Abstract: Techniques are provided for an inductor at a second level interface between a first substrate and a second substrate. In an example, the inductor can include a winding and a core disposed inside the winding. The winding can include first conductive traces of a first substrate, second conductive traces of a second non-semiconductor substrate, and a plurality of connectors configured to connect the first substrate with the second substrate. Each connector of the plurality of connectors can be located between a trace of the first conductive traces and a corresponding trace of the second conductive traces.

Abstract: A graphical user interface allows a user to dynamically select a scope of friends to share media content based on a sharing criteria and interest degree analysis. The sharing criteria may be selected by the user to filter friends for sharing content. The interest degree analysis may be provided from a social media platform that identifies the topic and content of the media which is being shared and determines a degree of interest for each friend on the identified topic. The degree of interest is used to assign each friend to a sharing scope on the graphical user interface to allow the user to select a scope of friends to share the media.

Abstract: A method of fabricating interconnects in a semiconductor device is provided, which includes forming an interconnect layer having a conductive line and depositing a first aluminum-containing layer over the interconnect layer. A dielectric layer is deposited over the first aluminum-containing layer, followed by a second aluminum-containing layer deposited over the dielectric layer. A via opening is formed in the second aluminum-containing layer through to the conductive line, wherein the via opening has chamferless sidewalls.

Abstract: An emotional state of a user and one or more images of one or more respective objects observed by the user in an environment using an augmented reality device are received. It is determined whether the one or more objects include at least one negative impact object having a source color that can be changed to improve the emotional state of the user. In response to a determination that the one or more objects include at least one negative impact object having a source color that can be changed to improve the emotional state of the user, the augmented reality device is caused to render the at least one negative impact object with a target color assigned to improve the emotional state of the user.

Abstract: An integrated circuit package may be formed having a heat transfer fluid chamber, wherein the heat transfer fluid chamber may be positioned to allow a heat transfer fluid to directly contact an integrated circuit device within the integrated circuit package. In one embodiment, a first surface of the integrated circuit device may be electrically attached to a first substrate. The first substrate may then may be electrically attached to a second substrate, such that the integrated circuit device is between the first substrate and the second substrate. The second substrate may include a cavity, wherein the heat transfer fluid chamber may be formed between a second surface of the integrated circuit device and the cavity of the second substrate. Thus, at least a portion of a second surface of the integrated circuit device is exposed to the heat transfer fluid which flows into the heat transfer fluid chamber.

Abstract: Techniques of protecting cored or coreless semiconductor packages having materials formed from dissimilar metals from galvanic corrosion are described. An exemplary semiconductor package comprises one or more build-up layers; first and second semiconductor components (e.g., die, EMIB, etc.) on or embedded in the one or more build-up layers. The first semiconductor component may be electrically coupled to the second semiconductor component via a contact pad and an interconnect structure that are formed in the one or more build-up layers. The contact pad can comprise a contact region, a non-contact region, and a gap region that separates the contact region from the non-contact region. Coupling of the contact pad and an interconnect structure is performed by coupling only the contact region with the interconnect structure. Also, a surface area of the contact region can be designed to substantially equal to a surface area of the interconnect structure.

Abstract: Various examples are provided for vertically aligned ultra-high density nanowires and their transfer onto flexible substrates. In one example, a method includes forming a plurality of vertically aligned nanowires inside channels of an anodized alumina (AAO) template on an aluminum substrate, where individual nanowires of the plurality of vertically aligned nanowires extend to a distal end from a proximal end adjacent to the aluminum substrate; removing the aluminum substrate and a portion of the AAO template to expose a surface of the AAO template and a portion of the proximal end of the individual nanowires; depositing an interlayer on the exposed surface of the AAO template and the exposed portion of the individual nanowires; and removing the AAO template from around the plurality of vertically aligned nanowires embedded in the interlayer.

Abstract: An electronic interconnect may include a substrate. The substrate may include a passageway in the substrate. The passageway may extend from a first surface of the substrate toward a second surface of the substrate. The passageway may be closed at an end of the passageway. The electronic interconnect may include a plated through hole socket coupled to the passageway. The electronic interconnect may include a contact. The contact may include a pin. The pin may be configured to engage with the plated through hole socket. The electronic interconnect may include a solder ball. The solder ball may be coupled to the plated through hole socket.

Abstract: Disclosed embodiments include an embedded thin-film capacitor and a magnetic inductor that are assembled in two adjacent build-up layers of a semiconductor package substrate. The thin-film capacitor is seated on a surface of a first of the build-up layers and the magnetic inductor is partially disposed in a recess in the adjacent build up layer. The embedded thin-film capacitor and the integral magnetic inductor are configured within a die shadow that is on a die side of the semiconductor package substrate.

Abstract: A computer-implemented method according to one embodiment includes identifying a mobile detection device, requesting the mobile detection device to travel to a predetermined location, requesting the mobile detection device to retrieve location information and supplementary information from a radio frequency identification (RFID) tag at the predetermined location, receiving the location information and the supplementary information from the mobile detection device, determining a three-dimensional location of the RFID tag, based on the location information, and creating a three-dimensional map that includes the three-dimensional location of the RFID tag and the supplementary information from the RFID tag.

