Patents by Inventor Cheng-Yu Chu
Cheng-Yu Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11990258Abstract: An over-current protection device includes first and second electrode layers and a PTC material layer laminated therebetween. The PTC material layer includes a polymer matrix, a conductive filler, and a titanium-containing dielectric filler. The polymer matrix has a fluoropolymer. The titanium-containing dielectric filler has a compound represented by a general formula of MTiO3, wherein the M represents transition metal or alkaline earth metal. The total volume of the PTC material layer is calculated as 100%, and the titanium-containing dielectric filler accounts to for 5-15% by volume of the PTC material layer.Type: GrantFiled: September 28, 2022Date of Patent: May 21, 2024Assignee: POLYTRONICS TECHNOLOGY CORP.Inventors: Hsiu-Che Yen, Yung-Hsien Chang, Cheng-Yu Tung, Chen-Nan Liu, Chia-Yuan Lee, Yu-Chieh Fu, Yao-Te Chang, Fu-Hua Chu
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Publication number: 20240159642Abstract: A smoke detector with an anti-insect function includes a substrate, an optical detection module, a top cover, a base and a perforated plate. The substrate has a ring shape region surrounding a central detection region, and a first block structure of the central detection region is protruded from the substrate and higher than an upper surface of the ring shape region. The optical detection module is disposed inside the central detection region. The top cover has a lateral wall. The base is disposed on the substrate and connected to the top cover to cover the optical detection module. The base has a second block structure partly overlapped with the lateral wall to form a guiding channel. The perforated plate is disposed between the lateral wall and the second block structure to prevent an insect from moving into the top cover through the guiding channel.Type: ApplicationFiled: January 25, 2024Publication date: May 16, 2024Applicant: PixArt Imaging Inc.Inventors: Yen-Chang Chu, Cheng-Nan Tsai, Chih-Ming Sun, Zhi-Hao Wu, Hung-Yu Lai
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Publication number: 20240162833Abstract: A power supply unit supplies power to a load, and the power supply unit includes a power factor corrector, a DC conversion module, and an isolated conversion module. The power factor corrector is plugged into a first main circuit board and converts an AC power into a DC power. The DC conversion module is plugged into the first main circuit board and converts the DC power into a main power. The isolated conversion module includes a bus capacitor, the bus capacitor is coupled to the DC conversion module through a first power copper bar, and coupled to the power factor corrector through a second power copper bar. The first power copper bar and the second power copper bar are arranged on a side opposite to the first main circuit board, and are arranged in parallel with the first main circuit board.Type: ApplicationFiled: November 13, 2023Publication date: May 16, 2024Inventors: Yi-Sheng CHANG, Cheng-Chan HSU, Chia-Wei CHU, Chun-Yu YANG, Deng-Cyun HUANG, Yi-Hsun CHIU, Chien-An LAI, Yu-Tai WANG, Chi-Shou HO, Zhi-Yuan WU, Ko-Wen LU
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Publication number: 20240145132Abstract: An over-current protection device includes first and second electrode layers and a PTC material layer laminated therebetween. The PTC material layer includes a polymer matrix, and a conductive filler. The polymer matrix has a fluoropolymer. The total volume of the PTC material layer is calculated as 100%, and the fluoropolymer accounts for 47-62% by volume of the PTC material layer. The fluoropolymer has a melt viscosity higher than 3000 Pa·s.Type: ApplicationFiled: March 16, 2023Publication date: May 2, 2024Inventors: CHENG-YU TUNG, CHEN-NAN LIU, Chia-Yuan Lee, HSIU-CHE YEN, YUNG-HSIEN CHANG, Yao-Te Chang, FU-HUA CHU
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Publication number: 20240145133Abstract: An over-current protection device includes a first metal layer, a second metal layer and a heat-sensitive layer laminated therebetween. The heat-sensitive layer exhibits a positive temperature coefficient (PTC) characteristic and includes a polymer matrix and a first conductive filler. The polymer matrix includes a polyolefin-based polymer and a fluoropolymer. The fluoropolymer has a melt flow index higher than 1.9 g/10 min, and the polyolefin-based polymer and the fluoropolymer together form an interpenetrating polymer network (IPN). The first conductive filler has a metal-ceramic compound dispersed in the polymer matrix.Type: ApplicationFiled: April 5, 2023Publication date: May 2, 2024Inventors: CHEN-NAN LIU, YUNG-HSIEN CHANG, CHENG-YU TUNG, HSIU-CHE YEN, Chia-Yuan LEE, Yao-Te CHANG, FU-HUA CHU
