Abstract: An implantable phototherapy device includes a power receiver element configured to receive power from an external power transmitter, a light delivery element powered by the power receiver, and configured to deliver phototherapy to a target treatment area, and a tether element is coupled to the light delivery element and the power receiver element. The tether element is configured to deliver power between the power receiver element and the light delivery element.

Abstract: Methods for performing endovascular procedures are described herein. The methods may comprise advancing an expandable member of a blood flow control device to a target location in a blood vessel of a patient, and rotating a circular gear positioned at least partially within a housing of a controller via the controller communicably coupled to the blood flow control device. Rotating the circular gear may translate a linear gear of a syringe pump fluidly coupled to the expandable member thereby adjusting a volume of the expandable member. Various blood flow control devices, control systems, and fluid delivery systems are also described herein. The fluid delivery systems may include a pump configured for manual or automated delivery of fluids, or configured to switch between automated and manual modes of delivery. The pump may be a syringe pump that utilizes a rack and pinion system, a motor, and a sensor to track the position and/or movement of a component of the syringe pump during fluid transfer.

Abstract: An implantable phototherapy device includes a power receiver element configured to receive power from an external power transmitter, a light delivery element powered by the power receiver, and configured to deliver phototherapy to a target treatment area, and a tether element is coupled to the light delivery element and the power receiver element. The tether element is configured to deliver power between the power receiver element and the light delivery element.

Abstract: An implantable phototherapy device includes a power receiver element configured to receive power from an external power transmitter, a light delivery element powered by the power receiver, and configured to deliver phototherapy to a target treatment area, and a tether element is coupled to the light delivery element and the power receiver element. The tether element is configured to deliver power between the power receiver element and the light delivery element.

Abstract: An implantable phototherapy device includes a power receiver element configured to receive power from an external power transmitter, a light delivery element powered by the power receiver, and configured to deliver phototherapy to a target treatment area, and a tether element is coupled to the light delivery element and the power receiver element. The tether element is configured to deliver power between the power receiver element and the light delivery element.

Abstract: A temperature measurement device having a thermopile temperature sensor and a proximity sensor, a mobile temperature measurement device, and a method for determining a corrected temperature with a temperature measurement device are described. In an implementation, a temperature measurement device includes a semiconductor device; a thermopile temperature sensor disposed on the semiconductor device, where the thermopile temperature sensor is configured to receive radiation from an object; a proximity sensor disposed on the semiconductor device, the proximity sensor configured to detect a distance between the thermopile temperature sensor and the object; and a controller configured determine a corrected temperature measurement using at least an indication of received radiation and an indication of distance between the thermopile temperature sensor and the object.

Abstract: An implantable phototherapy device includes a power receiver element configured to receive power from an external power transmitter, a light delivery element powered by the power receiver, and configured to deliver phototherapy to a target treatment area, and a tether element is coupled to the light delivery element and the power receiver element. The tether element is configured to deliver power between the power receiver element and the light delivery element.

Abstract: An integrated multifunction sensor, a mobile integrated sensor device, and process are described that include a sensor, where the sensor is used primarily for a first purpose other than as an electrode. In an implementation, an integrated multifunction sensor includes a multifunction sensor configured as a sensor and a first electrode, the multifunction sensor including a lid coupled to a first side of the sensor, where the lid includes a semi-conductive material, and an analog device connected to the lid; where the multifunction sensor is configured to couple to a controller that receives health information from the first electrode and a second electrode. In some embodiments, the integrated multifunction sensor can include an integrated optical sensor. In some implementations, a second electrode may be located elsewhere in a mobile integrated sensor device and complete a differential circuit.

Abstract: Techniques are provided to furnish a light sensor that includes a filter positioned over a photodetector to filter visible and infrared wavelengths to permit the sensing of ultraviolet (UV) wavelengths. In one or more implementations, the light sensor comprises a semiconductor device (e.g., a die) that includes a substrate. A photodetector (e.g., photodiode, phototransistor, etc.) is formed in the substrate proximate to the surface of the substrate. In one or more implementations, the substrate comprises a silicon on insulator substrate (SOI). A filter (e.g., absorption filter, interference filter, flat pass filter, McKinlay-Diffey Erythema Action Spectrum-based filter, UVA/UVB filter, and so forth) is disposed over the photodetector. The filter is configured to filter infrared light and visible light from light received by the light sensor to at least substantially block infrared light and visible light from reaching the photodetector.

Abstract: An infrared thermopile sensor, an electronic device, and a method for fabricating an infrared thermopile sensor using a front-end process that employ example techniques in accordance with the present disclosure are described herein. In an implementation, the infrared thermopile sensor includes a silicon substrate that has been implanted during front-end processing to form an implant region; a passivation layer disposed on a first side of the silicon substrate, where the passivation layer forms a membrane; and an interlayer dielectric formed on the passivation layer, where the interlayer dielectric includes at least one thermopile that includes at least one thermocouple in series; and at least one metallic interconnect that electrically couples the at least one thermopile to a bond pad; and at least one bond pad interconnect that electrically couples the implant region to the bond pad.

Abstract: A sensor device, a sensor package, and method for fabricating a sensor device are described that include an integrated light blocker disposed on the thermopile device and a lens configured to direct light to the thermopile device. In an implementation, the thermopile device includes a substrate; a thermopile membrane disposed on the substrate, the thermopile membrane including at least one passivation layer; a thermopile disposed within the thermopile membrane, the thermopile including at least one thermocouple; and a light blocking layer disposed proximate to the thermopile membrane, the light blocking layer including an aperture disposed proximate to the thermopile.

