Patents by Inventor Chengyun Yang

Chengyun Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Enhanced flattening for cable and wiring harnesses in computer-aided design drawings
    Patent number: 8005650
    Abstract: Embodiments of the invention include a method for generating a two-dimensional (2D) flattened nailboard representation of a wiring harness in a three-dimensional (3D) computer-aided design (CAD) model. The nailboard representation invention may be used to provide a dimensionally accurate “flattened” view of a complex 3D wiring harness depicted in a CAD model, without cutting any of the wires included in the harness, and minimizing the overlap of multiple exposed wires present in wire loops.
    Type: Grant
    Filed: February 28, 2008
    Date of Patent: August 23, 2011
    Assignee: Autodesk, Inc.
    Inventors: Steve Flores, Baolin Jiang, Wang Xianfeng, Chengyun Yang
  • ENHANCED FLATTENING FOR CABLE AND WIRING HARNESSES IN COMPUTER-AIDED DESIGN DRAWINGS
    Publication number: 20090222121
    Abstract: Embodiments of the invention include a method for generating a two-dimensional (2D) flattened nailboard representation of a wiring harness in a three-dimensional (3D) computer-aided design (CAD) model. The nailboard representation invention may be used to provide a dimensionally accurate “flattened” view of a complex 3D wiring harness depicted in a CAD model, without cutting any of the wires included in the harness, and minimizing the overlap of multiple exposed wires present in wire loops.
    Type: Application
    Filed: February 28, 2008
    Publication date: September 3, 2009
    Inventors: STEVE FLORES, Baolin Jiang, Wang Xianfeng, Chengyun Yang