Patents by Inventor Chi Chan

Chi Chan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11996058
    Abstract: A display device is provided and includes a display panel, a light source, a light source controller, and a timing controller. The light source is adjacent to the display panel. The light source controller is electrically connected to the light source. The timing controller is electrically connected to the light source controller and the display panel. The timing controller includes a decoding unit and first and second processing units. The first processing unit is electrically connected to the decoding unit and the display panel. The second processing unit is electrically connected to the decoding unit and the light source controller. The decoding unit provides a refresh signal to the first and second processing units so that the display panel refreshes displayed content in a first refresh sequence according to first refresh rates, and the light source refreshes brightness in a second refresh sequence according to second refresh rates.
    Type: Grant
    Filed: February 7, 2023
    Date of Patent: May 28, 2024
    Assignee: INNOLUX CORPORATION
    Inventors: Huang-Chi Chao, Wei-Cheng Tsai, Ming-Chi Weng, Yu-Hsin Feng, Cheng-Tso Hsiao, Ming-Feng Hsieh, Chien-Hung Chan
  • Publication number: 20240162833
    Abstract: A power supply unit supplies power to a load, and the power supply unit includes a power factor corrector, a DC conversion module, and an isolated conversion module. The power factor corrector is plugged into a first main circuit board and converts an AC power into a DC power. The DC conversion module is plugged into the first main circuit board and converts the DC power into a main power. The isolated conversion module includes a bus capacitor, the bus capacitor is coupled to the DC conversion module through a first power copper bar, and coupled to the power factor corrector through a second power copper bar. The first power copper bar and the second power copper bar are arranged on a side opposite to the first main circuit board, and are arranged in parallel with the first main circuit board.
    Type: Application
    Filed: November 13, 2023
    Publication date: May 16, 2024
    Inventors: Yi-Sheng CHANG, Cheng-Chan HSU, Chia-Wei CHU, Chun-Yu YANG, Deng-Cyun HUANG, Yi-Hsun CHIU, Chien-An LAI, Yu-Tai WANG, Chi-Shou HO, Zhi-Yuan WU, Ko-Wen LU
  • Patent number: 11982866
    Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a stopping assembly. The fixed assembly has a main axis. The movable assembly is configured to connect an optical element, and the movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The stopping assembly is configured to limit the movement of the movable assembly relative to the fixed assembly within a range of motion.
    Type: Grant
    Filed: December 15, 2022
    Date of Patent: May 14, 2024
    Assignee: TDK TAIWAN CORP.
    Inventors: Chao-Chang Hu, Liang-Ting Ho, Chen-Er Hsu, Yi-Liang Chan, Fu-Lai Tseng, Fu-Yuan Wu, Chen-Chi Kuo, Ying-Jen Wang, Wei-Han Hsia, Yi-Hsin Tseng, Wen-Chang Lin, Chun-Chia Liao, Shou-Jen Liu, Chao-Chun Chang, Yi-Chieh Lin, Shang-Yu Hsu, Yu-Huai Liao, Shih-Wei Hung, Sin-Hong Lin, Kun-Shih Lin, Yu-Cheng Lin, Wen-Yen Huang, Wei-Jhe Shen, Chih-Shiang Wu, Sin-Jhong Song, Che-Hsiang Chiu, Sheng-Chang Lin
  • Patent number: 11983479
    Abstract: A method of fabricating an integrated circuit includes placing a first set of conductive feature patterns on a first level, placing a second set of conductive feature patterns on a second level, placing a first set of via patterns between the second set of conductive feature patterns and the first set of conductive feature patterns, placing a third set of conductive feature patterns on a third level different from the first level and the second level, placing a second set of via patterns between the third set of conductive feature patterns and the second set of conductive feature patterns, and manufacturing the integrated circuit based on at least one of the above patterns of the integrated circuit.
    Type: Grant
    Filed: August 10, 2022
    Date of Patent: May 14, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Jung-Chan Yang, Ting-Wei Chiang, Jerry Chang-Jui Kao, Hui-Zhong Zhuang, Lee-Chung Lu, Li-Chun Tien, Meng-Hung Shen, Shang-Chih Hsieh, Chi-Yu Lu
  • Publication number: 20240153541
    Abstract: Some embodiments include an integrated assembly having first and second source/drain regions laterally offset from one another. Metal silicide is adjacent to lateral surfaces of the source/drain regions. Metal is adjacent to the metal silicide. Container-shaped first and second capacitor electrodes are coupled to the source/drain regions through the metal silicide and the metal. Capacitor dielectric material lines interior surfaces of the container-shaped first and second capacitor electrodes, A shared capacitor electrode extends vertically between the first and second capacitor electrodes, and extends into the lined first and second capacitor electrodes. Some embodiments include methods of forming integrated assemblies.