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Publication number: 20240127988Abstract: An over-current protection device includes a first metal layer, a second metal layer and a heat-sensitive layer laminated therebetween. The heat-sensitive layer exhibits a positive temperature coefficient (PTC) characteristic and includes a first polymer and a conductive filler. The first polymer consists of polyvinylidene difluoride (PVDF), and PVDF exists in different phases such as ?-PVDF, ?-PVDF and ?-PVDF. The total amount of ?-PVDF, ?-PVDF and ?-PVDF is calculated as 100%, and the amount of ?-PVDF accounts for 48% to 55%. The conductive filler has a metal-ceramic compound.Type: ApplicationFiled: March 2, 2023Publication date: April 18, 2024Inventors: HSIU-CHE YEN, YUNG-HSIEN CHANG, CHENG-YU TUNG, Chia-Yuan Lee, CHEN-NAN LIU, Yao-Te Chang, FU-HUA CHU
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Publication number: 20240127989Abstract: An over-current protection device includes a first metal layer, a second metal layer and a heat-sensitive layer laminated therebetween. The heat-sensitive layer exhibits a positive temperature coefficient (PTC) characteristic and includes a first polymer and a conductive filler. The first polymer consists of polyvinylidene difluoride (PVDF), and PVDF exists in different phases such as ?-PVDF, ?-PVDF and ?-PVDF. The total amount of ?-PVDF, ?-PVDF and ?-PVDF is calculated as 100%, and the amount of ?-PVDF accounts for 33% to 42%.Type: ApplicationFiled: January 25, 2023Publication date: April 18, 2024Inventors: CHIA-YUAN LEE, CHENG-YU TUNG, HSIU-CHE YEN, CHEN-NAN LIU, YUNG-HSIEN CHANG, YAO-TE CHANG, FU-HUA CHU
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Patent number: 11654529Abstract: A burr trimming device includes a removing assembly and a directed spraying assembly disposed on a carrier, wherein the directed spraying assembly has a nozzle facing the removing assembly. The directed spraying assembly rapidly freezes objects such as burrs and then the removing assembly removes the hardened objects by coming into rigid contact therewith, thereby ensuring complete removal of the fine flexible burrs.Type: GrantFiled: March 19, 2020Date of Patent: May 23, 2023Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Zhi-Xiang Chen, Chia-Chung Sung, Cheng-Yu Chu, Jao-Hao Chen
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Publication number: 20210205954Abstract: A burr trimming device includes a removing assembly and a directed spraying assembly disposed on a carrier, wherein the directed spraying assembly has a nozzle facing the removing assembly. The directed spraying assembly rapidly freezes objects such as burrs and then the removing assembly removes the hardened objects by coming into rigid contact therewith, thereby ensuring complete removal of the fine flexible burrs.Type: ApplicationFiled: March 19, 2020Publication date: July 8, 2021Inventors: Zhi-Xiang Chen, Chia-Chung Sung, Cheng-Yu Chu, Jao-Hao Chen
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Publication number: 20200206912Abstract: A transmission device is provided, including a first housing, a second housing connected to the first housing, a third housing axially connected to the second housing, an adapter disposed on the third housing, a first power shaft actuating the first housing and the second housing to rotate, a second power shaft actuating the third housing to rotate, and a third power shaft actuating the adapter to rotate. The second and third power shafts are a coaxial structure. The first power shaft is an independent rod. Therefore, a motor loaded with a smaller rotation inertia and being thus cheaper can be used to drive the first power shaft, and the transmission device can have a reduced cost.Type: ApplicationFiled: March 27, 2019Publication date: July 2, 2020Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Meng-He WU, Shang-Te CHEN, Chia-Chung SUNG, Cheng-Yu CHU, Jan-Hao CHEN
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Publication number: 20200070367Abstract: A load balancing device for a robot arm including a pneumatic cylinder and a piston rod is provided. The pneumatic cylinder, used to store a gas, includes a first chamber, a second chamber and a communicating passage, wherein the communicating passage connects the first chamber and the second chamber. The piston rod has one end connected to the robot arm and the other end slidably disposed in the pneumatic cylinder. The piston rod adjusts the volume and the pressure of the gas in the first chamber and the second chamber according to a load, wherein the first chamber and the second chamber are coaxially disposed in the axial direction of the pneumatic cylinder.Type: ApplicationFiled: November 16, 2018Publication date: March 5, 2020Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Chia-Chung SUNG, Shang-Te CHEN, Cheng-Yu CHU, Meng-He WU, Jan-Hao CHEN
