides while every two adjacent actuating rings have a projecting portion on opposing sides such that the co-moving rings can be turned to unlocking position where all gaps thereof oppose a trench of the female member to form a passage for the lock rod by operating the dial; orientations of the dial and the actuating rings relative to respective co-moving rings are changed for changing the unlocking combination by operating the dial after the dial and the actuating rings are disengaged from the co-moving rings.