Abstract: A system includes a temperature sensor and a distance sensor. The distance sensor provides an indication of distance between the temperature sensor and an object to be measured. By determining the distance between the temperature sensor and the object, the system determines whether the object is sufficiently close to the temperature sensor to make an accurate temperature measurement, such as by determining whether the object completely fills the field of view of the sensor. In an implementation, the distance sensor includes a light source and a photodetector configured to detect light having wavelengths that correspond to those generated by the light source.

Abstract: A sensor package having a thermopile sensor and a reference thermopile sensor disposed therein. In one or more implementations, the sensor package includes a substrate, a thermopile sensor disposed over the substrate, a reference thermopile sensor disposed over the substrate, and a lid assembly disposed over the thermopile sensor and the reference thermopile sensor. The lid assembly includes a transparent structure that passes electromagnetic radiation occurring in a limited spectrum of wavelengths and an electromagnetic blocker disposed over the lid assembly. The electromagnetic blocker defines an aperture over the thermopile sensor such that at least a portion of the electromagnetic blocker is positioned over the reference thermopile sensor. The electromagnetic blocker is configured to at least substantially block the electromagnetic radiation occurring in a limited spectrum of wavelengths from reaching the reference thermopile sensor.

Abstract: A sensor package can have a reference thermopile sensor and a reference temperature sensor disposed therein to determine an ambient temperature. In one or more implementations, the sensor package includes a substrate having a substrate surface, a reference thermopile sensor disposed over the substrate surface, a reference temperature sensor disposed over the substrate surface, and a lid assembly disposed over the thermopile sensor and the reference thermopile sensor. The lid assembly includes a structure having a transparent portion that passes electromagnetic radiation occurring in a limited spectrum of wavelengths. The reference thermopile sensor generates a reference thermopile sensor signal representing a difference between a temperature of the substrate surface and a temperature of a lid assembly surface. An external ambient temperature can be determined based upon the reference thermopile sensor signal.

Abstract: A mobile sterilization assembly, a mobile sterilization device, and method for sterilization using a mobile sterilization device are described for providing a low-cost and compact sterilization system using an ultraviolet light-emitting diode for sterilization. In an implementation, a mobile sterilization assembly includes a sterilization assembly couplable to a mobile device with a controller, the sterilization assembly including at least one light dispersive element; and an optical coupler configured to couple the at least one light dispersive element to a mobile device; where the at least one light dispersive element at least one of transmits and disperses light from at least one light-emitting diode or transmits light to a photodiode, where the at least one light-emitting diode or the photodiode are configured to be communicatively coupled to the controller.

Abstract: The present disclosure describes systems, methods, and devices for estimating spectral contributions in ambient light. The present disclosure also describes systems, methods, and devices for compensating for field of view errors resulting from the user, contextual structures (e.g., buildings, trees, fixtures, or geological formations), atmospheric effects (e.g., ozone coverage, smog, fog, haze, or clouds), device structures, and/or device orientation/tilt relative to a light source being measured (e.g., sun, indoor/outdoor light emitter, or an at least partially reflective surface). The present disclosure also describes systems, methods, and devices for estimating spectral contributions in light or color measurements and accounting for field of view errors to obtain a refined estimate.

Abstract: The present disclosure describes an ultraviolet (UV) sensor configured to detect a target UV spectrum (e.g., UVB spectrum). The UV sensor includes a first photodiode with a first UV spectral response and a second photodiode with a second UV spectral response. A filter layer having a graded spectral response is formed over the second photodiode, and the second UV spectral response is affected by a controlled parameter (e.g., thickness) of the filter layer. The UV sensor further includes a subtraction circuit coupled with the first photodiode and the second photodiode. The subtraction circuit is configured to provide a differential response based on a difference between the first UV spectral response and the second UV spectral response. The controlled parameter of the filter layer can be selected such that the differential response provides a detected spectral response of the target spectrum.

Abstract: A sensor device, a sensor package, and method for fabricating a sensor device are described that include an integrated light blocker disposed on the thermopile device and a lens configured to direct light to the thermopile device. In an implementation, the thermopile device includes a substrate; a thermopile membrane disposed on the substrate, the thermopile membrane including at least one passivation layer; a thermopile disposed within the thermopile membrane, the thermopile including at least one thermocouple; and a light blocking layer disposed proximate to the thermopile membrane, the light blocking layer including an aperture disposed proximate to the thermopile.

Abstract: A mobile sterilization assembly, a mobile sterilization device, and method for sterilization using a mobile sterilization device are described for providing a low-cost and compact sterilization system using an ultraviolet light-emitting diode for sterilization. In an implementation, a mobile sterilization assembly includes a sterilization assembly couplable to a mobile device with a controller, the sterilization assembly including at least one light dispersive element; and an optical coupler configured to couple the at least one light dispersive element to a mobile device; where the at least one light dispersive element at least one of transmits and disperses light from at least one light-emitting diode or transmits light to a photodiode, where the at least one light-emitting diode or the photodiode are configured to be communicatively coupled to the controller.

Abstract: The present disclosure is directed to a sensor package having a reference thermopile sensor, and a reference temperature sensor disposed therein to determine an ambient temperature. In one or more implementations, the sensor package includes a substrate having a substrate surface, a reference thermopile sensor disposed over the substrate surface, a reference temperature sensor disposed over the substrate surface, and a lid assembly disposed over the thermopile sensor and the reference thermopile sensor. The lid assembly includes a structure having a transparent portion that passes electromagnetic radiation occurring in a limited spectrum of wavelengths. The reference thermopile sensor generates a reference thermopile sensor signal representing a difference between a temperature of the substrate surface and a temperature of a lid assembly surface. An external ambient temperature can be determined based upon the reference thermopile sensor signal.