Patents by Inventor Cheonhee Lee
Cheonhee Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9558685Abstract: The present invention relates to a wall mounting-type flexible display, which can be mounted on a wall, the display comprising: a display panel having a bending portion having a bent peripheral area; a support bar for supporting the display panel by being in contact with the bending portion; and a bracket coupled to the support bar and fixed to a wall surface, wherein the bending portion of the display panel comprises at least two curved surfaces having at least one inflection point, and the first and second curved surfaces, which are adjacent to each other about the inflection point, may have different curvatures. The first curved surface is directly adjacent to the end portion of the display panel, the second curved surface is adjacent to the first curved surface while being spaced from the end portion of the display panel, and the curvature of the first curved surface may be larger than the curvature of the second curved surface.Type: GrantFiled: March 7, 2014Date of Patent: January 31, 2017Assignee: LG ELECTRONICS INC.Inventors: Cheonhee Lee, Dongwon Choi, Sangchul Han, Sungjung Hwang
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Publication number: 20160111028Abstract: The present invention relates to a wall mounting-type flexible display, which can be mounted on a wall, the display comprising: a display panel having a bending portion having a bent peripheral area; a support bar for supporting the display panel by being in contact with the bending portion; and a bracket coupled to the support bar and fixed to a wall surface, wherein the bending portion of the display panel comprises at least two curved surfaces having at least one inflection point, and the first and second curved surfaces, which are adjacent to each other about the inflection point, may have different curvatures. The first curved surface is directly adjacent to the end portion of the display panel, the second curved surface is adjacent to the first curved surface while being spaced from the end portion of the display panel, and the curvature of the first curved surface may be larger than the curvature of the second curved surface.Type: ApplicationFiled: March 7, 2014Publication date: April 21, 2016Inventors: Cheonhee LEE, Dongwon CHOI, Sangchul HAN, Sungjung HWANG
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Patent number: 9134846Abstract: An image display apparatus includes a display defined by a front surface for outputting screen information and a rear surface opposite to the front surface, and a bezel part formed along edges of the display, wherein the display includes a plane portion configured to output at least part of the screen information, and at least one bent portion integrally formed with the plane portion and bent from an edge of the plane portion by a preset angle, the at least one bent portion outputting at least one of a part of the screen information and a preset image.Type: GrantFiled: October 1, 2013Date of Patent: September 15, 2015Assignee: LG ELECTRONICS INC.Inventors: Cheonhee Lee, Dongwon Choi, Sunjung Hwang, Namhun Kim, Junghoon Park
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Patent number: 9049490Abstract: The present disclosure relates to an image display apparatus, and more particularly, an image display apparatus capable of displaying screen information. The image display apparatus includes a display configured to display screen information, an interface configured to receive an input signal with respect to the display, and a controller configured to display a menu item for controlling the screen information, wherein the display outputs the screen information on an inner region of rounded corners of the display, and wherein the controller decides a shape of the menu item to be displayed on a point where the input signal has been received, in response to the reception of the input signal.Type: GrantFiled: October 1, 2013Date of Patent: June 2, 2015Assignee: LG Electronics Inc.Inventors: Junghoon Park, Dongwon Choi, Sunjung Hwang, Cheonhee Lee, Namhun Kim
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Publication number: 20140267097Abstract: An image display apparatus includes a display defined by a front surface for outputting screen information and a rear surface opposite to the front surface, and a bezel part formed along edges of the display, wherein the display includes a plane portion configured to output at least part of the screen information, and at least one bent portion integrally formed with the plane portion and bent from an edge of the plane portion by a preset angle, the at least one bent portion outputting at least one of a part of the screen information and a preset image.Type: ApplicationFiled: October 1, 2013Publication date: September 18, 2014Applicant: LG ELECTRONICS INC.Inventors: Cheonhee LEE, Dongwon CHOI, Sunjung HWANG, Namhun KIM, Junghoon PARK
