Patents by Inventor Chi-An Kao
Chi-An Kao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240178321Abstract: A method of forming a semiconductor device includes forming a fin protruding above a substrate; forming a liner over the fin; performing a surface treatment process to convert an upper layer of the liner distal to the fin into a conversion layer, the conversion layer comprising an oxide or a nitride of the liner; forming isolation regions on opposing sides of the fin after the surface treatment process; forming a gate dielectric over the conversion layer after forming the isolation regions; and forming a gate electrode over the fin and over the gate dielectric.Type: ApplicationFiled: January 16, 2024Publication date: May 30, 2024Inventors: Wan-Yi Kao, Chung-Chi Ko
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Publication number: 20240164069Abstract: A ceramic substrate structure includes a ceramic board, a first conductive layer, a second conductive layer and a heat dissipation layer. The ceramic board has a first surface and a second surface opposite to each other. Each of the first surface and the second surface is a single surface extending continuously. The first conductive layer is mounted on the first surface of the ceramic board. The second conductive layer is mounted on the first surface of the ceramic board. The second conductive layer is adjacent to the first conductive layer and have different thicknesses. The heat dissipation layer is mounted on the second surface of the ceramic board. The heat dissipation layer includes a first heat dissipation portion corresponding to the first conductive layer and a second heat dissipation portion corresponding to the second conductive layer, and the second heat dissipation portion has a patterned region.Type: ApplicationFiled: December 21, 2022Publication date: May 16, 2024Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Yue-Zhen HUANG, Meng-Chi HUANG, Tune-Hune KAO, Min-Chieh CHOU, Jie-Chi CHEN
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Publication number: 20240162602Abstract: An electronic device is provided. The electronic device includes a first substrate, an insulating layer, a first conductive layer and a second conductive layer. The insulating layer is overlapped with the first substrate. The second conductive layer contacts with the first conductive layer. The first conductive layer and the second conductive layer are disposed between the first substrate and the insulating layer. The second conductive layer is disposed between the first conductive layer and the insulating layer. Moreover, a thermal expansion coefficient of the second conductive layer is between a thermal expansion coefficient of the first conductive layer and a thermal expansion coefficient of the insulating layer.Type: ApplicationFiled: January 2, 2024Publication date: May 16, 2024Inventors: Chia-Ping TSENG, Ker-Yih KAO, Chia-Chi HO, Ming-Yen WENG, Hung-I TSENG, Shu-Ling WU, Huei-Ying CHEN
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Publication number: 20240149185Abstract: There is provided a building block assembly including a block body formed of EVA; and an adhesive layer adhered to the block body and formed of hydrophobic material having a higher viscosity. The adhesive layer comprises 20 wt %-50 wt % of rubber mixture and 50 wt %-80 wt % of high polymer resin mixed together. The rubber mixture comprises rubber, softening agent and filler. The high polymer resin uses PIB having a heavy molecular weight. There is further provided a building block assembly including a block body formed of soft material; and an adhesive layer adhered to the block body and formed of hydrophobic material having a higher viscosity. The adhesive layer comprises 20 wt %-50 wt % of rubber mixture and 50 wt %-80 wt % of high polymer resin mixed together. The rubber mixture comprises rubber, softening agent and filler. The high polymer resin uses PIB having a heavy molecular weight.Type: ApplicationFiled: November 4, 2022Publication date: May 9, 2024Inventor: TSENG-CHI KAO
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Patent number: 11959941Abstract: A probe card includes a flexible inorganic material layer, a metal micro structure, and a circuit board. The flexible inorganic material layer has a first surface and a second surface opposite to each other. The metal micro structure is disposed on the first surface. The circuit board is disposed on the second surface, and the circuit board is electrically connected to the metal micro structure. The test signal is adapted to be conducted to the circuit board through the flexible inorganic material layer.Type: GrantFiled: December 27, 2021Date of Patent: April 16, 2024Assignee: Industrial Technology Research InstituteInventors: Min-Chieh Chou, Meng-Chi Huang, Tune-Hune Kao, Yue-Zhen Huang