    Type: Application
    Filed: January 16, 2024
    Publication date: May 9, 2024
    Applicant: Micron Technology, Inc.
    Inventors: Che-Chi Lee, Terrence B. McDaniel, Kehao Zhang, Albert P. Chan, Clement Jacob, Luca Fumagalli, Vinay Nair
  • Patent number: 11967446
    Abstract: An inductor is disclosed, the inductor comprising: a T-shaped magnetic core, being made of a material comprising an annealed soft magnetic metal material and having a base and a pillar integrally formed with the base, wherein ?CĂ—Hsat?1800, where ?C is a permeability of the T-shaped magnetic core, and Hsat (Oe) is a strength of the magnetic field at 80% of ?C0, where ?C0 is the permeability of the T-shaped magnetic core when the strength of the magnetic field is 0.
    Type: Grant
    Filed: January 4, 2021
    Date of Patent: April 23, 2024
    Assignee: CYNTEC CO., LTD.
    Inventors: Chun-Tiao Liu, Lan-Chin Hsieh, Tsung-Chan Wu, Chi-Hsun Lee, Chih-Siang Chuang
  • Publication number: 20240113254
    Abstract: A semiconductor light emitting device includes a multi-quantum-well structure, a first capping layer, a second capping layer, and an electron barrier layer stacked in order. The multi-quantum-well structure includes a plurality of alternately-stacked potential barrier layers and potential well layers. The first capping layer is a semiconductor layer, and the second capping layer is a p-doped semiconductor layer. Each of the first and second capping layers has an aluminum mole fraction larger than that of each of the potential barrier layers, and the aluminum mole fraction of the first capping layer is larger than that of at least a portion of the electron barrier layer. A method for preparing the semiconductor light emitting device is also provided.
    Type: Application
    Filed: December 15, 2023
    Publication date: April 4, 2024
    Inventors: Yung-Ling LAN, Chan-Chan LING, Chi-Ming TSAI, Chia-Hung CHANG
  • Publication number: 20240114150
    Abstract: A display processing device includes a display device interface and a processing unit. The processing is configured to transition at least a first component of the display processing system into a low-power state in response to an active region of a first video frame of a plurality of video frames having completed. A second component of the display processing device is configured to maintain a temporal count value corresponding to a current frame line of the plurality of video frames, and further to generate a first signal in response to the temporal count value corresponding to a first trigger value. The first signal causes the at least first component to transition out of the low-power state.
    Type: Application
    Filed: September 29, 2022
    Publication date: April 4, 2024
    Inventors: Wing-Chi Chow, Yee Shun Chan, Nicholas James Chorney, Minghua Zhu
  • Publication number: 20240098898
    Abstract: One aspect provides a printed circuit board (PCB). The PCB can include a plurality of layers and a plurality of plated through-hole (PTH) vias extending through the plurality of layers. The plurality of layers can include at least a top layer for mounting components, a second surface layer, and a first power layer positioned between the top layer and the second surface layer. The plurality of PTH vias can include at least one power via coupled to the first power layer to provide power to components mounted on the top layer. A stub length of the power via can be less than a distance between the power layer and the second surface layer.
    Type: Application
    Filed: September 21, 2022
    Publication date: March 21, 2024
    Inventors: Melvin Kent Benedict, Chi Kim Sides, Paul Danna, Michael Chan
  • Patent number: 11937373
    Abstract: One aspect of the instant application provides techniques to reduce the amount of crosstalk on single-ended signals in the pin field region of an integrated circuit device on a printed circuit board (PCB). The PCB can include a plurality of layers and an array of vias comprising a plurality of rows configured to route signals across layers. An inner layer of the PCB can include first and second signal traces positioned between first and second adjacent rows of the vias, the first signal trace positioned adjacent to the first row and the second signal trace positioned adjacent to the second row. The first signal trace can include at least one curved segment that curves around a substantial portion of a corresponding via in the first row such that separation between the first and second signal traces varies along the curved segment.
