Abstract: An LED lamp includes a heat sink, a plurality of LED modules mounted on the heat sink, a bracket connecting with the heat sink and a cover covering over the heat sink. The heat sink includes a curved base plate and a plurality of fins extending from an inner surface of the base plate. The LED modules are mounted on an outer surface of the base plate, whereby the LED modules radiate light on different directions. The bracket is located above the fins and includes two connecting bars to respectively connect two ends of the base plate. The cover covers over the outer surface of the base plate to protect the LED modules. Heat generated by the LED modules is absorbed by base plate of the heat sink and dissipated into ambient air via the fins thereof.

Abstract: An LED lamp includes a heat absorbing member having a hollow, cylindrical configuration, a lamp base, a plurality of LED modules and a heat sink. The heat absorbing member defines a through hole therein. The heat sink is secured to a top portion of the heat absorbing member. The lamp base is secured to a bottom portion of the heat absorbing member. The LED modules are mounted on an outer sidewall of the heat absorbing member, and each of the LED modules includes a printed circuit board and a plurality of LEDs mounted on the printed circuit board. Each of the heat pipes has an evaporating portion received in an inner sidewall of the heat absorbing member and a condensing portion connecting with the heat sink. The condensing portions of the heat pipes are radially arranged on the heat sink, radiating outwardly from a central point of the heat sink.

Abstract: A heat dissipation device for removing heat from LED chips includes a heat sink and a plurality of substrates. The heat sink comprises a base plate. A plurality of fins extends upwardly from the base plate. The substrates each have a unidirectional heat transfer and are attached to a bottom face of the heat sink. Each of the substrates defines a first wall on which The LED chips are mounted and a second wall coupled to the heat sink. The substrates only transfer heat from the first wall to the second wall and restrict the heat transfer in a reverse direction. When the LED chips generate heat, the heat is transferred to the fins of the heat sink via the unidirectional substrates to lower temperature of the LED chips.

Abstract: A heat dissipation device for removing heat from LED chips includes a finned heat sink, a plurality of heat pipes and a plurality of heat conductive substrates. The heat sink comprises a base plate and a plurality of fins formed on the base plate. The heat pipes which transfer heat in a unidirectional manner are embedded in the base plate. Each of the heat pipes defines a first wall and a second wall coupled to the heat sink. The heat pipes only transfer heat from the first walls to the second walls and restrict a heat transfer in a reversed direction. The substrates are in contact with first walls of the heat pipes. The LED chips are mounted on the substrates. When the LED chips generate heat, the heat is transferred to the fins via the unidirectional heat pipes to lower the temperature of the LED chips.

Abstract: A heat dissipation device for a light emitting diode (LED) module includes a heat sink, a plurality of heat pipes received in the heat sink and a heat-absorbing plate thermally attached to the heat pipes and the LED module and located therebetween. The heat sink includes a base and a plurality of fins mounted on the base. The base defines a plurality of grooves for accommodating the heat pipes therein. Top surfaces of the heat pipes are coplanar with a top face of the base of the heat sink so that the heat-absorbing plate has an intimate contacting with the top face of the base of the heat sink and the top surfaces of the heat pipes, whereby the heat pipes can quickly transfer heat from the LED module to the heat sink via the heat-absorbing plate.

Abstract: An LED lamp includes a heat dissipation apparatus with a base, an LED module mounted on the base, and an AC-DC converter electrically connected to the LED module. The AC-DC converter is mounted on the base near the LED module. Heat generated by the LED module and heat-generating components of the AC-DC converter is transferred to the base from which the heat is dissipated by the heat dissipation apparatus. Heat pipes are embedded in the base of the heat dissipation apparatus.

Abstract: A heat dissipation assembly includes a heat sink, a retention module surrounding the heat sink, and a pair of wire clips pivotably attached to the retention module to press the heat sink against an electronic component on a printed circuit board. The retention module includes three walls surrounding a rectangular opening through which the heat sink contacts with the electronic component. Two barbs and two supporting members are formed on the three walls. Each clip includes a pivoting section retained in one supporting member, an abutting section pressing the heat sink toward the electronic component, and a locking section locked with one barb, a connecting section connecting the abutting section with the pivoting section, and a handle formed from the locking section. Each clip is entirely located at a corresponding side of the heat sink.

Abstract: An LED lamp includes a hollow, prism-shaped heat sink (30), a plurality of LED modules (20) attached on sidewalls (320) of the heat sink, a cover (40) mounted on a top of the heat sink, a lampshade (10) secured to a bottom of the heat sink, and a fan (50) fixed on the top of the heat sink and through the cover. A plurality of fins (340) extends inwardly from inner faces of the heat sink to cooperatively define two crossed slots in the heat sink. When the fan is in operation, an airflow produced by the fan flows through the fins from the top through the bottom of the heat sink, thereby dissipating heat absorbed by the heat sink from the LED modules rapidly and efficiently.

Abstract: A heat dissipation device (40) is used for dissipating heat generated by a plurality of LEDs (15) mounted on a circuit board (12). The heat dissipation device comprises two heat sinks (30) mounted on the circuit board via a heat spreader (20). Each of the two heat sinks comprises a plurality of fins (300) stacked together. A plurality of short walls (350) are formed at two opposite lateral sides of the two heat sinks. A plurality of openings (330) are defined below the short walls and opened laterally. A plurality of vertical cavities (360) are defined by the two heat sinks and communicate with the openings (330), respectively. The cavities in the two heat sinks are alternately arranged.