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Patent number: 11948841Abstract: A method includes forming a dummy gate stack over a semiconductor region of a wafer, and depositing a gate spacer layer using Atomic Layer Deposition (ALD) on a sidewall of the dummy gate stack. The depositing the gate spacer layer includes performing an ALD cycle to form a dielectric atomic layer. The ALD cycle includes introducing silylated methyl to the wafer, purging the silylated methyl, introducing ammonia to the wafer, and purging the ammonia.Type: GrantFiled: April 21, 2022Date of Patent: April 2, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Wan-Yi Kao, Chung-Chi Ko
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Patent number: 11948939Abstract: An integrated circuit (IC) with active and dummy device cell arrays and a method of fabricating the same are discloses. The IC includes a substrate, an active device cell, and a dummy device cell. The active device cell includes an array of source/drain (S/D) regions of a first conductivity type disposed on or within the substrate and an array of gate structures with a first gate fill material disposed on the substrate. The dummy device cell includes a first array of S/D regions of the first conductivity type disposed on or within the substrate, a second array of S/D regions of a second conductivity type disposed on or within the substrate, and an array of dual gate structures disposed on the substrate. Each of the dual gate structures includes the first gate fill material and a second gate fill material that is different from the first gate fill material.Type: GrantFiled: May 13, 2021Date of Patent: April 2, 2024Assignee: Taiwan Semiconductor Manufacturing Company, LtdInventors: Kai-Chi Wu, Ching-Hung Kao, Meng-I Kang, Kuo-Fang Ting
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Patent number: 11942179Abstract: Systems, methods, circuits, and apparatuses for managing integrated circuits in memory devices are provided. In one aspect, an integrated circuit includes: a latch circuit including a latch and a sensing transistor coupled to the latch, and a compensation circuit coupled to the sensing transistor. The sensing transistor includes a gate terminal coupled to a sensing node and an additional terminal coupled to the compensation circuit, and the compensation circuit is configured to apply a control voltage to the additional terminal to compensate for a variation of a threshold voltage of the sensing transistor.Type: GrantFiled: April 11, 2022Date of Patent: March 26, 2024Assignee: Macronix International Co., Ltd.Inventors: Shang-Chi Yang, Hui-Yao Kao
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Publication number: 20240079348Abstract: An electronic device includes a chip and a circuit structure layer overlapped with the chip. The circuit structure layer includes a redistribution structure layer and an element structure layer, and the redistribution structure layer and the element structure layer are electrically connected to the chip. At least one of the redistribution structure layer and the element structure layer includes at least one opening, and in a normal direction of the electronic device, the at least one opening is overlapped with aside of the chip.Type: ApplicationFiled: August 7, 2023Publication date: March 7, 2024Applicant: InnoLux CorporationInventors: Ker-Yih Kao, Cheng-Chi Wang, Yen-Fu Liu, Ju-Li Wang, Jui-Jen Yueh
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Patent number: 11923405Abstract: The present disclosure is directed to a semiconductor device. The semiconductor device includes a substrate, an insulating layer disposed on the substrate, a first conductive feature disposed in the insulating layer, and a capacitor structure disposed on the insulating layer. The capacitor structure includes a first electrode, a first dielectric layer, a second electrode, a second dielectric layer, and a third electrode sequentially stacked. The semiconductor device also includes a first via connected to the first electrode and the third electrode, a second via connected to the second electrode, and a third via connected to the first conductive feature. A part of the first via is disposed in the insulating layer. A portion of the first conductive feature is directly under the capacitor structure.Type: GrantFiled: May 23, 2022Date of Patent: March 5, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTDInventors: Chih-Fan Huang, Hung-Chao Kao, Yuan-Yang Hsiao, Tsung-Chieh Hsiao, Hsiang-Ku Shen, Hui-Chi Chen, Dian-Hau Chen, Yen-Ming Chen
