Abstract: Package structures and methods for manufacturing the same are provided. The package structure includes a first bump structure formed over a first substrate. The first bump structure includes a first pillar layer formed over the first substrate and a first barrier layer formed over the first pillar layer. In addition, the first barrier layer has a first protruding portion laterally extending outside a first edge of the first pillar layer. The package structure further includes a second bump structure bonded to the first bump structure through a solder joint. In addition, the second bump structure includes a second pillar layer formed over a second substrate and a second barrier layer formed over the second pillar layer. The first protruding portion of the first barrier layer is spaced apart from the solder joint.

Abstract: The present disclosure relates to a method for fabricating a semiconductor structure. The method includes providing a substrate with a gate structure, an insulating structure over the gate structure, and a S/D region; depositing a titanium silicide layer over the S/D region with a first chemical vapor deposition (CVD) process. The first CVD process includes a first hydrogen gas flow. The method also includes depositing a titanium nitride layer over the insulating structure with a second CVD process. The second CVD process includes a second hydrogen gas flow. The first and second CVD processes are performed in a single reaction chamber and a flow rate of the first hydrogen gas flow is higher than a flow rate of the second hydrogen gas flow.

Abstract: A circuit includes a first transistor, a second transistor, a third transistor and a fourth transistor. The first transistor has a first end and a second end. The second transistor has a first end and a second end, wherein the first end of the second transistor is coupled to the first end of the first transistor. The third transistor has a first end and a second end, wherein the second end of the third transistor is coupled to the second end of the second transistor. The fourth transistor has a first end coupled to the second end of the first transistor. The fourth transistor has a bottom gate and an oxide semiconductor layer, and the second transistor has a top gate and a silicon semiconductor layer.

Abstract: An electronic device including an electronic unit and a redistribution layer is disclosed. The electronic unit has connection pads. The redistribution layer is electrically connected to the electronic unit and includes a first insulating layer, a first metal layer and a second insulating layer. The first insulating layer is disposed on the electronic unit and has first openings disposed corresponding to the connection pads. The first metal layer is disposed on the first insulating layer and electrically connected to the electronic unit through the connection pads. The second insulating layer is disposed on the first metal layer. The first insulating layer includes first filler particles, and the second insulating layer includes second filler particles. The first filler particles have a first maximum particle size, the second filler particles have a second maximum particle size, and the second maximum particle size is greater than the first maximum particle size.

Abstract: An acute kidney injury predicting system and a method thereof are proposed. A processor reads the data to be tested, the detection data, the machine learning algorithm and the risk probability comparison table from a main memory. The processor trains the detection data according to the machine learning algorithm to generate an acute kidney injury prediction model, and inputs the data to be tested into the acute kidney injury prediction model to generate an acute kidney injury characteristic risk probability and a data sequence table. The data sequence table lists the data to be tested in sequence according to a proportion of each of the data to be tested in the acute kidney injury characteristics. The processor selects one of the medical treatment data from the risk probability comparison table according to the acute kidney injury characteristic risk probability.

Abstract: A vacuum release valve includes: a tube body and an elastic valve. The tube body is provided with at least one venting opening, and the tube body has a stopping portion at one end of the venting opening and a flange at the other end. The elastic valve is provided with a ring, and the ring has a tubular portion. The tubular portion is retracted to form two inclined surfaces and a linear gap. The elastic valve is installed in the tube body, and the ring and the tubular portion respectively press against the stopping portion and the flange of the tube body. When the tubular portion is elastically deformed due to the vacuum suction, the venting opening communicates with the output end, and then the external air is introduced. The inclined surface can withstand reverse water pressure and close the linear gap and the venting opening.

Abstract: A vacuum release valve includes: a tube body and an elastic valve. The tube body is provided with at least one venting opening, and the tube body has a stopping portion at one end of the venting opening and a flange at the other end. The elastic valve is provided with a ring, and the ring has a tubular portion. The tubular portion is retracted to form two inclined surfaces and a linear gap. The elastic valve is installed in the tube body, and the ring and the tubular portion respectively press against the stopping portion and the flange of the tube body. When the tubular portion is elastically deformed due to the vacuum suction, the venting opening communicates with the output end, and then the external air is introduced. The inclined surface can withstand reverse water pressure and close the linear gap and the venting opening.

Abstract: A method for finishing an edge of a glass sheet comprises grinding the edge of the glass sheet with a grinding wheel. The glass sheet includes a first major surface, a second major surface substantially parallel to the first major surface, and the edge connecting the first and second major surfaces. The grinding produces a central edge portion and two chamfered edge portions connecting the central edge portion with the first and second major surfaces, respectively. The method further comprises polishing the central edge portion with at least one cup wheel rotated about a first axis substantially parallel with the first and second major surfaces of the glass sheet to polish the central edge portion, wherein an abrasive layer of the cup wheel comprises at least one of ferric oxide (Fe2O3), silicon carbide (SiC), and ceric oxide (CeO2).

Abstract: A faucet may comprise a main body, a ceramic control valve, a locating sleeve and a faucet head, and a pulling rod is connected at a lateral side of the faucet head for the operation of the faucet. The faucet head with the pulling rod is positioned at a front side of the faucet, which is convenient for a user to operate the faucet and saves water during the process of operating the faucet.

Abstract: A faucet may comprise a main body, a ceramic control valve, a locating sleeve, a driving block, a handle, an adaptor, and a spout. The handle of the faucet in the present invention is positioned at a front side of the faucet, which is convenient for a user to operate the faucet and saves water during the process of operating the faucet.