Abstract: A system and method for instant tongue sampling and diagnosis includes acquiring a plurality of tongue images from a plurality of digital oral devices, and a current health conditions, building a diagnosis framework for diagnosing a current health condition of a user by: i) analyzing the collected tongue images with a visual recognition engine to determine tongue characteristics of each tongue captured in the tongue images, and ii) correlating the tongue characteristics with the current health condition, identifying tongue characteristics from a received image of the tongue using the visual image recognition engine, applying the diagnosis framework to the tongue characteristics of the tongue to diagnosis the current health condition of the user, and modifying a graphical user interface of the digital oral device to display a custom health report indicative of the current health condition of the user, in response to applying the diagnosis framework.

Abstract: A method of fabricating interconnects in a semiconductor device is provided, which includes forming an interconnect layer having a conductive line and depositing a first aluminum-containing layer over the interconnect layer. A dielectric layer is deposited over the first aluminum-containing layer, followed by a second aluminum-containing layer deposited over the dielectric layer. A via opening is formed in the second aluminum-containing layer through to the conductive line, wherein the via opening has chamferless sidewalls.

Abstract: Microelectronic assemblies, related devices, and methods are disclosed herein. In some embodiments, a microelectronic assembly may include a die having a first surface and an opposing second surface; a capacitor having a surface, wherein the surface of the capacitor is coupled to the first surface of the die; and a conductive pillar coupled to the first surface of the die. In some embodiments, a microelectronic assembly may include a capacitor in a first dielectric layer; a conductive pillar in the first dielectric layer; a first die having a surface in the first dielectric layer; and a second die having a surface in a second dielectric layer, wherein the second dielectric layer is on the first dielectric layer, and wherein the surface of the second die is coupled to the capacitor, to the surface of the first die, and to the conductive pillar.

Abstract: Microelectronic assemblies that include a cooling channel, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate having a surface, a die having a surface, and a fluidic channel between the surface of the die and the surface of the package substrate, wherein a top surface of the fluidic channel is defined by the surface of the die and a bottom surface of the fluidic channel is defined by the surface of the package substrate. In some embodiments, a microelectronic assembly may include a package substrate having a surface; a die having a surface; and an interposer having a fluidic channel between the surface of the die and the surface of the package substrate.

Abstract: The present disclosure provides a method, computer system and computer program product for obtaining an image. According to the method, an emotional status of a user is determined, at least one character can be determined based on a preference of the user, and at least one image comprising the at least one character can be obtained based on the emotional status of the user.

Abstract: An integrated circuit (IC) package comprises a substrate comprising a dielectric and a thermal conduit that is embedded within the dielectric. The thermal conduit has a length that extends laterally within the dielectric from a first end to a second end. An IC die is thermally coupled to the first end of the thermal conduit. The IC die comprises an interconnect that is coupled to the first end of the thermal conduit. An integrated heat spreader comprises a lid over the IC die and at least one sidewall extending from the edge of the lid to the substrate that is thermally coupled to the second end of the thermal conduit.

Abstract: A system and method for providing reminding assistance. The system includes at least one processing component, at least one memory component, and a memory impairment detection and assistance environment. The memory impairment detection and assistance environment includes a reminding database, an analysis module, and an assistance module. The analysis module includes an attribute analyzer configured to determine values for attributes based on memory impairment detection data and a memory evaluator configured to determine that an attribute has a value that crosses a threshold attribute value. The assistance module includes a reminding assistant configured to receive a memory impairment signal and, in response, generate a reminder that includes information selected from the reminding database.

Abstract: Techniques provide a framework for dynamic globalization enablement for an application during software development. A globalization development operation information system (GDOIS) retrieves source code for the application, which is assigned to support specified globalization features. The GDOIS evaluates the source code for each of the plurality of specified globalization features. Upon determining that the source code does not include at least a first specified globalization feature, the GDOIS identifies an application programming interface (API) associated with the feature. The GDOIS inserts source code associated with the API into the source code for the application.

Abstract: A method, program product, and system for inputting Simplified and Traditional Chinese, Japanese, and Korean (CJK) characters into a touchscreen-enabled device is provided. The touchscreen-enabled device receives a plurality of finger touch events. Each of the plurality of finger touch events is a CJK text input stroke associated with a corner of the touchscreen-enabled device. A finger touch movement direction on the touchscreen-enabled device is determined for each of the plurality of finger touch events. In response to determining the finger touch movement direction, the finger touch movement direction associated with each of the plurality of finger touch events is converted to a numeric index value. The corner that is activated by each of the plurality of finger touch events is determined and associated to the numeric index value.

Abstract: A computer-implemented method includes: obtaining and storing, by a computer device, a service profile defining writing style rules, scoring information, and threshold information; receiving, by the computer device, an extracted program integrated information (PII) message from a client device; determining, by the computer device, an overall validation score of the extracted PII message is less than a threshold defined by the threshold information; generating, by the computer device, a modified PII message by changing content of the extracted PII message; and returning, by the computer device, the modified PII message to the client device for replacing the extracted PII message in a source code.