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Publication number: 20240071136Abstract: A vehicle device setting method including: capturing, by an image sensing unit, a first image frame; recognizing a user ID according to the first image frame; showing ID information of the recognized user ID on a screen or by a speaker; capturing a second image frame; generating a confirm signal when a first user expression is recognized by calculating an expression feature in the second image frame and comparing the recognized expression feature with stored expression data associated with a predetermined user expression to confirm whether the recognized user ID is correct or not according to the second image frame captured after the ID information is shown; controlling an electronic device according to the confirm signal; and entering a data update mode instructed by the user and updating setting information of the electronic device by current electronic device setting according to a saving signal generated by confirming a second user expression in a third image frame captured after the user ID is confirmedType: ApplicationFiled: November 3, 2023Publication date: February 29, 2024Inventors: LIANG-CHI CHIU, YU-HAN CHEN, MING-TSAN KAO
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Publication number: 20240071408Abstract: A system may include a first acoustic event detection (AED) component configured to detect a predetermined set of acoustic events, and include a second AED component configured to detect custom acoustic events that a user configures a device to detect. The first and second AED components are configured to perform task-specific processing, and may receive as input the same acoustic feature data corresponding to audio data that potentially represents occurrence of one or more events. Based on processing by the first and second AED components, a device may output data indicating that one or more acoustic events occurred, where the acoustic events may be a predetermined acoustic event and/or a custom acoustic event.Type: ApplicationFiled: September 8, 2023Publication date: February 29, 2024Inventors: Qingming Tang, Chieh-Chi Kao, Qin Zhang, Ming Sun, Chao Wang, Sumit Garg, Rong Chen, James Garnet Droppo, Chia-Jung Chang
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Patent number: 11790932Abstract: A system may include a first acoustic event detection (AED) component configured to detect a predetermined set of acoustic events, and include a second AED component configured to detect custom acoustic events that a user configures a device to detect. The first and second AED components are configured to perform task-specific processing, and may receive as input the same acoustic feature data corresponding to audio data that potentially represents occurrence of one or more events. Based on processing by the first and second AED components, a device may output data indicating that one or more acoustic events occurred, where the acoustic events may be a predetermined acoustic event and/or a custom acoustic event.Type: GrantFiled: December 10, 2021Date of Patent: October 17, 2023Assignee: Amazon Technologies, Inc.Inventors: Qingming Tang, Chieh-Chi Kao, Qin Zhang, Ming Sun, Chao Wang, Sumit Garg, Rong Chen, James Garnet Droppo, Chia-Jung Chang
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Publication number: 20230278467Abstract: An occupant sensing system is provided. The seat adjustment system includes at least one first sensor, at least one second sensor, and a computer system. The first sensor is configured to obtain at least one physiological signal of an occupant. The second sensor is configured to obtain at least one environmental signal that does not contain the at least one physiological signal of the occupant. The computer system is connected to the at least one first sensor and the at least one second sensor, the computer system receives the at least one physiological signal and the at least one environmental signal, and the computer system includes in a fatigue reminder computation an environmental auxiliary parameter generated by performing a feature extraction of the at least one physiological signal and the at least one environmental signal.Type: ApplicationFiled: March 31, 2023Publication date: September 7, 2023Inventors: Sheng-Chi KAO, Chia-Yu YU, Ching-Feng CHENG, Pin-Xian WU