Abstract: A heat dissipation device (40) is used for dissipating heat generated by a plurality of LEDs (15) mounted on a circuit board (12). The heat dissipation device comprises two heat sinks (30) mounted on the circuit board via a heat spreader (20). Each of the two heat sinks comprises a plurality of fins (300) stacked together. A plurality of short walls (350) are formed at two opposite lateral sides of the two heat sinks. A plurality of openings (330) are defined below the short walls and opened laterally. A plurality of vertical cavities (360) are defined by the two heat sinks and communicate with the openings (330), respectively. The cavities in the two heat sinks are alternately arranged.

Abstract: An LED lamp includes a hollow first heat sink (10), a plurality of LED modules (40) respectively mounted on outer sidewalls (120) of the first heat sink, a second heat sink (20) being enclosed by the first heat sink, and a plurality of heat pipes (30) connecting the second heat sink to the first heat sink. The second heat sink includes an annular base (22) and a plurality of fins (24, 240) extending outwardly and radially from an outer sidewall of the base. The heat pipes couple the base of the second heat sink with the first heat sink, so that heat generated by the LED modules can be transferred from the first heat sink to the second heat sink via the heat pipes, thereby enhancing a heat dissipating efficiency of the LED lamp.

Abstract: A heat dissipation device includes a first heat sink and a second heat sink juxtaposed with the first heat sink. The first heat sink includes a first base and a plurality of first fin extending from the first base with a plurality of first channels defined therebetween. The second heat sink includes a second base and a plurality of second fins extending from the second base with a plurality of second channels defined therebetween. The second fins extend beyond a common edge of the first base and the second base to extend into first channels of the first heat sink.

Abstract: A heat pipe includes an outer pipe (10), an inner pipe (20), and a hermetic cap (30). The outer pipe has an evaporating end (12) and a condensing end (14). The evaporating end is integrally sealed and receives working fluid. The inner pipe includes an open top and an open bottom. A very narrow gap (40) is defined between the inner pipe and the outer pipe. A plurality of granules is put into the gap to form a porous wicking structure. When the evaporating end is heated by an external heat source, the working fluid is vaporized and flows up along the inner pipe to the condensing end. The working fluid condenses at the condensing end, and flows back down to the evaporating end through the gap. Because the gap is very narrow, surface tension of the working fluid and capillary action of the outer and inner pipes is enhanced.

Abstract: A heat dissipating device assembly for dissipating heat generated by an electronic component (32) mounted on a printed circuit board (30) is disclosed. The heat dissipating device assembly includes a back plate (26) mounted below the printed circuit board, a retention module (22) secured on the printed circuit board, a heat sink (10) disposed on the retention module for contacting the electronic component, and a pair of wire clips (24) pivotably attached to two opposite walls (222) of the retention module. The pair of clips produce symmetrical pressure acting on two lateral sides of the heat sink, thus holding the heat sink in reliable contact with the electronic component.

Abstract: A memory module assembly includes a printed circuit board (10) having a heat-generating electronic component (14) thereon, and first and second heat-dissipation plates (20), (30) attached on opposite sides of the printed circuit board. The first heat-dissipation plate includes a first hook (24) extending from a side thereof and the first hook includes a resisting portion (242) extending from an end of the first heat-dissipation plate and a first engaging portion (244) extending from a free end of the resisting portion for resisting the printed circuit board and the second heat-dissipation plate. The second heat-dissipation plate defines a depressed portion (34) in a side thereof for engaging with the first hook. The other sides of the first and second heat-dissipation plates engage with each other to clamp the printed circuit board between the first and second heat-dissipation plates.

Abstract: A vapor chamber includes a base (100) for contacting a heat-generating component (500), a cover (200), a first porous capillary sheet (300) located in the base and a second porous capillary sheet (400) located in the cover and facing the first porous capillary sheet. The base comprises a block (130) extending from the base to thermally connect with the cover. The cover is mounted on the base and forms a hermetically sealed container together with the base. The first and second porous capillary sheets together form an enclosure and are contained in the container, and the block extends through the first and second porous capillary sheets and engage therewith.

Abstract: A heat dissipation device includes a heat sink, a fan producing an airflow flowing towards the heat sink, an air-guiding member positioned between the fan and the heat sink and a cover enclosing the fan and the heat sink. The air-guiding member includes an air deflector dividing the airflow produced by the fan into two airstreams. The air deflector guides the airstreams of the airflow flowing towards different portions of the heat sink. By the air deflector, the portion of the heat sink, which is hotter than the other portion of the heat sink, has more air flowing therethrough.

Abstract: A heat dissipation device includes a heat conducting plate (100) for contacting with an electronic component (400), a heat sink (200) mounted on the heat conducting plate and a heat pipe (300). The heat conducting plate comprises a groove (110) defined in. The heat pipe comprises an evaporating portion (310) sandwiched between the heat conducting plate and the heat sink, and a condensing portion (320) thermally connecting with the heat sink. The evaporating portion comprises a middle portion (3104) having a circular cross section and accommodated in the groove of the heat conducting plate, and a pair of end portions (3102) formed on opposite sides of the middle portion. The end portions have flat bottom surfaces.

Abstract: An LED module includes a latching component, a frame holding an LED thereon, a heat spreader located in the latching component and a heat transfer member having a heat-dissipating unit remote from the LED and a heat pipe thermally connecting with the heat spreader, the LED and the heat-dissipating unit. The latching component cooperates with the heat spreader to tightly press the frame being attached on the heat spreader. The heat transfer member thermally connects with the heat spreader and transfers heat from the LED to an ambient environment. The latching component has two spring pieces pushing the frame toward the heat spreader and the heat pipe. The spring pieces electrically engage with the frame to thereby electrically connect with the LED.