Patents by Inventor Chengdong Wang

Chengdong Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240162566
    Abstract: A separator includes a substrate and a coating. The coating is formed on at least a portion of surface of the substrate. The coating includes composite particles and a binder. The composite particles form bulges on surface of the coating. The composite particles include polyacrylate particles and first inorganic particles. The first inorganic particle is present between at least two of the polyacrylate particles.
    Type: Application
    Filed: January 22, 2024
    Publication date: May 16, 2024
    Inventors: Haiyi HONG, Yanyun MA, Xiaonan CHENG, Lei CHAO, Peng WANG, Chongwang HAN, Yuxia LI, Jianrui YANG, Yi ZHENG, Chengdong SUN
  • Publication number: 20240029229
    Abstract: The invention provides a measurement method and system of undeformed chip thickness in micro-milling. This method includes the steps of: S1: acquiring a surface topography picture of the bottom of a flute after micro-milling; S2: extracting a tool mark at the central line of the flute from the surface topography picture; S3: calculating a spacing distance between adjacent tool marks and calculating the difference of equivalent cutting radius between adjacent cutter teeth based on the spacing distance between adjacent tool marks; and S4: reconstructing the instant undeformed chip thickness in micro-milling based on the difference of equivalent cutting radius between adjacent cutter teeth.
    Type: Application
    Filed: July 12, 2022
    Publication date: January 25, 2024
    Inventors: Tongshun LIU, Kedong ZHANG, Chengdong WANG, Xuhong GUO
  • Patent number: 11869180
    Abstract: The invention provides a measurement method and system of undeformed chip thickness in micro-milling. This method includes the steps of: S1: acquiring a surface topography picture of the bottom of a flute after micro-milling; S2: extracting a tool mark at the central line of the flute from the surface topography picture; S3: calculating a spacing distance between adjacent tool marks and calculating the difference of equivalent cutting radius between adjacent cutter teeth based on the spacing distance between adjacent tool marks; and S4: reconstructing the instant undeformed chip thickness in micro-milling based on the difference of equivalent cutting radius between adjacent cutter teeth.
    Type: Grant
    Filed: July 12, 2022
    Date of Patent: January 9, 2024
    Assignee: SOOCHOW UNIVERSITY
    Inventors: Tongshun Liu, Kedong Zhang, Chengdong Wang, Xuhong Guo
  • Patent number: 7774293
    Abstract: A hybrid causal framework applies properties of probabilistic models, such as Bayesian belief networks, to causal logic models, such as fault trees and event sequence diagrams. The probabilistic model establishes a joint probability distribution of causal relationships between events and conditions in the logic models. The probability of the events and conditions are found by propagating probabilities from the probabilistic model through the logic models.
    Type: Grant
    Filed: March 17, 2006
    Date of Patent: August 10, 2010
    Assignee: University of Maryland
    Inventors: Ali Mosleh, Chengdong Wang, Franciscus J. Groen
  • Publication number: 20070011113
    Abstract: A hybrid causal framework applies properties of probabilistic models, such as Bayesian belief networks, to causal logic models, such as fault trees and event sequence diagrams. The probabilistic model establishes a joint probability distribution of causal relationships between events and conditions in the logic models. The probability of the events and conditions are found by propagating probabilities from the probabilistic model through the logic models.
    Type: Application
    Filed: March 17, 2006
    Publication date: January 11, 2007
    Inventors: Ali Mosleh, Chengdong Wang, Franciscus Groen