Patents by Inventor Chengfang YUAN

Chengfang YUAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11905213
    Abstract: An ultra-high performance concrete (UHPC) with waste brick powder and preparation method and application thereof are provided, which relates to the technical field of concrete. The preparation method includes the following steps: stimulating activity of a brick powder by a method of mechanically stimulating activity to obtain waste brick powder; and preparing UHPC according to a mass ratio of cement to waste brick powder of 5:5-7:3 to obtain the UHPC with waste brick powder. The UHPC is prepared by treating waste bricks from construction waste (mechanically stimulating activity) to make waste brick powder with activity, therefore partially replacing cement. The UHPC is applied in a construction field.
    Type: Grant
    Filed: June 26, 2023
    Date of Patent: February 20, 2024
    Assignee: ZHENGZHOU UNIVERSITY
    Inventors: Chengfang Yuan, Hu Feng, Ali Raza, Lei Shen, Yanan Sun, Changjiu Zhang, Baoliang Wang, Xiaohan Wu, Na Chen, Gangzhu Sun
  • Publication number: 20230416147
    Abstract: An ultra-high performance concrete (UHPC) with waste brick powder and preparation method and application thereof are provided, which relates to the technical field of concrete. The preparation method includes the following steps: stimulating activity of a brick powder by a method of mechanically stimulating activity to obtain waste brick powder; and preparing UHPC according to a mass ratio of cement to waste brick powder of 5:5-7:3 to obtain the UHPC with waste brick powder. The UHPC is prepared by treating waste bricks from construction waste (mechanically stimulating activity) to make waste brick powder with activity, therefore partially replacing cement. The UHPC is applied in a construction field.
    Type: Application
    Filed: June 26, 2023
    Publication date: December 28, 2023
    Inventors: Chengfang YUAN, Hu FENG, Ali RAZA, Lei SHEN, Yanan SUN, Changjiu ZHANG, Baoliang WANG, Xiaohan WU, Na CHEN, Gangzhu SUN