Patents by Inventor Cheng-Yi Wang
Cheng-Yi Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240142935Abstract: A method for detecting workpiece based on homogeneous multi-core architecture is illustrate. The method comprises: obtaining detecting images of detecting workpieces; identifying detecting areas of the detecting workpieces in the detecting images; dividing the preset rotation angle to obtain the rotation accuracy and initial rotation angles; based on each of the initial rotation angles, rotating the detecting areas to obtain a rotation area of each of the initial rotation angles; calculating similarity values between each of the rotation areas and a preset qualified area, and determining a largest similarity value as the target similarity value; and when the rotation accuracy is greater than or equal to a preset accuracy, identifying whether the detecting workpiece is a qualified workpiece according to the target similarity value and a preset similarity threshold.Type: ApplicationFiled: February 24, 2023Publication date: May 2, 2024Inventors: CHENG-FENG WANG, LI-CHE LIN, YEN-YI LIN
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Publication number: 20240145421Abstract: Provided are a passivation layer for forming a semiconductor bonding structure, a sputtering target making the same, a semiconductor bonding structure and a semiconductor bonding process. The passivation layer is formed on a bonding substrate by sputtering the sputtering target; the passivation layer and the sputtering target comprise a first metal, a second metal or a combination thereof. The bonding substrate comprises a third metal. Based on a total atom number of the surface of the passivation layer, O content of the surface of the passivation layer is less than 30 at %; the third metal content of the surface of the passivation layer is less than or equal to 10 at %. The passivation layer has a polycrystalline structure. The semiconductor bonding structure sequentially comprises a first bonding substrate, a bonding layer and a second bonding substrate: the bonding layer is mainly formed by the passivation layer and the third metal.Type: ApplicationFiled: October 27, 2023Publication date: May 2, 2024Inventors: Kuan-Neng CHEN, Zhong-Jie HONG, Chih-I CHO, Ming-Wei WENG, Chih-Han CHEN, Chiao-Yen WANG, Ying-Chan HUNG, Hong-Yi WU, CHENG-YEN HSIEH
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Publication number: 20230361468Abstract: A dual-band antenna module includes a first antenna structure and a second antenna structure. The first antenna structure includes a first insulating substrate, a conductive metal layer, a plurality of grounding supports, and a first feeding pin. The second antenna structure includes a second insulating substrate, a top metal layer, a bottom metal layer, and a second feeding pin. The conductive metal layer is disposed on the first insulating substrate. The grounding supports are configured for supporting the first insulating substrate. The second insulating substrate is disposed above the first insulating substrate. The top metal layer and the bottom metal layer are respectively disposed on a top side and a bottom side of the second insulating substrate. The first frequency band signal transmitted or received by the first antenna structure is smaller than the second frequency band signal transmitted or received by the second antenna structure.Type: ApplicationFiled: August 7, 2022Publication date: November 9, 2023Inventors: Ta-Fu Cheng, Shou-Jen Li, Cheng-Yi Wang, CHIH-MING SU
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Patent number: 11764474Abstract: A portable electronic device and a plate antenna module thereof are provided. The plate antenna module includes an antenna carrying structure, an inner surrounding radiation structure, a first inner feeding structure, an outer surrounding radiation structure, and a first outer feeding structure. The first inner feeding structure is surrounded by the inner surrounding radiation structure. The inner surrounding radiation structure is surrounded by the outer surrounding radiation structure. The inner surrounding radiation structure and the outer surrounding radiation structure are respectively disposed on two different planes of the antenna carrying structure.Type: GrantFiled: February 15, 2022Date of Patent: September 19, 2023Assignee: Taiwan Inpaq electronic Co., Ltd.Inventors: Yang-Hsin Fan, Ta-Fu Cheng, Cheng-Yi Wang, Zhi-Xiang Wang