    Type: Grant
    Filed: March 8, 2022
    Date of Patent: March 19, 2024
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Melvin K. Benedict, Paul Danna, Chi Kim Sides, Wayne Vuong, Michael Chan
  • Publication number: 20240082835
    Abstract: The present disclosure relates to a urine reagent containing devices and a method associated, the device including a carrier assembly including at least a moisture-proof layer, the carrier assembly being arranged to define at least one open chamber configured to receive a urine reagent, a lid assembly including at least a moisture-proof layer, the lid assembly being arranged to cover the open chamber, the open chamber of the carrier assembly and the lid assembly defining a closed chamber, a reagent in the closed chamber, wherein at least one of the lid assembly or the carrier assembly is transparent, and the closed chamber is moisture-proof.
    Type: Application
    Filed: September 14, 2023
    Publication date: March 14, 2024
    Inventors: Tung Chi CHAN, Jonas LOY, Pierre-Arnaud DONNET, Christelle BARAKAT
  • Publication number: 20240087215
    Abstract: A system for generating an advanced surround view for a vehicle includes a plurality of cameras to generate image data. Sensors are configured to determine kinematic data of the vehicle. Kinematic data are also obtained by a visual odometry module and/or a deep-vision mechanism. A processor is configured to process image data captured by the plurality of cameras to generate a 360-degree surround view layer representative of a surrounding area. The processor is further configured to construct an improved bicycle kinematic model for processing kinematic data to generate an under-chassis layer representative of an area under the vehicle. The processor is further configured to generate a 3D vehicle model layer and overlay objects layer. Display screens display a GUI of combined scene of the 360-degree surround view layer, under-chassis layer, 3D vehicle model layer and overlay objects layer as would be viewed from a virtual camera viewpoint.
    Type: Application
    Filed: October 26, 2023
    Publication date: March 14, 2024
    Inventors: Dai Thanh PHAN, Phuc Thien NGUYEN, Chi Thanh NGUYEN, Duc Chan VU, Truong Trung Tin NGUYEN, Dang Quang NGUYEN, Hai Hung BUI
  • Patent number: 11924995
    Abstract: A water cooling head with sparse and dense fins, including a main body, a first fin set and a second fin set. Wherein a chamber is formed inside the main body, the main body has a first plate and a second plate, the main body forms an inlet channel and an outlet channel, so that the cooling water passes through the chamber. The first fin set and the second fin set are arranged in the chamber, and the first fin set and the second fin set are connected to the first plate respectively. The first fin set comprises several first fins spaced apart, the first fins divide the chamber to form several first channels. The second fin set comprises several second fins spaced apart, the second fins divide the chamber to form several second channels. The water cooling head can increase the overall heat sinking efficiency.
    Type: Grant
    Filed: April 23, 2021
    Date of Patent: March 5, 2024
    Inventors: Chi-Chuan Wang, Cheng-Chen Cheng, Chuan-Chan Huang, Jen-Chieh Huang
  • Patent number: 11915777
    Abstract: Some embodiments include an integrated assembly having first and second source/drain regions laterally offset from one another. Metal silicide is adjacent to lateral surfaces of the source/drain regions. Metal is adjacent to the metal silicide. Container-shaped first and second capacitor electrodes are coupled to the source/drain regions through the metal silicide and the metal. Capacitor dielectric material lines interior surfaces of the container-shaped first and second capacitor electrodes, A shared capacitor electrode extends vertically between the first and second capacitor electrodes, and extends into the lined first and second capacitor electrodes. Some embodiments include methods of forming integrated assemblies.
    Type: Grant
    Filed: February 10, 2022
    Date of Patent: February 27, 2024
    Assignee: Micron Technology, Inc.
    Inventors: Che-Chi Lee, Terrence B. McDaniel, Kehao Zhang, Albert P. Chan, Clement Jacob, Luca Fumagalli, Vinay Nair
  • Publication number: 20240009790
    Abstract: A method includes steps of: performing preparation-phase measurements on a spindle of a machine tool to generate normal-condition signals; establishing a reference model based on the normal-condition signals; generating abnormal-condition signals based on the reference model and a preset damage value; utilizing principal components analysis (PCA) to characterize the normal-condition and abnormal-condition signals to obtain normal and abnormal probabilistic models, determining normal-condition and abnormal-condition reference curves based on the normal and abnormal probabilistic models; determining an alert-triggering line based on the abnormal-condition reference curve; determining a permissible range between the alert-triggering line and the normal-condition reference curve; and generating a warning signal when it is determined that a detection value falls outside of the permissible range, wherein the detection value is obtained based on application-phase measurements performed on the spindle.
