Patents by Inventor Cheng-Yi Yu
Cheng-Yi Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240162051Abstract: Some implementations described herein include systems and techniques for fabricating a stacked die product. The systems and techniques include using a supporting fill mixture that includes a combination of types of composite particulates in a lateral gap region of a stack of semiconductor substrates and along a perimeter region of the stack of semiconductor substrates. One type of composite particulate included in the combination may be a relatively smaller size and include a smooth surface, allowing the composite particulate to ingress deep into the lateral gap region. Properties of the supporting fill mixture including the combination of types of composite particulates may control thermally induced stresses during downstream manufacturing to reduce a likelihood of defects in the supporting fill mixture and/or the stack of semiconductor substrates.Type: ApplicationFiled: April 27, 2023Publication date: May 16, 2024Inventors: Kuo-Ming WU, Hau-Yi HSIAO, Kai-Yun YANG, Che Wei YANG, Sheng-Chau CHEN, Chung-Yi YU, Cheng-Yuan TSAI
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Patent number: 11953740Abstract: A package structure including a photonic, an electronic die, an encapsulant and a waveguide is provided. The photonic die includes an optical coupler. The electronic die is electrically coupled to the photonic die. The encapsulant laterally encapsulates the photonic die and the electronic die. The waveguide is disposed over the encapsulant and includes an upper surface facing away from the encapsulant. The waveguide includes a first end portion and a second end portion, the first end portion is optically coupled to the optical coupler, and the second end portion has a groove on the upper surface.Type: GrantFiled: May 14, 2021Date of Patent: April 9, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo, Tsung-Yuan Yu, Hua-Kuei Lin, Che-Hsiang Hsu
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Patent number: 11947173Abstract: A package includes a photonic layer on a substrate, the photonic layer including a silicon waveguide coupled to a grating coupler; an interconnect structure over the photonic layer; an electronic die and a first dielectric layer over the interconnect structure, where the electronic die is connected to the interconnect structure; a first substrate bonded to the electronic die and the first dielectric layer; a socket attached to a top surface of the first substrate; and a fiber holder coupled to the first substrate through the socket, where the fiber holder includes a prism that re-orients an optical path of an optical signal.Type: GrantFiled: May 5, 2023Date of Patent: April 2, 2024Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo, Tsung-Yuan Yu, Hua-Kuei Lin, Che-Hsiang Hsu
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Patent number: 11935878Abstract: A method for manufacturing a package structure includes providing a carrier board; providing at least one die having a top surface, a bottom surface, and a side surface on the carrier board; and forming a protective layer to cover at least a portion of the side surface of the die. The die includes a substrate, a semiconductor layer, a gate structure, a source structure and a drain structure, at least one dielectric layer, and at least one pad. The semiconductor layer is disposed on the substrate. The gate structure is disposed on the semiconductor layer. The source and the drain structures are disposed on opposite sides of the gate structure. The dielectric layer covers the gate, source, and drain structures. The pad is disposed on the dielectric layer and penetrates through the dielectric layer to electrically contact with the gate, source or drain structure.Type: GrantFiled: September 10, 2021Date of Patent: March 19, 2024Assignee: VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATIONInventors: Hsiu-Mei Yu, Guang-Yuan Jiang, Cheng-Yi Hsieh, Wei-Chan Chang, Chang-Sheng Lin
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Patent number: 11935871Abstract: A semiconductor package including a first semiconductor die, a second semiconductor die, a first insulating encapsulation, a dielectric layer structure, a conductor structure and a second insulating encapsulation is provided. The first semiconductor die includes a first semiconductor substrate and a through silicon via (TSV) extending from a first side to a second side of the semiconductor substrate. The second semiconductor die is disposed on the first side of the semiconductor substrate. The first insulating encapsulation on the second semiconductor die encapsulates the first semiconductor die. A terminal of the TSV is coplanar with a surface of the first insulating encapsulation. The dielectric layer structure covers the first semiconductor die and the first insulating encapsulation. The conductor structure extends through the dielectric layer structure and contacts with the through silicon via.Type: GrantFiled: August 30, 2021Date of Patent: March 19, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Hao-Yi Tsai, Cheng-Chieh Hsieh, Tsung-Hsien Chiang, Hui-Chun Chiang, Tzu-Sung Huang, Ming-Hung Tseng, Kris Lipu Chuang, Chung-Ming Weng, Tsung-Yuan Yu, Tzuan-Horng Liu
