Abstract: A method for assessing cardiac wellness in a human utilizes high definition EKG signals to detect, analyze and compare waveform feature signatures at rest and during recovery from exertion. The parameters measured and displayed include beat-to-beat heart rate, heart rate variance and rate of recovery, which are indicators of the underlying physiological state. Combining these capabilities in a wearable device enables direct feedback to the user regarding overall fitness and physiologic response to therapeutic or behavioral interventions.

Abstract: A method of manufacturing an implantable electrical lead body MRI used in such applications as cardiac pacing, electrical nerve stimulation and intracardiac defibrillation applications that is biocompatible upon implantation in an animal and compatible with a magnetic resonance imaging scanner for the purpose of diagnostic quality imaging is disclosed. The method involves a relatively rigid first substrate layer, a conductive coil layer being precisely placed over the first substrate layer, a relatively soft second substrate layer over the conductive coil layer and a relatively rigid third substrate layer over the second substrate layer.

Abstract: An electrical lead body for an implantable electronic medical device has multiple layers of insulating material encapsulating a conductor that is wound in a spiral manner along the length of the lead. The layered structure provides resistance to fracture from mechanical stresses. A manufacturing process for producing this electrical lead is described.

Abstract: A method of manufacturing an implantable electrical lead body MRI used in such applications as cardiac pacing, electrical nerve stimulation and intracardiac defibrillation applications that is biocompatible upon implantation in an animal and compatible with a magnetic resonance imaging scanner for the purpose of diagnostic quality imaging is disclosed. The method involves a relatively rigid first substrate layer, a conductive coil layer being precisely placed over the first substrate layer, a relatively soft second substrate layer over the conductive coil layer and a relatively rigid third substrate layer over the second substrate layer.