    Type: Application
    Filed: December 16, 2022
    Publication date: January 11, 2024
    Inventors: TZU-CHI CHAN, JYUN-DE LI, YI-FAN SU, XIAN-YOU SHAO, YI-HAO CHEN, SHINN-LIANG CHANG, I-HUNG WANG, SHAO-CHI WU
  • Patent number: 11870158
    Abstract: An ultra-wideband antenna for a wireless headphone is provided, which includes a first portion and a second portion. One side of the first portion has at least two slots. The second portion is laterally adjacent to and separated from the first portion. The second portion includes a main body portion and an extension portion, and one side of the main body portion is close to the at least two slots, and another side of the main body portion is connected to the extension portion, in which an included angle between the main body portion and the extension portion is in a range of between 85 degrees and 135 degrees. A wireless headphone including the above-mentioned ultra-wideband antenna is also provided.
    Type: Grant
    Filed: June 28, 2022
    Date of Patent: January 9, 2024
    Assignee: PRIMAX ELECTRONICS LTD.
    Inventors: Yung-Tai Pan, Chun-Kai Wang, Yih-Shiuan Shin, Chi-Chan Lee, Yen-Tsung Fu
  • Publication number: 20240008171
    Abstract: A semiconductor package includes a chip, a circuit board and a filling material. The circuit board includes a substrate, a patterned metal layer and a protective layer. A circuit area, a chip-mounting area and a flow-guiding area are defined on a surface of the substrate. The chip is mounted on the chip-mounting area. A flow-guiding member of the patterned metal layer is arranged on the flow-guiding area and includes a hollow portion and flow-guiding grooves which are communicated with the hollow portion and arranged radially. The flow-guiding grooves are provided to allow the protective layer to flow toward the hollow portion, and the hollow portion and the flow-guiding grooves are provided to allow the filling material to flow toward the protective layer such that the filling material can cover the protective layer to improve structural strength of the semiconductor package.
    Type: Application
    Filed: May 4, 2023
    Publication date: January 4, 2024
    Inventors: Wei-Teng Lin, Hui-Yu Huang, Ching-Chi Chan, Shih-Chieh Chang
  • Publication number: 20230418256
    Abstract: A measuring unit is used to measure a specific dimension of a product feature within a time segment to generate a measured dimension value. A processing unit compares the measured dimension value with a standard dimension value to generate an offset value. A control unit generates a control instruction based on the offset value, and transmits the control instruction to a machine on which machining member that is used to form the product feature is installed, so that the machine performs tool compensation on the machining member according to the control instruction.
    Type: Application
    Filed: December 2, 2022
    Publication date: December 28, 2023
    Inventors: TZU-CHI CHAN, CHIA-CHUAN CHANG, HAN-HUEI LIN, YI-HAO CHEN
  • Patent number: 11813531
    Abstract: Embodiments relate to adapting assets for a video game based on social media interaction. Instructions are sent to a computing device associated with a social media platform to create a social media post comprising at least one piece of multimedia content relating to a video game, the at least one piece of multimedia content produced by a player of the video game. Data is received from the computing device indicative of one or more indications of user interaction with the social media post. A score is determined for the player based at least in part on the received data indicative of the one or more indications of user interaction relating to the social media post. One or more assets of the video game are adapted for the player based at least in part on the determined score for the player.
    Type: Grant
    Filed: July 6, 2022
    Date of Patent: November 14, 2023
    Assignee: Harmonix Music Systems, Inc.
    Inventors: Brian Seong-chi Chan, Daniel Aaron Sproul, Michael Verrette, Ryan William Challinor
  • Patent number: D1019023
    Type: Grant
    Filed: March 30, 2020
    Date of Patent: March 19, 2024
    Assignee: Amazon Technologies, Inc.
    Inventors: Michael Edward James Paterson, Chia-Wei Chan, Mei Hsuan Chen, Benjamin Wild, Matthew J. England, Wen-Yo Lu, James Siminoff, Mark Siminoff, Yen-Chi Tsai