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Publication number: 20140282726Abstract: The present disclosure relates to an image display apparatus, and more particularly, an image display apparatus capable of displaying screen information. The image display apparatus includes a display configured to display screen information, an interface configured to receive an input signal with respect to the display, and a controller configured to display a menu item for controlling the screen information, wherein the display outputs the screen information on an inner region of rounded corners of the display, and wherein the controller decides a shape of the menu item to be displayed on a point where the input signal has been received, in response to the reception of the input signal.Type: ApplicationFiled: October 1, 2013Publication date: September 18, 2014Applicant: LG ELECTRONICS INC.Inventors: Junghoon PARK, Dongwon CHOI, Sunjung HWANG, Cheonhee LEE, Namhun KIM
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Patent number: 8174120Abstract: An integrated circuit package system is provided. A dual-type leadframe having first and second rows of leads is formed. A first row of bumps is formed on an integrated circuit chip. Solder paste is placed on the first row of leads, and the first row of bumps is pressed into the solder paste on the first row of leads. The solder paste is reflow soldered to form solder and connect the integrated circuit chip to the first row of leads, and the integrated circuit chip, the first row of bumps, the solder, and the leadframe are encapsulated.Type: GrantFiled: October 3, 2009Date of Patent: May 8, 2012Assignee: Stats Chippac Ltd.Inventors: Cheonhee Lee, Youngnam Choi
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Patent number: 8067823Abstract: A flip chip lead frame package includes a die and a lead frame having a die paddle and leads, and has interconnection between the active site of the die and the die paddle. Also, methods for making the package are disclosed.Type: GrantFiled: November 15, 2005Date of Patent: November 29, 2011Assignee: STATS ChipPAC, Ltd.Inventor: Cheonhee Lee
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Patent number: 7691681Abstract: A flip chip lead frame package includes a die and a lead frame having a die paddle and leads, and has interconnection between the active site of the die and the die paddle. Also, methods for making the package are disclosed.Type: GrantFiled: August 14, 2008Date of Patent: April 6, 2010Assignee: ChipPAC, Inc.Inventor: Cheonhee Lee
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Publication number: 20100019369Abstract: An integrated circuit package system is provided. A dual-type leadframe having first and second rows of leads is formed. A first row of bumps is formed on an integrated circuit chip. Solder paste is placed on the first row of leads, and the first row of bumps is pressed into the solder paste on the first row of leads. The solder paste is reflow soldered to form solder and connect the integrated circuit chip to the first row of leads, and the integrated circuit chip, the first row of bumps, the solder, and the leadframe are encapsulated.Type: ApplicationFiled: October 3, 2009Publication date: January 28, 2010Inventors: Cheonhee Lee, Youngnam Choi
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Patent number: 7645640Abstract: A system for manufacturing an integrated circuit package system is provided. A dual-type leadframe having first and second rows of leads is formed. A first row of bumps is formed on an integrated circuit chip. Solder paste is placed on the first row of leads, and the first row of bumps is pressed into the solder paste on the first row of leads. The solder paste is reflow soldered to form solder and connect the integrated circuit chip to the first row of leads, and the integrated circuit chip, the first row of bumps, the solder, and the leadframe are encapsulated.Type: GrantFiled: October 23, 2005Date of Patent: January 12, 2010Assignee: Stats Chippac Ltd.Inventors: Cheonhee Lee, Youngnam Choi
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Publication number: 20080299705Abstract: A flip chip lead frame package includes a die and a lead frame having a die paddle and leads, and has interconnection between the active site of the die and the die paddle. Also, methods for making the package are disclosed.Type: ApplicationFiled: August 14, 2008Publication date: December 4, 2008Applicant: STATS CHIPPAC, LTD.Inventor: Cheonhee Lee
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Publication number: 20060192294Abstract: A flip chip lead frame package includes a die and a lead frame having a die paddle and leads, and has interconnection between the active site of the die and the die paddle. Also, methods for making the package are disclosed.Type: ApplicationFiled: November 15, 2005Publication date: August 31, 2006Applicant: ChipPAC, IncInventor: Cheonhee Lee
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Publication number: 20060102989Abstract: A system for manufacturing an integrated circuit package system is provided. A dual-type leadframe having first and second rows of leads is formed. A first row of bumps is formed on an integrated circuit chip. Solder paste is placed on the first row of leads, and the first row of bumps is pressed into the solder paste on the first row of leads. The solder paste is reflow soldered to form solder and connect the integrated circuit chip to the first row of leads, and the integrated circuit chip, the first row of bumps, the solder, and the leadframe are encapsulated.Type: ApplicationFiled: October 23, 2005Publication date: May 18, 2006Applicant: STATS CHIPPAC LTD.Inventors: Cheonhee Lee, Youngnam Choi