Abstract: A headlight with a modular projection module for enhancing illumination intensity includes a base, a lighting module, a reflective cover, a light-shielding member and a lens assembly. The base has a connection portion obliquely formed on a top of the base. The lighting module is mounted on the connection portion of the base. The reflective cover is mounted on the connection portion of the base with an inner reflective surface facing the lighting module. The lens assembly is mounted on a front portion of the base. The light-shielding member is mounted on a rear portion of the lens assembly. As the lighting module is located below a horizontal center line of the lens assembly and the connection portion of the base is obliquely arranged, the reflective cover can significantly reflect light emitted from the lighting module to enhance illumination intensity of the headlight.

Abstract: A headlight with a modular projection module for enhancing illumination intensity includes a base, a lighting module, a reflective cover, a light-shielding member and a lens assembly. The base has a connection portion obliquely formed on a top of the base. The lighting module is mounted on the connection portion of the base. The reflective cover is mounted on the connection portion of the base with an inner reflective surface facing the lighting module. The lens assembly is mounted on a front portion of the base. The light-shielding member is mounted on a rear portion of the lens assembly. As the lighting module is located below a horizontal center line of the lens assembly and the connection portion of the base is obliquely arranged, the reflective cover can significantly reflect light emitted from the lighting module to enhance illumination intensity of the headlight.

Abstract: A modularized headlight has a heat sink base, a lens assembly on a front end of the heat sink base, a first illuminating module and a first reflector on a first stage of the heat sink base, a second illuminating module and a second reflector on a second stage of the heat sink base, and a shading component on the first stage. When the first illuminating module is emitting light, the light beams are reflected by the first reflector toward the lens assembly through the shading component to provide a low beam mode. When the second illuminating module is emitting light, the light beams are reflected by the second reflector toward the lens assembly to provide a high beam mode. The modularized headlight is switched between the two modes without mechanical mechanism so that components of the modularized headlight may not be worn out and durability is improved.

Abstract: A headlight with a modular projection module for enhancing illumination intensity includes a base, a lighting module, a reflective cover, a light-shielding member and a lens assembly. The base has a connection portion obliquely formed on a top of the base. The lighting module is mounted on the connection portion of the base. The reflective cover is mounted on the connection portion of the base with an inner reflective surface facing the lighting module. The lens assembly is mounted on a front portion of the base. The light-shielding member is mounted on a rear portion of the lens assembly. As the lighting module is located below a horizontal center line of the lens assembly and the connection portion of the base is obliquely arranged, the reflective cover can significantly reflect light emitted from the lighting module to enhance illumination intensity of the headlight.

Abstract: An apparatus for cleaning a glass sheet moving along a conveyed direction is disclosed herein. The apparatus comprises a first plurality of spraying devices coupled to a water supply and positioned away from a first surface of the glass sheet in a first angle measured from the first surface of the glass sheet, and a control unit configured to supply water from the water supply into the first plurality of spraying devices such that the first plurality of spraying devices spray water from the water supply in a first plurality of spraying sections at the first angle over an edge of the glass sheet, thereby forming a first cleaning zone on the first surface of the glass sheet.

Abstract: An efficient heat-dissipating and all day lighting headlight includes an inner heat-dissipating base, an outer heat-dissipating base, a circuit assembly, a low-beam lamp assembly, a high-beam lamp assembly, a daytime lamp assembly and a headlight cover. The inner heat-dissipating base has two opposite surfaces with one of the surfaces thermally contacting the circuit assembly and the outer heat-dissipating base. The circuit assembly is mounted between the inner heat-dissipating base and the outer heat-dissipating base. The low-beam, high-beam and daytime lamp assemblies thermally contact the other surface of the inner heat-dissipating base. The low-beam and high-beam assemblies are electrically connected to the circuit assembly. The daytime, low-beam and high-beam lamp assemblies are further covered by the headlight cover capable of radiating heat out.

Abstract: The instant disclosure is related to a sapphire, including a surface and a silver-containing antibiotic source, wherein the silver-containing antibiotic source forms an antibiotic film covering the surface. The instant disclosure also relates to a sapphire, including a surface, an oxide layer extending from the surface to inside of the surface, and a silver-containing antibiotic source, wherein the silver-containing antibiotic source is distributed in the oxide layer, so as to turn the oxide layer into an antibiotic layer and turn the surface into an antibiotic surface. Therefore, the sapphire can have an antibiotic to reduce bacteria proliferation issues.

Abstract: A modular LED heat-dissipating device includes an LED circuit board, a heat-conducting adhesive layer, a heat-dissipating structure, and a wire terminal module. The LED light source illuminates by power supplied via the wire terminal module. Heat generated from the LED light source is dissipated by the heat-dissipating structure. This device does not dissipate heat by a lamp housing. So the lamp housing can be made of, but not limited to, plastic, thereby decreasing a production cost of the LED lamp. In addition, the modular LED heat-dissipating device can fit various kinds of lamp housings. When the LED light source breaks down, the modular LED heat-dissipating device and the lamp housing can be easily separated to replace or repair the LED light source.

Abstract: A modular LED heat-dissipating device includes an LED circuit board, a heat-conducting adhesive layer, a heat-dissipating structure, and a wire terminal module. The LED light source illuminates by power supplied via the wire terminal module. Heat generated from the LED light source is dissipated by the heat-dissipating structure. This device does not dissipate heat by a lamp housing. So the lamp housing can be made of, but not limited to, plastic, thereby decreasing a production cost of the LED lamp. In addition, the modular LED heat-dissipating device can fit various kinds of lamp housings. When the LED light source breaks down, the modular LED heat-dissipating device and the lamp housing can be easily separated to replace or repair the LED light source.