Patents by Inventor Cheng-Yi Teng

Cheng-Yi Teng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated Circuit Package and Method
    Publication number: 20240113071
    Abstract: An integrated circuit package including electrically floating metal lines and a method of forming are provided. The integrated circuit package may include integrated circuit dies, an encapsulant around the integrated circuit dies, a redistribution structure on the encapsulant, a first electrically floating metal line disposed on the redistribution structure, a first electrical component connected to the redistribution structure, and an underfill between the first electrical component and the redistribution structure. A first opening in the underfill may expose a top surface of the first electrically floating metal line.
    Type: Application
    Filed: January 5, 2023
    Publication date: April 4, 2024
    Inventors: Chung-Shi Liu, Mao-Yen Chang, Yu-Chia Lai, Kuo-Lung Pan, Hao-Yi Tsai, Ching-Hua Hsieh, Hsiu-Jen Lin, Po-Yuan Teng, Cheng-Chieh Wu, Jen-Chun Liao
  • Sputtering target assembly to prevent overetch of backing plate and methods of using the same
    Patent number: 11557470
    Abstract: A sputtering target assembly, sputtering apparatus, and method, the target assembly including a backing plate having an aperture formed therein; and a target bonded to a front surface of the backing plate. The aperture is disposed on the backing plate such that a first end of the aperture is sealed by a portion of the target that is predicted by a sputtering target erosion profile to have the highest etching rate during a corresponding sputtering process.
    Type: Grant
    Filed: July 12, 2022
    Date of Patent: January 17, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Chen-Fang Chung, Wen-Cheng Cheng, Po Wen Yang, Ming-Jie He, Yan-Zi Lu, Cheng-Yi Teng
  • SPUTTERING TARGET ASSEMBLY TO PREVENT OVERETCH OF BACKING PLATE AND METHODS OF USING THE SAME
    Publication number: 20220351953
    Abstract: A sputtering target assembly, sputtering apparatus, and method, the target assembly including a backing plate having an aperture formed therein; and a target bonded to a front surface of the backing plate. The aperture is disposed on the backing plate such that a first end of the aperture is sealed by a portion of the target that is predicted by a sputtering target erosion profile to have the highest etching rate during a corresponding sputtering process.
    Type: Application
    Filed: July 12, 2022
    Publication date: November 3, 2022
    Inventors: Chen-Fang CHUNG, Wen-Cheng CHENG, Po Wen YANG, Ming-Jie HE, Yan-Zi LU, Cheng-Yi TENG
  • Sputtering target assembly to prevent overetch of backing plate and methods of using the same
    Patent number: 11424111
    Abstract: A sputtering target assembly, sputtering apparatus, and method, the target assembly including a backing plate having an aperture formed therein; and a target bonded to a front surface of the backing plate. The aperture is disposed on the backing plate such that a first end of the aperture is sealed by a portion of the target that is predicted by a sputtering target erosion profile to have the highest etching rate during a corresponding sputtering process.
    Type: Grant
    Filed: June 25, 2020
    Date of Patent: August 23, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Chen-Fang Chung, Wen-Cheng Cheng, Po Wen Yang, Ming-Jie He, Yan-Zi Lu, Cheng-Yi Teng
  • SPUTTERING TARGET ASSEMBLY TO PREVENT OVERETCH OF BACKING PLATE AND METHODS OF USING THE SAME
    Publication number: 20210407777
    Abstract: A sputtering target assembly, sputtering apparatus, and method, the target assembly including a backing plate having an aperture formed therein; and a target bonded to a front surface of the backing plate. The aperture is disposed on the backing plate such that a first end of the aperture is sealed by a portion of the target that is predicted by a sputtering target erosion profile to have the highest etching rate during a corresponding sputtering process.
    Type: Application
    Filed: June 25, 2020
    Publication date: December 30, 2021
    Inventors: Chen-Fang Chung, Wen-Cheng Cheng, Po Wen Yang, Ming-Jie He, Yan-Zi Lu, Cheng-Yi Teng