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Patent number: 7816169Abstract: Disclosed is an ordered microelectronic fabrication sequence in which color filters are formed by conformal deposition directly onto a photodetector array of a CCD, CID, or CMOS imaging device to create a concave-up pixel surface, and, overlayed with a high transmittance planarizing film of specified index of refraction and physical properties which optimize light collection to the photodiode without additional conventional microlenses. The optically flat top surface serves to encapsulate and protect the imager from chemical and thermal cleaning treatment damage, minimizes topographical underlayer variations which would aberrate or cause reflection losses of images formed on non-planar surfaces, and, obviates residual particle inclusions induced during dicing and packaging. A CCD imager is formed by photolithographically patterning a planar-array of photodiodes on a semiconductor substrate. The photodiode array is provided with metal photoshields, passivated, and, color filters are formed thereon.Type: GrantFiled: December 31, 2008Date of Patent: October 19, 2010Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Yang-Tung Fan, Chiou-Shian Peng, Cheng-Yu Chu, Shih-Jane Lin, Yen-Ming Chen, Fu-Jier Fan, Kuo-Wei Li
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Publication number: 20090111208Abstract: Disclosed is an ordered microelectronic fabrication sequence in which color filters are formed by conformal deposition directly onto a photodetector array of a CCD, CID, or CMOS imaging device to create a concave-up pixel surface, and, overlayed with a high transmittance planarizing film of specified index of refraction and physical properties which optimize light collection to the photodiode without additional conventional microlenses. The optically flat top surface serves to encapsulate and protect the imager from chemical and thermal cleaning treatment damage, minimizes topographical underlayer variations which would aberrate or cause reflection losses of images formed on non-planar surfaces, and, obviates residual particle inclusions induced during dicing and packaging. A CCD imager is formed by photolithographically patterning a planar-array of photodiodes on a semiconductor substrate. The photodiode array is provided with metal photoshields, passivated, and, color filters are formed thereon.Type: ApplicationFiled: December 31, 2008Publication date: April 30, 2009Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Yang-Tung FAN, Chiou-Shian Peng, Cheng-Yu Chu, Shih-Jane Lin, Yen-Ming Chen, Fu-Jier Fan, Kuo-Wei Lin
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Patent number: 7485906Abstract: Disclosed is an ordered microelectronic fabrication sequence in which color filters are formed by conformal deposition directly onto a photodetector array of a CCD, CID, or CMOS imaging device to create a concave-up pixel surface, and, overlayed with a high transmittance planarizing film of specified index of refraction and physical properties which optimize light collection to the photodiode without additional conventional microlenses. The optically flat top surface serves to encapsulate and protect the imager from chemical and thermal cleaning treatment damage, minimizes topographical underlayer variations which would aberrate or cause reflection losses of images formed on non-planar surfaces, and, obviates residual particle inclusions induced during dicing and packaging. A CCD imager is formed by photolithographically patterning a planar-array of photodiodes on a semiconductor substrate. The photodiode array is provided with metal photoshields, passivated, and, color filters are formed thereon.Type: GrantFiled: December 20, 2006Date of Patent: February 3, 2009Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yang-Tung Fan, Chiou-Shian Peng, Cheng-Yu Chu, Shih-Jane Lin, Yen-Ming Chen, Fu-Jier Fan, Kuo-Wei Lin
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Patent number: 7183598Abstract: Disclosed is an ordered microelectronic fabrication sequence in which color filters are formed by conformal deposition directly onto a photodetector array of a CCD, CID, or CMOS imaging device to create a concave-up pixel surface, and, overlayed with a high transmittance planarizing film of specified index of refraction and physical properties which optimize light collection to the photodiode without additional conventional microlenses. The optically flat top surface serves to encapsulate and protect the imager from chemical and thermal cleaning treatment damage, minimizes topographical underlayer variations which would aberrate or cause reflection losses of images formed on non-planar surfaces, and, obviates residual particle inclusions induced during dicing and packaging. A CCD imager is formed by photolithographically patterning a planar-array of photodiodes on a semiconductor substrate. The photodiode array is provided with metal photoshields, passivated, and, color filters are formed thereon.Type: GrantFiled: January 18, 2005Date of Patent: February 27, 2007Assignee: Taiwan Semiconductor Manufacturing CompanyInventors: Yang-Tung Fan, Chiou-Shian Peng, Cheng-Yu Chu, Shih-Jane Lin, Yen-Ming Chen, Fu-Jier Fan, Kuo-Wei Lin
