Abstract: A method of manufacturing a semiconductor structure includes receiving a first substrate including an IMD layer disposed over the first substrate and a plurality of conductive bumps disposed in the IMD layer; receiving a second substrate; disposing a patterned adhesive over the first substrate, wherein at least a portion of the IMD layer is exposed through the patterned adhesive; and bonding the first substrate with the second substrate, wherein a top surface of the at least portion of the IMD layer is exposed through the patterned adhesive after bonding the first substrate with the second substrate.

Abstract: A method of manufacturing a semiconductor structure, including receiving a first substrate including a plurality of conductive bumps disposed over the first substrate; receiving a second substrate; disposing an adhesive over the first substrate; removing a portion of the adhesive to expose at least one of the plurality of conductive bumps; and bonding the first substrate with the second substrate.

Abstract: A method of manufacturing a semiconductor structure, including receiving a first substrate including a plurality of conductive bumps disposed over the first substrate; receiving a second substrate; disposing an adhesive over the first substrate; removing a portion of the adhesive to expose at least one of the plurality of conductive bumps; and bonding the first substrate with the second substrate.

Abstract: A method of manufacturing a semiconductor structure, comprising: receiving a first substrate including a first surface, a second surface opposite to the first surface and a plurality of conductive bumps disposed over the first surface; receiving a second substrate; disposing an adhesive over the first substrate or the second substrate; heating the adhesive in a first ambiance; bonding the first substrate with the second substrate by applying a force of less than about 10,000N upon the first substrate or the second substrate and heating the adhesive in a second ambiance; and thinning down a thickness of the first substrate from the second surface.

Abstract: A method of manufacturing a semiconductor structure, comprising: receiving a first substrate including a first surface, a second surface opposite to the first surface and a plurality of conductive bumps disposed over the first surface; receiving a second substrate; disposing an adhesive over the first substrate or the second substrate; heating the adhesive in a first ambiance; bonding the first substrate with the second substrate by applying a force of less than about 10,000N upon the first substrate or the second substrate and heating the adhesive in a second ambiance; and thinning down a thickness of the first substrate from the second surface.

Abstract: One or more methods for semiconductor processing are provided. At least one of the methods include receiving information regarding a pre-etch back thickness of a first layer over a substrate, comparing the pre-etch back thickness to a desired thickness of the first layer, responsive to the pre-etch back thickness being greater than the desired thickness, determining parameters for an etch back process and performing the etch back process on the first layer to reduce the pre-etch back thickness to a first etch back thickness. The etch back process comprising performing a gas cluster ion beam etching process. In some embodiments, a second etch back process is performed. In some embodiments a wet clean process is performed on the first layer after the etch back process.

Abstract: An upper body reciprocating exerciser includes a frame having a post. A cam is connected to the post and has a guide slot which is cooperated with a piston rod of a cylinder. An enclosed loop pipe is connected to outside of the cylinder and includes two sets of a check valve and an adjustable control valve. The loop pipe communicates with a space in the cylinder. The check valves and the adjustable control valves control fluid in the cylinder to adjust the resistance force when a user pulls a pull unit, so that the user's bones and muscles are exercised properly.

Abstract: A lower body reciprocating exerciser includes a frame having two posts on two sides thereof. Two swing units are respectively connected to the two posts and an arm of each swing unit is connected with a cam of a transmission unit corresponding thereto. The cam is connected with a piston rod of a resistance unit corresponding thereto and the piston rod is connected with a piston located in a cylinder. An enclosed loop pipe is connected to outside of each of the cylinders and includes two sets of a check valve and an adjustable control valve. The loop pipe communicates with the space in the cylinder. The check valves and the adjustable control valves control the fluid in the cylinders to adjust the resistance force when the user swings the pedals and the arms, so that the user's bones and muscles of the lower body are exercised properly.

Abstract: A lower body reciprocating exerciser includes a frame having two posts on two sides thereof. Two swing units are respectively connected to the two posts and an arm of each swing unit is connected with a cam of a transmission unit corresponding thereto. The cam is connected with a piston rod of a resistance unit corresponding thereto and the piston rod is connected with a piston located in a cylinder. An enclosed loop pipe is connected to outside of each of the cylinders and includes two sets of a check valve and an adjustable control valve. The loop pipe communicates with the space in the cylinder. The check valves and the adjustable control valves control the fluid in the cylinders to adjust the resistance force when the user swings the pedals and the arms, so that the user's bones and muscles of the lower body are exercised properly.

Abstract: An upper body reciprocating exerciser includes a frame having a post. A cam is connected to the post and has a guide slot which is cooperated with a piston rod of a cylinder. An enclosed loop pipe is connected to outside of the cylinder and includes two sets of a check valve and an adjustable control valve. The loop pipe communicates with a space in the cylinder. The check valves and the adjustable control valves control fluid in the cylinder to adjust the resistance force when a user pulls a pull unit, so that the user's bones and muscles are exercised properly.