Abstract: A gaming machine includes a housing having side walls, a top wall, a bottom wall to define an interior space. Several doors and a collector cabinet are pivotably connected to the side walls and are pivoted away from the housing between an opened position and a closed position. A coin circulation device for circulating coins is disposed in the collector cabinet. A dish is disposed in the collector cabinet to receive the coins from the coin circulation device.

Abstract: A gaming machine for playing a game includes side walls extending to a distal edge, a top wall, and a bottom wall to define a housing of the gaming machine. A player interaction device is disposed in the housing to determine a winning outcome of the game and to receive and process currency such as, coins, tokens, or the like, and to discharge the currency in response to the winning outcome of the game through a coin retrieving opening defined in the front wall. At least one handle is defined at the distal edge of one of the side walls.

Abstract: A security enclosure for a gaming machine having a main housing defining a chamber and having a major opening. A door assembly is connected to the housing and moves between an open position providing external access to the chamber and a closed position securing the major opening. The door has a number of components, at least some of which are elongated elements having fasteners at opposed end portions. At least one of the elements may be unplated or have a different surface finish, because the members may be finished prior to assembly. Each element is narrow enough to be received in a relatively shallow and narrow plating tank that would be inadequate to receive the assembled door.

Abstract: A system for ascertaining the thickness of thin films, especially on semiconductor substrates, comprising a light source, a randomized bifurcated fiber optic bundle, a pentamirror, a rapid scanning monochromator with a rotating grating, a photodetector, and A/D converter, an interface and a data reduction computer. The randomized bifurcated fiber optic bundle via the pentamirror directs light to and receives reflected light from a surface of the thin film, the reflected light passes through the bifurcated bundle to the monochromator and to the photodetector whose output is read by the A/D converter. A timing control circuit is provided which has an input from an encoder coupled to the motor rotating the grating and clock and trigger outputs coupled to the A/D converter so that the A/D converter consistently samples the analog signal representative of the same portions of the reflected visible spectra returned from the thin film under test.

Abstract: An automatic system for performing sheet resistivity testing on surface layers of semiconductor wafers, including a wafer handling stage having a platform for carrying a semiconductor wafer, and an arrangement for mounting the platform for rotation about a central axis and for translation of the platform orthogonal to a major surface thereof. A platform drive translates the platform between a wafer test position and a wafer load position, and a stage drive rotates the platform to accurately located angular test positions. A probe handling arrangement includes a carriage for carrying a test probe parallel to the major surface of a wafer on the platform and a carriage drive translates the carriage between a parked position in which a test prove thereon is positioned adjacent and clear of the platform and accurately located test positions along a radius of the platform. The carriage carries a resistivity test probe which includes test probe element for contacting the surface of a semiconductor wafer.

Abstract: An automatic sheet resistance mapping system for semiconductor wafers which has the capability of taking high accuracy, multiple test readings in both contour scan and diameter scan modes. A rotatable wafer stage carries a semiconductor wafer thereon with the center of the wafer positioned substantially at the axis of rotation of the wafer stage. A probe head assembly, including a linear array of at least four equally spaced probe tips projecting from one surface of the assembly is mounted facing the wafer stage on an arrangement for moving the probe tips alternately into and out of contact with the surface of a wafer carried thereon. Positioning arrangements are provided for rotating the wafer stage to accurately registered angular test positions and for producing translation between the wafer stage and the probe head assembly to position the array of probe tips at accurately registered radial test positions relative to the center of the wafer.