Patents by Inventor Chi-Bok Lee

Chi-Bok Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240304469
    Abstract: The present invention presents a single wafer-type wafer cleaning device and a single wafer-type method for controlling the surface roughness of a wafer, in which, in a wafer cleaning process, mutually different cleaning processes are carried out on the respective two sides of a wafer, and also, mutually different chemicals are used depending on the side of the wafer being cleaned, thereby enabling the respective roughness of the two sides to differ. The single wafer-type wafer cleaning device comprises a spin chamber, a first chemical supply device, a second chemical supply device and a third chemical supply device.
    Type: Application
    Filed: February 16, 2021
    Publication date: September 12, 2024
    Inventors: Gun Ho LEE, Chi Bok LEE, Dae Ki SEO, Byeong Ha KO
  • Publication number: 20240268198
    Abstract: A display apparatus according to the disclosure comprises a substrate including first region and eh second region, a display device for display an image in the first region, and a lens above the display device in the first region, wherein a center of the display device and a center of the lens are spaced apart from each other by a predetermined distance.
    Type: Application
    Filed: July 19, 2023
    Publication date: August 8, 2024
    Inventors: Yong-Ku LEE, Sung-Woo KIM, Young-Bok LEE, Chi-yong KIM, A-Ra YOON, Se-Wan OH
  • Publication number: 20240260407
    Abstract: A light emitting display device includes a substrate in which a display region and a non-display area are defined; a light emitting diode which is on the substrate and is provided in a pixel region within the display region; a protective film which is on the light emitting diode, and includes an edge portion an outer side surface of which is located in the non-display region and has an inclined step structure including a plurality of steps; a lens which is on the protective film and corresponds to the pixel region; a planarization film covering the lens; a first adhesive layer which is on the planarization film and located in the display region and the non-display region; and a cover window on the first adhesive layer.
    Type: Application
    Filed: December 7, 2023
    Publication date: August 1, 2024
    Applicant: LG Display Co., Ltd
    Inventors: Se-Wan OH, A-Ra YOON, Young-Bok LEE, Sung-Woo KIM, Yong-Ku LEE, Chi-Yong KIM
  • Publication number: 20240244937
    Abstract: A display apparatus includes a substrate with a plurality of pixel areas. The display apparatus includes a light-emitting device formed in a pixel area for emitting light. An encapsulation unit is formed on the light-emitting device. The display apparatus includes a black matrix on the encapsulation unit, where an opening in the black matrix overlaps with the light-emitting device in a first direction. An upper surface of the control insulating layer is formed with a groove that is a recessed portion toward the substrate. An optical lens is disposed above the groove in the control insulating layer.
    Type: Application
    Filed: September 5, 2023
    Publication date: July 18, 2024
    Inventors: You Yong Jin, Young Bok Lee, Sung Woo Kim, Keong Jin Lee, Yong Ku Lee, Chi Yong Kim, Won Sik Lee, Se Wan Oh, Seok Ho Ki
  • Patent number: 11569106
    Abstract: The present invention provides an apparatus for packing wafer cassettes, the apparatus including: a loading part to which a wafer cassette is loaded; an accessory inspecting part configured to check a recipe attached to the wafer cassette and inspect accessories of the wafer cassette; a first label attaching part configured to attach a first label to the wafer cassette on which the accessory inspection has been completed; a primary film packing part configured to receive a primary film according to the recipe and pack the wafer cassette using the primary film; a secondary film packing part configured to receive a secondary film according to the recipe and secondarily pack the wafer cassette using the secondary film; a second label attaching part configured to attach a second label to the secondary film with which the wafer cassette has been packed; and an unloading part configured to discharge the wafer cassette which has been completely packaged.
    Type: Grant
    Filed: August 22, 2019
    Date of Patent: January 31, 2023
    Assignee: SK Siltron Co., Ltd.
    Inventors: Tae Ju Yun, Chi Bok Lee
  • Publication number: 20200219741
    Abstract: The present invention provides an apparatus for packing wafer cassettes, the apparatus including: a loading part to which a wafer cassette is loaded; an accessory inspecting part configured to check a recipe attached to the wafer cassette and inspect accessories of the wafer cassette; a first label attaching part configured to attach a first label to the wafer cassette on which the accessory inspection has been completed; a primary film packing part configured to receive a primary film according to the recipe and pack the wafer cassette using the primary film; a secondary film packing part configured to receive a secondary film according to the recipe and secondarily pack the wafer cassette using the secondary film; a second label attaching part configured to attach a second label to the secondary film with which the wafer cassette has been packed; and an unloading part configured to discharge the wafer cassette which has been completely packaged.
    Type: Application
    Filed: August 22, 2019
    Publication date: July 9, 2020
    Inventors: Tae Ju YUN, Chi Bok LEE
  • Patent number: 8414360
    Abstract: A double side polishing apparatus comprises an upper polishing plate and a lower polishing plate for polishing both sides of a wafer; a plurality of carriers, each including a center plate and a circumferential plate, the center plate having a mounting hole where the wafer is mounted, the circumferential plate having a fitting hole where the center plate is fitted and a gear part formed along the outer periphery thereof, the center of the mounting hole being eccentric from the center of the center plate, the center of the fitting hole being eccentric from the center of the circumferential plate; and a sun gear and an internal gear engaged with the gear part to transmit a rotational force to the plurality of carriers, wherein a fitting direction of a center plate into a fitting hole is adjustable for at least two carriers among the plurality of carriers.
    Type: Grant
    Filed: February 4, 2010
    Date of Patent: April 9, 2013
    Assignee: Siltron, Inc.
    Inventors: Chi-Bok Lee, Heui-Don Cho
  • Publication number: 20110045748
    Abstract: A double side polishing apparatus comprises an upper polishing plate and a lower polishing plate for polishing both sides of a wafer; a plurality of carriers, each including a center plate and a circumferential plate, the center plate having a mounting hole where the wafer is mounted, the circumferential plate having a fitting hole where the center plate is fitted and a gear part formed along the outer periphery thereof, the center of the mounting hole being eccentric from the center of the center plate, the center of the fitting hole being eccentric from the center of the circumferential plate; and a sun gear and an internal gear engaged with the gear part to transmit a rotational force to the plurality of carriers, wherein a fitting direction of a center plate into a fitting hole is adjustable for at least two carriers among the plurality of carriers.
    Type: Application
    Filed: February 4, 2010
    Publication date: February 24, 2011
    Applicant: SILTRON INC.
    Inventors: Chi-Bok Lee, Heui-Don Cho