Abstract: A network server communicating with a plurality of user terminals over a network includes a communicator and at least one processor configured to communicate with the plurality of user terminals through the communicator. The at least one processor obtains an event history including information on user input events of each of the plurality of user terminals by communicating with each of the plurality of user terminals through the communicator, determines a macro score corresponding to each of the plurality of user terminals based on each of the event histories of the plurality of user terminals, adjusts a reference value for detecting whether a macro is used, based on the macro scores corresponding to the plurality of user terminals, and detects whether each of the plurality of user terminals uses the macro, by comparing each of the macro scores corresponding to the plurality of user terminals with the reference value.

Abstract: A network server communicating with a plurality of user terminals over a network includes a communicator and at least one processor configured to communicate with the plurality of user terminals through the communicator. The at least one processor obtains an event history including information on user input events of each of the plurality of user terminals by communicating with each of the plurality of user terminals through the communicator, determines a macro score corresponding to each of the plurality of user terminals based on each of the event histories of the plurality of user terminals, adjusts a reference value for detecting whether a macro is used, based on the macro scores corresponding to the plurality of user terminals, and detects whether each of the plurality of user terminals uses the macro, by comparing each of the macro scores corresponding to the plurality of user terminals with the reference value.

Abstract: A temperature controller for semiconductor fabrication comprises a lower chiller connected with a lower chamber of a processing chamber and configured to adjust a temperature of the lower chamber, an electrostatic chuck disposed in the lower chamber and an upper chiller connected with an upper chamber of the processing chamber and configured to adjust a temperature of the upper chamber, a heater disposed in the upper chamber. In the temperature controller for semiconductor fabrication, the three-way valve may be installed on the cooling fluid supplying pipe, and the bypass pipe may be installed between the three-way valve and the cooling fluid collecting pipe to reduce the degree of bypass opening of the three-way valve.

Abstract: A temperature controller for semiconductor fabrication comprises a lower chiller connected with a lower chamber of a processing chamber and configured to adjust a temperature of the lower chamber, an electrostatic chuck disposed in the lower chamber and an upper chiller connected with an upper chamber of the processing chamber and configured to adjust a temperature of the upper chamber, a heater disposed in the upper chamber. In the temperature controller for semiconductor fabrication, the three-way valve may be installed on the cooling fluid supplying pipe, and the bypass pipe may be installed between the three-way valve and the cooling fluid collecting pipe to reduce the degree of bypass opening of the three-way valve.

Abstract: An edge ring cooling module for semiconductor manufacturing chuck is provided which effectively cools the edge ring equipped in electrostatic chuck. The edge ring cooling module forcibly exhausts the heat of an edge ring (20) using an electronic cooling device (32) to top of a large-diameter portion (11) to effectively cool the edge ring (20) so that the temperature of the edge ring (20) is similar to that of top of a small-diameter portion (12) of a chuck body (10) to eventually improve the yield ratio while reducing the failure ratio.

Abstract: A cooling apparatus having an auxiliary chiller is provided. The apparatus can include a wafer chuck on which a wafer is mounted and in which a cooling cavity is formed. A main chiller having a main coolant reservoir can be spaced apart from the wafer chuck. The cooling cavity and the main coolant reservoir can be arranged in communication with each other through coolant passages. The coolant passages can include an auxiliary chiller detachably installed thereon, respectively. A method of cooling a wafer chuck or process chamber during a semiconductor device fabrication process is also provided. Using the method and apparatuses of this invention, fine temperature adjustments of the wafer chuck are possible.