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Patent number: 11749905Abstract: A dual-band patch array antenna module and an electronic device using the same are provided. The dual-band patch array antenna module includes an insulative carrier substrate, a common conductive metal layer, a common grounding metal layer, an outer surrounding shielding structure, a plurality of first band antenna structures, and a plurality of second band antenna structures. The common conductive metal layer is disposed inside the insulative carrier substrate. The common grounding metal layer is disposed on the insulative carrier substrate. The outer surrounding shielding structure is electrically connected between the common conductive metal layer and the common grounding metal layer. Each first band antenna structure includes a first radiator, two first metal elements, two first feeding elements, and two first inner surrounding shielding assemblies.Type: GrantFiled: January 4, 2022Date of Patent: September 5, 2023Assignee: Taiwan Inpaq electronic Co., Ltd.Inventors: Ta-Fu Cheng, Cheng-Yi Wang, Ting-Wei Lin
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Patent number: 11670872Abstract: A movable device and a block-type millimeter wave array antenna module thereof are provided. The block-type millimeter wave array antenna module includes an antenna carrying substrate, an antenna signal transmitting group, an antenna signal receiving group, and a dummy antenna group. The antenna carrying substrate includes a plurality of block-shaped carrier bodies that are divided into a plurality of first, second, third, and fourth antenna carrier blocks. The antenna signal transmitting group includes a plurality of signal transmitting antenna structures respectively carried by the first antenna carrier blocks. The antenna signal receiving group includes a plurality of signal receiving antenna structures respectively carried by the second antenna carrier blocks. The dummy antenna group includes a plurality of first dummy antenna structures respectively carried by the third antenna carrier blocks, and a plurality of second dummy antenna structures respectively carried by the fourth antenna carrier blocks.Type: GrantFiled: November 26, 2021Date of Patent: June 6, 2023Assignee: Taiwan Inpaq electronic Co., Ltd.Inventors: Ta-Fu Cheng, Ting-Wei Lin, Cheng-Yi Wang
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Publication number: 20230116495Abstract: A dual-band patch array antenna module and an electronic device using the same are provided. The dual-band patch array antenna module includes an insulative carrier substrate, a common conductive metal layer, a common grounding metal layer, an outer surrounding shielding structure, a plurality of first band antenna structures, and a plurality of second band antenna structures. The common conductive metal layer is disposed inside the insulative carrier substrate. The common grounding metal layer is disposed on the insulative carrier substrate. The outer surrounding shielding structure is electrically connected between the common conductive metal layer and the common grounding metal layer. Each first band antenna structure includes a first radiator, two first metal elements, two first feeding elements, and two first inner surrounding shielding assemblies.Type: ApplicationFiled: January 4, 2022Publication date: April 13, 2023Inventors: Ta-Fu Cheng, Cheng-Yi Wang, Ting-Wei Lin
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Publication number: 20230112607Abstract: A portable electronic device and a plate antenna module thereof are provided. The plate antenna module includes an antenna carrying structure, an inner surrounding radiation structure, a first inner feeding structure, an outer surrounding radiation structure, and a first outer feeding structure. The first inner feeding structure is surrounded by the inner surrounding radiation structure. The inner surrounding radiation structure is surrounded by the outer surrounding radiation structure. The inner surrounding radiation structure and the outer surrounding radiation structure are respectively disposed on two different planes of the antenna carrying structure.Type: ApplicationFiled: February 15, 2022Publication date: April 13, 2023Inventors: Yang-Hsin Fan, Ta-Fu Cheng, Cheng-Yi Wang, ZHI-XIANG WANG
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Publication number: 20230031712Abstract: A movable device and a block-type millimeter wave array antenna module thereof are provided. The block-type millimeter wave array antenna module includes an antenna carrying substrate, an antenna signal transmitting group, an antenna signal receiving group, and a dummy antenna group. The antenna carrying substrate includes a plurality of block-shaped carrier bodies that are divided into a plurality of first, second, third, and fourth antenna carrier blocks. The antenna signal transmitting group includes a plurality of signal transmitting antenna structures respectively carried by the first antenna carrier blocks. The antenna signal receiving group includes a plurality of signal receiving antenna structures respectively carried by the second antenna carrier blocks. The dummy antenna group includes a plurality of first dummy antenna structures respectively carried by the third antenna carrier blocks, and a plurality of second dummy antenna structures respectively carried by the fourth antenna carrier blocks.Type: ApplicationFiled: November 26, 2021Publication date: February 2, 2023Inventors: Ta-Fu Cheng, Ting-Wei Lin, Cheng-Yi Wang