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Publication number: 20230186939Abstract: A system may include a first acoustic event detection (AED) component configured to detect a predetermined set of acoustic events, and include a second AED component configured to detect custom acoustic events that a user configures a device to detect. The first and second AED components are configured to perform task-specific processing, and may receive as input the same acoustic feature data corresponding to audio data that potentially represents occurrence of one or more events. Based on processing by the first and second AED components, a device may output data indicating that one or more acoustic events occurred, where the acoustic events may be a predetermined acoustic event and/or a custom acoustic event.Type: ApplicationFiled: December 10, 2021Publication date: June 15, 2023Inventors: Qingming Tang, Chieh-Chi Kao, Qin Zhang, Ming Sun, Chao Wang, Sumit Garg, Rong Chen, James Garnet Droppo, Chia-Jung Chang
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Patent number: 11648853Abstract: A seat adjustment system for a vehicle seat is provided. The seat adjustment system includes a seat body; at least one actuating unit, configured to adjust a support of the seat body; a sensing unit, configured to obtain and provide seat information and body shape data of a back of an occupant; and a control unit, configured to control the at least one actuating unit; wherein when one parameter of the seat body changes, the control unit makes a portion of the body shape data of the occupant in a pre-defined range via the at least one actuating unit.Type: GrantFiled: August 31, 2020Date of Patent: May 16, 2023Assignee: BIOLOGUE CO., LTD.Inventors: Chih-Ming Fu, Ching-Feng Cheng, Chia-Yu Yu, Yen-Ku Chen, Shu-An Lee, Sheng-Chi Kao
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Patent number: 11564908Abstract: Provided is a long-acting method for preventing or treating glucose metabolism disorders that includes administering a beta-lactam compound or a pharmaceutically acceptable salt thereof to a subject in need thereof. The method for preventing or treating glucose metabolism disorders has a long-acting effect that lasts more than two days even after medication has been stopped.Type: GrantFiled: January 21, 2020Date of Patent: January 31, 2023Assignee: GLYCOLYSIS BIOMED CO., LTD.Inventors: Feng-Ling Lee, Lung-Jr Lin, Jyh-Shing Hsu, Cheng-Hsien Hsu, Yen-Chun Huang, Ya-Chien Huang, Chun-Tsung Lo, Hui-Fang Liao, Yu-Wen Liu, Yu-Chi Kao
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Patent number: 11419852Abstract: Provided is a long-acting method for preventing or treating glucose metabolism disorders that includes administering a beta-lactam compound or a pharmaceutically acceptable salt thereof to a subject in need thereof. The method for preventing or treating glucose metabolism disorders has a long-acting effect that lasts more than two days even after medication has been stopped.Type: GrantFiled: January 21, 2020Date of Patent: August 23, 2022Assignee: GLYCOLYSIS BIOMED CO., LTD.Inventors: Feng-Ling Lee, Lung-Jr Lin, Jyh-Shing Hsu, Cheng-Hsien Hsu, Yen-Chun Huang, Ya-Chien Huang, Chun-Tsung Lo, Hui-Fang Liao, Yu-Wen Liu, Yu-Chi Kao
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Patent number: 11302329Abstract: A system may include an acoustic event detection component for detecting acoustic events, which may be non-speech sounds. Upon detection of a command to detect a new sound, a device may prompt a user to cause occurrence of the sound one or more times. The acoustic event detection component may then be reconfigured, using audio data corresponding to the occurrences, to detect future occurrences of the event.Type: GrantFiled: June 29, 2020Date of Patent: April 12, 2022Assignee: Amazon Technologies, Inc.Inventors: Ming Sun, Spyridon Matsoukas, Venkata Naga Krishna Chaitanya Puvvada, Chao Wang, Chieh-Chi Kao
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Publication number: 20210380021Abstract: A seat adjustment system for a vehicle seat is provided. The seat adjustment system includes a seat body; at least one actuating unit, configured to adjust a support of the seat body; a sensing unit, configured to obtain and provide seat information and body shape data of a back of an occupant; and a control unit, configured to control the at least one actuating unit; wherein when one parameter of the seat body changes, the control unit makes a portion of the body shape data of the occupant in a pre-defined range via the at least one actuating unit.Type: ApplicationFiled: August 31, 2020Publication date: December 9, 2021Inventors: Chih-Ming Fu, Ching-Feng Cheng, Chia-Yu Yu, Yen-Ku Chen, Shu-An Lee, Sheng-Chi Kao