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Publication number: 20060110842Abstract: The disclosure relates to a method and apparatus for preventing extrusion or spiking of a metal atom from a metallization layer to other layers of a silicon wafer. In one embodiment, the method includes forming a silicon-on-ship device with a MEMS component on the substrate. The MEMS component may include one or more metal or metallic alloys. To prevent spiking from the MEMS component, the sides thereof can be coated with one ore more spacer or barrier layers. In one embodiment, oxygen plasma and thermal oxidation methods are used to deposit spacers. In another embodiment, an oxide layer is deposited over the wafer, covering the substrate and the MEMS component. Selective etching or anisotropic etching can be used to remove the oxide layer from certain regions of the MEMS and the substrate while covering the sidewalls. An amorphous silicon layer can then be deposited to cover the MEMS device.Type: ApplicationFiled: November 23, 2004Publication date: May 25, 2006Inventors: Yuh-Hwa Chang, Fei-Yun Chen, Jiann-Tyng Tzeng, Cheng-Yu Chu, Chun-Kai Peng, Chih-Chieh Yeh, Chih-Heng Po, Dah-Chuen Ho
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Patent number: 6958546Abstract: A new method and processing sequence is provided for the formation of solder bumps that are in contact with underlying aluminum contact pads. A patterned layer of negative photoresist is interposed between a patterned layer of PE Si3N4 and a patterned layer of polyamide insulator. The patterned negative photoresist partially overlays the aluminum contact pad and prevents contact between the layer of polyamide insulator and the aluminum contact pad. By forming this barrier no moisture that is contained in the polyamide insulator can come in contact with the aluminum contact pad, therefore no corrosion in the surface of the aluminum contact pad can occur.Type: GrantFiled: May 13, 2003Date of Patent: October 25, 2005Assignee: Taiwan Semiconductor Manufacturing CompanyInventors: Fu-Jier Fan, Cheng-Yu Chu, Kuo Wei Lin, Shih-Jang Lin, Yang-Tung Fran, Chiou-Shian Peng
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Patent number: 6956292Abstract: A new process is provided which is an extension and improvement of present processing for the creation of a solder bump. After the layers of Under Bump Metal and a layer of solder metal have been created in patterned and etched format and overlying the contact pad, following a conventional processing sequence, a layer of polyimide is deposited. The solder flow is performed using the thickness of the deposited layer of polyimide to control the height of the column underneath the reflown solder.Type: GrantFiled: July 3, 2003Date of Patent: October 18, 2005Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Yang-Tung Fan, Cheng-Yu Chu, Fu-Jier Fan, Shih-Jane Lin, Chiou-Shian Peng, Yen-Ming Chen, Kuo-Wei Lin
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Patent number: 6936923Abstract: A new method and processing sequence is provided for the creation of interconnect bumps. A layer of passivation is deposited over a contact pad and patterned, creating an opening in the layer of passivation that aligns with the contact pad. A layer of UBM metal is deposited over the layer of passivation, the layer of UBM is overlying the contact pad and limited to the immediate surroundings of the contact pad. The central surface of the layer of UBM is selectively electroplated after which a layer of solder or solder alloy is solder printed over the electroplated surface of the layer of UBM. A solder flux or paste is applied over the surface of the solder printed solder compound or solder alloy. Flowing of the solder or solder alloy creates the solder bump of the invention.Type: GrantFiled: May 16, 2002Date of Patent: August 30, 2005Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Kuo-Wei Lin, Cheng-Yu Chu, Yen-Ming Chen, Yang-Tung Fan, Fu-Jier Fan, Chiou Shian Peng, Shih-Jang Lin
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Publication number: 20050121737Abstract: Disclosed is an ordered microelectronic fabrication sequence in which color filters are formed by conformal deposition directly onto a photodetector array of a CCD, CID, or CMOS imaging device to create a concave-up pixel surface, and, overlayed with a high transmittance planarizing film of specified index of refraction and physical properties which optimize light collection to the photodiode without additional conventional microlenses. The optically flat top surface serves to encapsulate and protect the imager from chemical and thermal cleaning treatment damage, minimizes topographical underlayer variations which would aberrate or cause reflection losses of images formed on non-planar surfaces, and, obviates residual particle inclusions induced during dicing and packaging. A CCD imager is formed by photolithographically patterning a planar-array of photodiodes on a semiconductor substrate. The photodiode array is provided with metal photoshields, passivated, and, color filters are formed thereon.Type: ApplicationFiled: January 18, 2005Publication date: June 9, 2005Inventors: Yang-Tung Fan, Chion-Shian Peng, Cheng-Yu Chu, Shih-Jane Lin, Yen-Ming Chen, Fu-Jier Fan, Kuo-Wei Lin