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Patent number: 11522292Abstract: A portable electronic device and a plate antenna module thereof are provided. The plate antenna module includes an antenna carrying structure, an inner surrounding radiation structure, a first inner feeding structure, an outer surrounding radiation structure, and a first outer feeding structure. The first inner feeding structure is surrounded by the inner surrounding radiation structure. The inner surrounding radiation structure is surrounded by the outer surrounding radiation structure and separate from the outer surrounding radiation structure. The first outer feeding structure corresponds to the first inner feeding structure.Type: GrantFiled: August 10, 2021Date of Patent: December 6, 2022Assignee: Taiwan Inpaq electronic Co., Ltd.Inventors: Ta-Fu Cheng, Cheng-Yi Wang, Wei-Lin Liu, Shou-Jen Li
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Publication number: 20220376399Abstract: A portable electronic device and a plate antenna module thereof are provided. The plate antenna module includes an antenna carrying structure, an inner surrounding radiation structure, a first inner feeding structure, an outer surrounding radiation structure, and a first outer feeding structure. The first inner feeding structure is surrounded by the inner surrounding radiation structure. The inner surrounding radiation structure is surrounded by the outer surrounding radiation structure and separate from the outer surrounding radiation structure. The first outer feeding structure corresponds to the first inner feeding structure.Type: ApplicationFiled: August 10, 2021Publication date: November 24, 2022Inventors: Ta-Fu Cheng, Cheng-Yi Wang, Wei-Lin Liu, Shou-Jen Li
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Patent number: 10384434Abstract: A separating device includes a separating unit and a crack front line adjusting unit. The separating unit is adapted to separate the flexible film and the substrate. During the process of separating the flexible film from the substrate, a crack front line is formed between a portion of the flexible film not separated from the substrate and a portion of the flexible film separated from the substrate. The crack front line adjusting unit is adapted to sense a relative displacement state of the flexible film and the substrate for determining a distribution of the crack front line, and is adapted to apply a down pressing force to the flexible film or the substrate and increase or decrease the down pressing force according to the relative displacement state, so as to adjust the distribution of the crack front line.Type: GrantFiled: April 19, 2018Date of Patent: August 20, 2019Assignees: Industrial Technology Research Institute, Intellectual Property Innovation CorporationInventors: Chen-Tsai Yang, Ko-Chin Yang, Shi-Chang Chen, Cheng-Yi Wang, Yen-Ting Wu
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Publication number: 20190061332Abstract: A separating device includes a separating unit and a crack front line adjusting unit. The separating unit is adapted to separate the flexible film and the substrate. During the process of separating the flexible film from the substrate, a crack front line is formed between a portion of the flexible film not separated from the substrate and a portion of the flexible film separated from the substrate. The crack front line adjusting unit is adapted to sense a relative displacement state of the flexible film and the substrate for determining a distribution of the crack front line, and is adapted to apply a down pressing force to the flexible film or the substrate and increase or decrease the down pressing force according to the relative displacement state, so as to adjust the distribution of the crack front line.Type: ApplicationFiled: April 19, 2018Publication date: February 28, 2019Applicants: Industrial Technology Research Institute, Intellectual Property Innovation CorporationInventors: Chen-Tsai Yang, Ko-Chin Yang, Shi-Chang Chen, Cheng-Yi Wang, Yen-Ting Wu
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Patent number: 10173407Abstract: A device is for removing a first substrate from a second substrate or adhering the first substrate to the second substrate. The device includes a carrier, a flexible member and a supporting member. The carrier is for fixing the first substrate. The flexible member is for fixing the second substrate. The supporting member is connected to the carrier and the flexible member. The carrier and the flexible member are spaced a distance from each other. The carrier, the flexible member and the supporting member together define a first variable pressure chamber. The first variable pressure chamber has a first air hole.Type: GrantFiled: April 21, 2016Date of Patent: January 8, 2019Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Chen-Chu Tsai, Cheng-Yi Wang, Shi-Chang Chen, Tzu-Chun Lin