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Publication number: 20240069277Abstract: A semiconductor package includes a first die stack structure and a second die stack structure, an insulating encapsulation, a redistribution structure, at least one prism structure and at least one reflector. The first die stack structure and the second die stack structure are laterally spaced apart from each other along a first direction, and each of the first die stack structure and the second die stack structure comprises an electronic die; and a photonic die electronically communicating with the electronic die. The insulating encapsulation laterally encapsulates the first die stack structure and the second die stack structure. The redistribution structure is disposed on the first die stack structure, the second die stack structure and the insulating encapsulation, and electrically connected to the first die stack structure and the second die stack structure. The at least one prism structure is disposed within the redistribution structure and optically coupled to the photonic die.Type: ApplicationFiled: August 29, 2022Publication date: February 29, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Hung-Yi Kuo, Chen-Hua Yu, Cheng-Chieh Hsieh, Che-Hsiang Hsu, Chung-Ming Weng, Tsung-Yuan Yu
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Publication number: 20230192209Abstract: A headlight horizontal lighting pattern adjustment system includes an inclination angle sensor connected to a vehicle to sense an inclination angle value of the vehicle. A processing unit receives the inclination angle value and processes the inclination angle value into a driving value. A driving module drives a lighting device. The driving module commands the driving device to driving and rotate the lighting device according the driving value. The headlight horizontal lighting pattern adjustment system is equipped to a motorbike or an electric motorbike. When the motorbike turns and tilt, the processing unit adjusts the light of the lighting device by the driving module and the driving device to eliminate dark corners in the dark zone and maintains the full scale of light pattern to enhance safety to all the road users.Type: ApplicationFiled: March 21, 2022Publication date: June 22, 2023Inventor: CHENG-YI YU
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Patent number: 11661131Abstract: A headlight horizontal lighting pattern adjustment system includes an inclination angle sensor connected to a vehicle to sense an inclination angle value of the vehicle. A processing unit receives the inclination angle value and processes the inclination angle value into a driving value. A driving module drives a lighting device. The driving module commands the driving device to driving and rotate the lighting device according the driving value. The headlight horizontal lighting pattern adjustment system is equipped to a motorbike or an electric motorbike. When the motorbike turns and tilt, the processing unit adjusts the light of the lighting device by the driving module and the driving device to eliminate dark corners in the dark zone and maintains the full scale of light pattern to enhance safety to all the road users.Type: GrantFiled: March 21, 2022Date of Patent: May 30, 2023Assignee: Ta Yih Industrial Co., Ltd.Inventor: Cheng-Yi Yu
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Patent number: 6554353Abstract: A dual-purpose chair comprises a seat structure and a base structure fastened detachably with the seat structure. When the seat structure and the base structure are fastened together, the chair serves as an office chair. The seat structure can be separated from the base structure for use as a deck chair.Type: GrantFiled: December 10, 2001Date of Patent: April 29, 2003Inventor: Cheng-Yi Yu
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Publication number: 20020121800Abstract: A lawn chair includes a seat member disposed between left and right leg units, a backrest member extending uprightly from the seat member, and left and right armrest member fastened pivotally to the backrest member at rear portions thereof. Two tension springs are fastened to the armrest members and the leg units for urging the backrest member to a predetermined inclination relative to the seat member. Downward pressure on the backrest member by virtue of body weight of a seated person against tension force of the springs, and a simultaneous upward lifting of the armrest members relative to the leg units result in adjusting the backrest member to a desired inclined position relative to the seat member. Removal of the downward pressure from the backrest member can result in restoration of the backrest member to the predetermined inclination.Type: ApplicationFiled: March 5, 2001Publication date: September 5, 2002Inventor: Cheng-Yi Yu