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Publication number: 20170144422Abstract: A device is for removing a first substrate from a second substrate or adhering the first substrate to the second substrate. The device includes a carrier, a flexible member and a supporting member. The carrier is for fixing the first substrate. The flexible member is for fixing the second substrate. The supporting member is connected to the carrier and the flexible member. The carrier and the flexible member are spaced a distance from each other. The carrier, the flexible member and the supporting member together define a first variable pressure chamber. The first variable pressure chamber has a first air hole.Type: ApplicationFiled: April 21, 2016Publication date: May 25, 2017Inventors: Chen-Chu Tsai, Cheng-Yi Wang, Shi-Chang Chen, Tzu-Chun Lin
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Publication number: 20170150604Abstract: A flexible electronic device includes a first flexible substrate, a first electronic component, a second flexible substrate, a second electronic component and an adhesive layer disposed between the first flexible substrate and the second flexible substrate. The first electronic component is disposed on a first surface of the first flexible substrate. The second electronic component is disposed on a first surface of the second flexible substrate. The first surface of the first flexible substrate has a first FPC bonding area having an orthogonal projection projected on a plane where the second flexible substrate is located does not overlap the second flexible substrate. The first surface of the second flexible substrate has a second FPC bonding area having an orthogonal projection projected on a plane where the first flexible substrate is located does not overlap the first flexible substrate.Type: ApplicationFiled: November 18, 2016Publication date: May 25, 2017Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Chen-Chu TSAI, Cheng-Yi WANG, Yuh-Zheng LEE, Ko-Chin YANG, Shi-Chang CHEN
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Patent number: 9655244Abstract: A flexible electronic device includes a first flexible substrate, a first electronic component, a second flexible substrate, a second electronic component and an adhesive layer disposed between the first flexible substrate and the second flexible substrate. The first electronic component is disposed on a first surface of the first flexible substrate. The second electronic component is disposed on a first surface of the second flexible substrate. The first surface of the first flexible substrate has a first FPC bonding area having an orthogonal projection projected on a plane where the second flexible substrate is located does not overlap the second flexible substrate. The first surface of the second flexible substrate has a second FPC bonding area having an orthogonal projection projected on a plane where the first flexible substrate is located does not overlap the first flexible substrate.Type: GrantFiled: November 18, 2016Date of Patent: May 16, 2017Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Chen-Chu Tsai, Cheng-Yi Wang, Yuh-Zheng Lee, Ko-Chin Yang, Shi-Chang Chen
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Patent number: 9251953Abstract: A method of manufacturing common mode filter having heterogeneous laminates, the method includes steps of providing a nonmagnetic insulating substrate; forming a magnetic layer; forming a first lead; forming a first insulating layer; forming a first through hole; forming a first coil; forming a second insulating layer; forming a second coil; forming a third insulating layer; forming a second through hole; forming a second lead; forming a fourth insulating layer; and depositing a first magnetic material.Type: GrantFiled: March 7, 2014Date of Patent: February 2, 2016Assignee: INPAQ TECHNOLOGY CO., LTD.Inventors: Yu Chia Chang, Chi Long Lin, Huai Luh Chang, Cheng Yi Wang
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Patent number: 9007149Abstract: A common mode filter with a multi spiral layer structure includes a first coil, a second coil, a third coil connected in series with the first coil, a fourth coil connected in series with the second coil, a first material layer and a second material layer. The second coil is disposed between the first and third coils, and the third coil is disposed between the second and fourth coils. At least one of the first and second material layers comprises magnetic material. The first, second, third, and fourth coils are disposed between the first and second material layers.Type: GrantFiled: August 10, 2012Date of Patent: April 14, 2015Assignee: Inpaq Technology Co., Ltd.Inventors: Yu Chia Chang, Chi Long Lin, Cheng Yi Wang, Shin Min Tai
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Patent number: D1021220Type: GrantFiled: July 15, 2021Date of Patent: April 2, 2024Assignee: Radiant Opto-Electronics CorporationInventors: Cheng-Ang Chang, Guo-Hao Huang, Chun-Yi Sun, Chih-Hung Ju, Pin-Tsung Wang